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Ceramic integrated packaging shell and manufacturing process thereof

A technology for encapsulating shells and ceramics, which is used in electric solid-state devices, semiconductor devices, semiconductor/solid-state device components, etc., can solve the problems of welding cracking, sealing failure, poor sealing reliability, etc., to avoid damage and improve sealing reliability. , The effect of improving the production qualification rate

Pending Publication Date: 2020-07-24
NO 43 INST OF CHINA ELECTRONICS TECH GRP CETC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] In view of this, it is necessary for the present invention to provide a ceramic integrated packaging shell and its manufacturing process. The ceramic integrated packaging shell in the present invention is provided with a stress release layer in the film system, and the stress release layer is fully utilized. When the welding stress is transferred When reaching the stress release layer, because the material therein is soft and easily plastically deformed, the welding stress can be effectively released, thereby avoiding damage to the adhesion and bonding of the ceramic and the underlying thin film Ti layer, and solving the problem of the integrated packaging shell in the prior art Existing technical problems of welding to crack, risk of sealing failure and poor sealing reliability

Method used

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  • Ceramic integrated packaging shell and manufacturing process thereof
  • Ceramic integrated packaging shell and manufacturing process thereof
  • Ceramic integrated packaging shell and manufacturing process thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0057] S1. In this embodiment, the alumina green porcelain is prepared by pressing and casting, and then the alumina green porcelain is sintered or printed with patterns to prepare a thick-film ceramic substrate with built-in passive components, and the thickness of the thick-film ceramic substrate The surface is ground and polished;

[0058] S2. After cleaning the thick-film ceramic substrate in S1, use the magnetron sputtering method to make a metal thin-film wiring layer on the surface of the thick-film ceramic substrate, and sputter Ti / Pt / Au / Ti / Pt / Au thin films sequentially from the inside to the outside The wiring layer, wherein the Ti layer in the Ti / Pt / Au / Ti / Pt / Au thin film wiring layer is 0.3 μm thick, the Pt layer is 1 μm thick, and the Au layer is 0.75 μm thick. Prepare the required metallization pattern on the wiring layer;

[0059] S3. Nickel gold is plated on the surface of the metal enclosure, wherein the material of the metal enclosure is 4J42 constant expansio...

Embodiment 2

[0067] S1. In this embodiment, aluminum nitride green porcelain is prepared by pressing and casting, and then the aluminum nitride green porcelain is sintered or printed to prepare a thick-film ceramic substrate with built-in passive components, and the thick-film ceramic The surface of the substrate is ground and polished;

[0068] S2. After cleaning the thick-film ceramic substrate in S1, use the magnetron sputtering method to make a metal thin-film wiring layer on the surface of the thick-film ceramic substrate, and sputter Ti / Ni / Au / Ti / Ni / Au thin films sequentially from inside to outside The wiring layer, in which the thickness of the Ti layer in the Ti / Ni / Au / Ti / Ni / Au thin film wiring layer is 0.3 μm, the thickness of the Ni layer is 2 μm, and the thickness of the Au layer is 2 μm, and then the metal thin film is wired by photolithography Prepare the required metallization pattern on the layer;

[0069]S3. Nickel gold is plated on the surface of the metal enclosure, wherei...

Embodiment 3

[0077] S1. In this embodiment, the LTCC green ceramics are prepared by pressing and casting, and then the LTCC green ceramics are sintered or printed with patterns to prepare a thick-film ceramic substrate with built-in passive components, and the surface of the thick-film ceramic substrate is treated. Grinding and polishing treatment;

[0078] S2. After cleaning the thick-film ceramic substrate in S1, use the magnetron sputtering method to make a metal thin-film wiring layer on the surface of the thick-film ceramic substrate, and sputter Ti / Pt / Au / Ti / Pt / Au thin films sequentially from the inside to the outside The wiring layer, in which the thickness of the Ti layer in the Ti / Pt / Au / Ti / Pt / Au thin film wiring layer is 0.6 μm, the thickness of the Pt layer is 3 μm, and the thickness of the Au layer is 3 μm, and then use photolithography to wire the metal thin film Prepare the required metallization pattern on the layer;

[0079] S3. Nickel gold is plated on the surface of the me...

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Abstract

The invention discloses a ceramic integrated packaging shell and a manufacturing process thereof. The ceramic integrated packaging shell is composed of a thick-film ceramic substrate and a metal filmwiring layer arranged on a surface of the thick-film ceramic substrate. The metal film wiring layer sequentially comprises a Ti / M / N / Ti / K / Au six-layer film systems from inside to outside, a M layer anda K layer are independently selected from Pt or Ni, an N layer is a stress release layer, and the stress release layer is Au or Cu. The ceramic integrated packaging shell is high in sealing reliability and good in air tightness, a production process window of a thick film mixed multi-layer ceramic integrated packaging shell is widened, and a production percent of pass is increased.

Description

technical field [0001] The invention belongs to the field of electronic package shells, and in particular relates to a ceramic integrated package shell and a manufacturing process thereof. Background technique [0002] The electronic packaging shell refers to the shell used to install the semiconductor integrated circuit chip. On the one hand, it plays the role of placing, fixing, sealing, protecting the chip and enhancing the thermal conductivity. On the other hand, it is also a bridge between the internal world of the chip and the external circuit. Specifically, the contacts on the chip are connected to the pins of the package shell with wires, and these pins are connected to other devices through wires on the printed circuit board. Therefore, for many integrated circuit products, the packaging technology of electronic packaging shells is a very critical link. [0003] In order to match the development trend of miniaturization, integration, and high frequency of radio fre...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/06H01L23/08H01L23/02H01L23/043
CPCH01L23/06H01L23/08H01L23/02H01L23/043
Inventor 钟永辉卢彩红高磊黄平崔嵩
Owner NO 43 INST OF CHINA ELECTRONICS TECH GRP CETC