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A kind of heat dissipation coating of waterborne carbon nanotube/epoxy resin dispersion system and its preparation method and application

A technology of water-based carbon nanotubes and water-based epoxy resin, applied in epoxy resin coatings, coatings, etc., can solve problems such as poor heat dissipation, improve mechanical properties and heat conduction and heat dissipation efficiency, improve bonding performance, and improve thermal conductivity. and the effect of heat transfer performance

Active Publication Date: 2022-01-25
湖南库泠斯特科技有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

The heat dissipation coating of the water-based carbon nanotube / epoxy resin dispersion system provided by the present invention has excellent heat dissipation performance, and can solve the problem of poor heat dissipation of conventional heat conduction coatings

Method used

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  • A kind of heat dissipation coating of waterborne carbon nanotube/epoxy resin dispersion system and its preparation method and application
  • A kind of heat dissipation coating of waterborne carbon nanotube/epoxy resin dispersion system and its preparation method and application
  • A kind of heat dissipation coating of waterborne carbon nanotube/epoxy resin dispersion system and its preparation method and application

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[0045] The present invention also provides a method for preparing a heat dissipation coating of the aqueous carbon nanotube / epoxy resin dispersion system, including the following steps:

[0046] The aqueous epoxy resin, hydrophilic carbon nanotubes, hydrophilic kaolin, water, defoamer, leveling agent, and two-component aqueous epoxy curing agent are mixed to obtain the water-based carbon nanotube / epoxy resin. The heat dissipation coating of the dispersion system.

[0047] In the present invention, the mixing manner is preferably magnetic stirring, the present invention is not particularly limited to the rotational speed and time of the magnetic force, and the raw material can be mixed uniform. In the present invention, the mixing order ensures that hydrophilic carbon nanotubes and hydrophilic kaolin and epoxy resins are sufficiently contacted, and the dispersibility of hydrophilic carbon nanotubes and hydrophilic kaolins in epoxy resins can be improved.

[0048] The present in...

Embodiment 1

[0060] 1G carbon nanotubes were weighed in the beaker, and then 2 g of sodium dodecyl sulfate, 0.5 g of tetrabutylammonium bromide, 3 g of polyvinyl alcohol and 45 ml of distilled water were magnetically stirred to obtain a hydrophilic carbon nanotube;

[0061] 1 g of calcined kaolin in the beaker, then weighted 2 g of sodium dodecyl sulfate, 0.5 g of tetrabutylammonium bromide, 3 g of polyvinyl alcohol, and 45 mL of distilled water, magnetic stirring, resulting in hydrophilic kaolin;

[0062] Weigh 15g aqueous epoxy resin, 8 g of hydrophilic carbon nanotubes, 12 g of hydrophilic kaolin and 3G water in the beaker, stir even, weigh 1 g of tributyl phosphate, 1 g of polyurethane flow flat agent, 3g two group Seed aqueous epoxy curing agent, stirred with a DW-2 increase-level constant speed stirrer for 2 h to dispersion uniform, to obtain a heat dissipation coating of aqueous carbon nanotube / epoxy resin dispersion system.

[0063]The surface of the 12cm × 5 cm galvanized steel shee...

Embodiment 2

[0080] The difference from the first embodiment is different from the amount of the feedstock.

[0081] 1G carbon nanotubes were weighed in the beaker, and then 2 g of sodium dodecyl sulfate, 0.5 g of tetrabutylammonium bromide, 3 g of polyvinyl alcohol and 45 ml of distilled water were magnetically stirred to obtain a hydrophilic carbon nanotube;

[0082] 1 g of calcined kaolin in the beaker, then weighted 2 g of sodium dodecyl sulfate, 0.5 g of tetrabutylammonium bromide, 3 g of polyvinyl alcohol, and 45 mL of distilled water, magnetic stirring, resulting in hydrophilic kaolin;

[0083] Weigh 15g aqueous epoxy resin, 10 g of hydrophilic carbon nanotubes, 12 g of hydrophilic kaolin and 3G water in the beaker, stir even, weigh 1 g of tributyl phosphate, 1 g of polyurethane floral, 3g two group Seed aqueous epoxy curing agent, stirred with a DW-2 increase-level constant speed stirrer for 2 h to dispersion uniform, to obtain a heat dissipation coating of aqueous carbon nanotube / ep...

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Abstract

The invention provides a water-based carbon nanotube / epoxy resin dispersion system heat-dissipating coating, a preparation method and application thereof, and relates to the technical field of water-based coatings. The heat dissipation coating of water-based carbon nanotube / epoxy resin dispersion system provided by the present invention comprises the following components in parts by mass: 10-20 parts of water-based epoxy resin, 5-15 parts of hydrophilic carbon nanotubes, 5-20 parts 1 part of hydrophilic kaolin, 0-10 parts of water, 1-5 parts of defoamer, 1-5 parts of leveling agent and 3-10 parts of two-component water-based epoxy resin curing agent. The water-based carbon nanotube / epoxy resin dispersion system heat dissipation coating provided by the present invention has good dispersion of hydrophilic carbon nanotubes, has excellent heat dissipation performance, and can solve the problems caused by poor dispersion of carbon nanotubes in conventional heat conduction coatings. The technical problem of poor heat dissipation, and the raw materials of the heat dissipation paint provided by the invention are environmentally friendly, and the produced heat dissipation paint has less VOC emissions.

Description

Technical field [0001] The present invention relates to an aqueous coating technology, and particularly relates to a heat dissipation coating and preparation method and application of an aqueous carbon nanotube / epoxy dispersions. Background technique [0002] With modern technology, the various electronic components gradually become smaller and more efficient, since the electronic components typically have a small size, a long period of operation, the characteristics of a closed environment, with increasing input power electronic component , cause the electronic component heat flux is very high, large thermal capacity. If the heat can not be dissipated in time, will lead to a local electronics or hot component, which will greatly shorten the life of the capacitor, reduce performance, resulting in waste of resources. Therefore, electronic components coated with a thermally conductive surface coating is to solve the heat problem of electronic components, to ensure their normal wo...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09D163/00C09D163/02C09D163/04C09D7/62
CPCC09D163/00C09D163/04C09D7/62C08L2205/02C08L2205/035C08K2201/003C08K2201/011C08L63/04C08L29/04C08L75/04C08K13/06C08K9/04C08K3/346C08K3/041C08K5/521
Inventor 谭正德李丰谢情丽吴钧涛赵剩勇
Owner 湖南库泠斯特科技有限公司
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