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Method for cleaning and recovering precious metal liner plate in semiconductor chip manufacturing

A semiconductor and precious metal technology, applied in the field of precious metal recycling, can solve the problems of low utilization rate of new precious metal materials, waste, and failure to realize the recycling and reuse of lining substrates, etc., to achieve convenient transportation and management, fast response, and use. Safety and environmental protection effect

Inactive Publication Date: 2020-07-28
紫金矿业集团黄金冶炼有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] In semiconductor manufacturing, there are high-quality requirements for target materials and evaporation materials, so that the utilization rate of new precious metal materials is low, usually less than 30%; a large number of residual materials and residues need to be recycled, and a large number of contact liners and waste products need to be cleaned Reuse
In the prior art, the liner cleaning machine is mainly used for cleaning and stripping precious metals of semiconductor chips and substrates, but it only removes the gold and other precious metals on the surface of the liner to realize the recovery of gold, and does not realize the recovery of the base material of the liner Reuse, causing a lot of waste

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0020] The base material of the precious metal liner in the semiconductor chip manufacturing of the present embodiment is germanium, and the composition of its coating from the surface to the inside is gold, tin, nickel, zinc sulfide layer, the cleaning recovery method of the precious metal liner in the semiconductor chip manufacturing of the present invention The operation steps are as follows:

[0021] 1. Purification treatment of treatment chemicals: first, purify the environment-friendly gold leaching agent Jinchan solution, prepare it with pure water and filter the solution to remove impurities. The water quality of pure water requires resistivity ≥ 15MΩ.CM; Filter device before use of sexual agents;

[0022] 2. Dissolution of surface coating gold: use an acid and alkali resistant constant temperature oscillating shaker, place the liner in it; control the concentration of the purified golden cicada to 100g / L, the pH of the pH to 11, and the temperature to be controlled at...

Embodiment 2

[0026] The base material of the noble metal liner in the semiconductor chip manufacturing of the present embodiment is germanium, and the composition of its coating from the surface to the inside is gold, nickel, cadmium, zinc sulfide layer, the cleaning recovery method of the noble metal liner in the semiconductor chip manufacturing of the present invention The operation steps are as follows:

[0027] 1. Purification treatment of treatment chemicals: first, purify the environment-friendly gold leaching agent Jinchan solution, prepare it with pure water and filter the solution to remove impurities. The water quality of pure water requires resistivity ≥ 15MΩ.CM; Filter device before use of sexual agents;

[0028] 2. Dissolution of surface coating gold: use an acid and alkali resistant constant temperature oscillating shaker, place the liner in it; control the concentration of the purified golden cicada to 100g / L, the pH of the pH to 12, and the temperature to be controlled at 8...

Embodiment 3

[0032] The base material of the noble metal liner in the semiconductor chip manufacturing of the present embodiment is germanium, and the composition of its coating from the surface to the inside is gold, nickel, cadmium, zinc sulfide layer, the cleaning recovery method of the noble metal liner in the semiconductor chip manufacturing of the present invention The operation steps are as follows:

[0033] 1. Purification treatment of treatment chemicals: first, purify the environment-friendly gold leaching agent Jinchan solution, prepare it with pure water and filter the solution to remove impurities. The water quality of pure water requires resistivity ≥ 15MΩ.CM; Filter device before use of sexual agents;

[0034] 2. Dissolution of surface coating gold: use an acid and alkali resistant constant temperature oscillating shaker, place the liner in it; control the concentration of the purified golden cicada to 150g / L, the pH to 13, and the temperature to be controlled at 85°C; shake...

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PUM

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Abstract

The invention discloses a method for cleaning and recovering a precious metal liner plate in semiconductor chip manufacturing. The method comprises the following steps of: firstly performing purification treatment on an environment-friendly gold leaching agent golden cicada solution and an alkaline agent, and then fully dissolving out surface plating gold; dissolving out other plating metals to complete plating stripping; and finally, extracting and recovering gold, performing ultrasonically non-destructive cleaning treatment on a liner plate substrate, performing vacuum drying on the liner plate substrate, and performing vacuum packaging and storage after the surface appearance quality passes inspection. The method has the characteristics of no damage to the liner plate substrate while realizing the recovery of precious metals, simple and efficient operation, safe and environmentally-friendly operation.

Description

technical field [0001] The invention relates to the recycling technology of precious metals in the semiconductor industry, in particular to a method for cleaning and recycling precious metal liners in the manufacture of semiconductor chips. Background technique [0002] In semiconductor manufacturing, there are high-quality requirements for target materials and evaporation materials, so that the utilization rate of new precious metal materials is low, usually less than 30%; a large number of residual materials and residues need to be recycled, and a large number of contact liners and waste products need to be cleaned Reuse. In the prior art, the liner cleaning machine is mainly used for cleaning and stripping precious metals of semiconductor chips and substrates, but it only removes the gold and other precious metals on the surface of the liner to realize the recovery of gold, and does not realize the recovery of the base material of the liner Reuse causes a lot of waste. ...

Claims

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Application Information

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IPC IPC(8): C22B7/00C22B11/00C22B1/00C22B23/00C22B25/06C22B19/20C22B19/30C22B17/00C01G9/08B08B3/12
CPCB08B3/12C01G9/08C22B1/005C22B7/008C22B11/046C22B17/04C22B19/22C22B19/30C22B23/0423C22B23/043C22B25/04C22B25/06Y02P10/20
Inventor 周方应宗波吴卫煌钟美娟钟茂礼罗鹏荷
Owner 紫金矿业集团黄金冶炼有限公司
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