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Low-density heat-conducting gel and preparation method thereof

A low-density, gel technology, applied in chemical instruments and methods, heat exchange materials, etc., can solve the problems of increasing the weight of parts, high density of thermally conductive powders, and increased material costs, and achieve improved thermal conductivity and thermal conductivity. Good, low cost effect

Active Publication Date: 2020-08-18
广州布鲁奥申新材料科技有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this type of thermally conductive powder has a high density, which increases the density of the thermally conductive gel under high filling conditions, thereby increasing the weight of the parts during application
[0005] In addition, some people prepare thermally conductive gels by adding low-density fillers and high thermally conductive fillers, such as silicon micropowder and alumina, silicon micropowder and aluminum nitride, alumina and boron nitride, etc., but this method as a whole Higher thermal conductivity can be obtained, but the density is still relatively high, and the material cost is also increased, and the practicability is not good

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preparation example Construction

[0072] On the other hand, the present invention also provides a method for preparing a low-density thermally conductive gel, comprising the following steps:

[0073] Step S1, weighing the materials of component A and component B for preparing the low-density thermally conductive gel according to the mass ratio;

[0074] Step S2, add the weighed materials of each component into the double planetary mixer, mix evenly and draw a vacuum, and vacuum defoam to obtain the A component mixture and the B component mixture; put the A component mixture into the double group In the tube A, put the B component mixture into the two component tube B; the vacuum defoaming is to remove the gas brought in during the stirring, otherwise the air inside will not be discharged during curing, resulting in pores in the colloid, affecting performance;

[0075] Step S3, mixing the prepared A-component mixture and B-component mixture, and curing at room temperature for 22-25 hours.

[0076] Specificall...

Embodiment 1

[0083] This embodiment provides a kind of surface silver-plated hollow microspheres (hereinafter referred to as silver-plated hollow microspheres), and the silver-plated hollow microspheres are prepared by the following preparation method:

[0084] S1, pretreatment of hollow microbeads;

[0085] Specifically, the pretreatment of hollow microbeads in S1 includes the following steps:

[0086] S101, coarsening: add 2g / L sodium fluoride solution to 15mL / L hydrofluoric acid to form a roughening solution, stir evenly; add 10g hollow microbeads to 300mL roughening solution, and sonicate in an ultrasonic generator for 20min at room temperature , stand still; after the powder settles, remove the roughening liquid, and wash the powder with water for 3 times;

[0087] S102. Sensitization: Pour the sensitizing solution into the washed powder at room temperature, ultrasonicate in an ultrasonic generator for 20-30 minutes, and let stand; after the powder settles, remove the sensitizing sol...

Embodiment 2

[0091] This embodiment provides a low-density thermally conductive gel, and the low-density thermally conductive gel is prepared by the following method:

[0092] A component:

[0093] 1) Weigh 40g of vinyl-terminated silicone oil with a viscosity of 500mPa·s, 60g of vinyl-terminated silicone oil with a viscosity of 3000mPa·s, 6.5g of dimethyl silicone oil with a viscosity of 100mPa·s, and 300g of silver-coated hollow microspheres with a particle size of 20μm , 600 g of spherical alumina with a particle size of 25 μm, and 0.2 g of chloroplatinic acid-isopropanol complex with a platinum content of 500 ppm;

[0094] 2) Put the above-mentioned weighed materials into the planetary mixer (add silicone oil first, then add filler); adjust the revolution speed to 50rpm, the dispersion speed to 500rpm, mix for 60min, and then vacuum defoam for 60min;

[0095] 3) Put the above mixed materials into the two-component tube A tube.

[0096] B component:

[0097] 1) Weigh 40g of vinyl-ter...

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Abstract

The invention discloses low-density heat-conducting gel and a preparation method thereof, and belongs to the technical field of heat-conducting gel, wherein problems that in the prior art, the densityof heat conduction gel is high, the weight of parts is increased in the application process, and the cost is high are solved. The low-density heat-conducting gel is prepared from the following raw materials: hollow microspheres with silver-plated surfaces and aluminum oxide. The low-density heat-conducting gel is prepared from the following raw materials: a component A: vinyl silicone oil, dimethicone, hollow microspheres with silver-plated surfaces, aluminum oxide and a chloroplatinic acid-isopropanol complex; a component B: vinyl silicone oil, dimethyl silicone oil, side hydrogen-containingsilicone oil, terminal hydrogen-containing silicone oil, hollow microspheres with silver-plated surfaces, aluminum oxide, 3,5-dimethyl-1-hexyne-3-ol and carbon black. The low-density heat-conductinggel disclosed by the invention is good in heat-conducting property, low in density, low in cost and wide in applicability.

Description

technical field [0001] The invention belongs to the technical field of heat-conducting gels, and in particular relates to a low-density heat-conducting gel and a preparation method thereof. Background technique [0002] With the development of the automotive industry and the electronic communication industry, such as new energy vehicles, 5G communication equipment, mobile phone notebooks, etc., equipment has higher and higher requirements for heat dissipation and lightweight (low density) of components, so high thermal conductivity, Lightweight materials play an increasingly important role. At present, the commonly used thermal interface materials are mainly thermal conductive silicone grease, thermal conductive silicone gasket, thermal conductive gel, etc. Thermal conductive gel, as a new type of thermal interface material, has attracted much attention. [0003] Because there is no cross-linking reaction in thermal conductive silicone grease, it is easy to cause oil powder...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L83/07C08L83/05C08L83/04C08K13/06C08K9/02C08K7/24C08K7/18C08K3/22C09K5/14
CPCC08L83/04C09K5/14C08L2205/025C08L2205/035C08K2003/2227C08K13/06C08K9/02C08K7/24C08K7/18C08K3/22
Inventor 不公告发明人
Owner 广州布鲁奥申新材料科技有限公司
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