Silver paste with high conductivity at 80 DEG C and preparation method thereof

A technology of silver paste and silver powder, which is applied in the direction of conductive materials dispersed in non-conductive inorganic materials, cable/conductor manufacturing, circuits, etc. It can solve the problems of low temperature resistance, poor conductivity of silver paste, hardness, adhesion, and reliability testing It is difficult to meet the requirements and other issues, and achieve the effect of excellent conductivity

Active Publication Date: 2020-08-07
无锡晶睿光电新材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Under low-temperature curing conditions, the cross-linking reaction cannot be carried out or is difficult to fully carry out, which makes it difficult to meet the requirements of hardness, adhesion, and reliability tests; and almost all organic matter on the surface of silver powder does not participate in the reaction during low-temperature baking and drying. Volatilization, resulting in poor conductivity of silver paste under low temperature curing conditions
However, many existing mobile phone terminals or smart wearable devices are made of materials that are not resistant to high temperatures, so how to make the conductive paste achieve excellent conductivity and meet high reliability under ultra-low temperature curing conditions is a major problem in the field of conductive paste.

Method used

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  • Silver paste with high conductivity at 80 DEG C and preparation method thereof
  • Silver paste with high conductivity at 80 DEG C and preparation method thereof
  • Silver paste with high conductivity at 80 DEG C and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0039] The preparation method of silver paste in the following examples is:

[0040]According to mass percentage, take 3-10% polymer resin carrier (the preparation method of polymer resin carrier is: take by weight 40% resin binder, 60% solvent mix, and under 80 ℃ Dissolve completely; Filter and remove impurities on the 400 mesh screen then, obtain polymer resin carrier, the viscosity of described polymer resin carrier is 30000-45000dpas.), 1-5% additive and 15-20% solvent; The weighed raw materials were centrifugally dispersed at 1600rpm for 2-3 minutes to obtain a mixed carrier material; then nano-scale silver powder, large-size dendritic silver powder and micron-scale silver powder were weighed and mixed to obtain a powder, that is, a 70-80% conductive functional phase ; Put the mixed powder into the mixed carrier material in stages, and premix it by centrifuging at 1400rpm every time you put it in, until all the powders are put in to get the slurry; put the premixed slurry...

Embodiment 1

[0045] A, B, and C in Table 1 are the resistivity of the silver paste obtained by using micron-scale silver powder a, nano-scale silver powder and large-size dendritic silver powder with organic amine dispersants on the surface of different mass percentages as the conductive functional phase. and adhesion.

[0046] Control 1 in Table 1 is the resistivity and adhesion of the silver paste obtained by using only the micron-sized silver powder a with an organic amine dispersant on the surface as the conductive functional phase.

[0047] Table 1

[0048]

[0049]

[0050] Controls 2-5 in Table 2 are the resistivity and adhesion of the silver paste obtained by using only different types of commercially available micron-sized silver powder b-e without organic amine dispersant on the surface as the conductive functional phase. It can be seen that the resistivity after drying and curing at 80°C is significantly higher than that in Table 1, and the adhesion of 3M 610 adhesive tap...

Embodiment 2

[0055] D, E, and F in Table 3 are the resistivity of the silver paste obtained by using micron-scale silver powder a, nano-scale silver powder and large-size dendritic silver powder with organic amine dispersants on the surface of different mass percentages as the conductive functional phase. and adhesion.

[0056] Control 6 in Table 3 shows the resistivity and adhesion of the silver paste obtained by using only the micron-sized silver powder b-e with an organic amine dispersant on the surface as the conductive functional phase.

[0057] table 3

[0058]

[0059]

[0060] The comparisons 7-10 in Table 4 are the resistivity and adhesion of the silver paste obtained by using only different types of commercially available micron-sized silver powder without organic amine dispersant on the surface as the conductive functional phase. It can be seen that the resistivity after drying and curing at 80°C is significantly higher than that in Table 3, and the adhesion of 3M 610 adh...

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Abstract

The invention discloses silver paste with high conductivity at 80 DEG C and a preparation method thereof, and belongs to the technical field of conductive paste. The invention provides the silver paste with high conductivity under an ultralow-temperature curing condition, the silver paste can be cured under the low-temperature condition of 80 DEG C and has excellent conductivity, the resistivity of the silver paste is less than 2.5*10<-7> ohm.m, and the silver paste can be used for manufacturing a 5G mobile phone terminal antenna. The adhesive force on the surfaces of plastic, metal, printingink, glass, ceramic and other base materials is excellent, and the adhesive force reaches 5B after high-temperature boiling (100 DEG C, 30 min). Meanwhile, the reliability test requirements of a conventional portable terminal under the conditions of high temperature, high humidity, cold and hot impact, salt mist, ultraviolet irradiation and the like can be met. The paste of the silver paste can beused for manufacturing circuit patterns on a plane and a curved surface through pad printing or silk-screen printing construction.

Description

technical field [0001] The invention relates to a silver paste with high conductivity at 80°C and a preparation method thereof, belonging to the technical field of conductive paste. Background technique [0002] With the advent of the 5G era, the requirements for various devices and functions on the mobile phone continue to increase. More electronic components need to be integrated inside the mobile phone, and the demand and quantity of antennas are also increasing. The traditional use of LDS technology to make antennas The method can no longer meet the requirements of the current mobile terminal on the number of antennas and antenna design. Therefore, how to integrate a large number of antennas with high efficiency and low cost to meet the current requirements of 5G signal transmission is an urgent problem in the field of antenna structures. [0003] Conductive silver paste can print various ultra-thin circuit graphics on the inside and outside of the back cover of the mob...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01B1/22H01B13/00H01Q1/38H05K1/09
CPCH01B1/22H01B13/00H01Q1/38H05K1/092
Inventor 董飞龙李亮吴立泰
Owner 无锡晶睿光电新材料有限公司
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