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A kind of one-component epoxy resin flow type bottom filling adhesive and preparation method thereof

An epoxy resin and underfill technology, which is applied in the directions of epoxy resin glue, adhesive, polymer adhesive additives, etc., can solve the problems of unhelpful heat dissipation of electronic components, unable to meet the glue filling effect, and reduced glue fluidity. , to achieve the effect of good adhesion, good thermal conductivity and insulation, and low hygroscopicity

Active Publication Date: 2022-04-01
东莞市新懿电子材料技术有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] However, with the advent of the 5G era, the calculation of the chip is further increased, the heat generation is high, and the heat dissipation problem is becoming more and more prominent. However, the thermal conductivity of the traditional underfill adhesive is very low, which basically does not help the heat dissipation of electronic components.
Adding heat-conducting particles in the filler is a way to increase the thermal conductivity of the glue, but with the increase of heat-conducting particles, the fluidity of the glue will decrease again, which cannot satisfy the filling effect of the glue

Method used

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  • A kind of one-component epoxy resin flow type bottom filling adhesive and preparation method thereof
  • A kind of one-component epoxy resin flow type bottom filling adhesive and preparation method thereof

Examples

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Effect test

Embodiment 1

[0026] This embodiment provides a one-component epoxy resin flow type underfill adhesive, including the following components by mass: 40 parts of bisphenol F epoxy resin, 15 parts of the first filler, 8 parts of the second filler, and 8 parts of curing agent , 4 parts of curing accelerator, 10 parts of reactive diluent, 3 parts of toughening agent, 2 parts of ion trapping agent, 2 parts of toner, 0.5 part of coupling agent.

[0027] Wherein, the first filler is spherical silica with a particle size of 15 μm, and the second filler is modified spherical alumina with a particle size of 5 μm. The toughening agent is acrylic rubber with spherical core-shell structure. The structural formula of the ion capture agent is Mg 1-n Al n (OH) 2 (CO 3 ) n / 2 .mH 2O wherein, 0

Embodiment 2

[0033] This embodiment provides a one-component epoxy resin flow type underfill adhesive, including the following components by mass: 50 parts of bisphenol F epoxy resin, 10 parts of the first filler, 5 parts of the second filler, and 5 parts of curing agent , 5 parts of curing accelerator, 5 parts of reactive diluent, 3 parts of toughening agent, 0.1 part of ion trapping agent, 3 parts of toner, 3 parts of coupling agent.

[0034] Wherein, the first filler is spherical silica with a particle size of 10 μm, and the second filler is modified spherical alumina with a particle size of 3 μm. The toughening agent is acrylic rubber with spherical core-shell structure. The structural formula of the ion capture agent is Mg 1-n al n (OH) 2 (CO 3 ) n / 2 .mH 2 O wherein, 0

Embodiment 3

[0040] This embodiment provides a one-component epoxy resin flow type underfill adhesive, including the following components by mass: 10 parts of bisphenol F epoxy resin, 20 parts of the first filler, 10 parts of the second filler, and 10 parts of curing agent , 5 parts of curing accelerator, 15 parts of reactive diluent, 3 parts of toughening agent, 3 parts of ion trapping agent, 1 part of toner, and 1 part of coupling agent.

[0041] Wherein, the first filler is spherical silica with a particle size of 25 μm, and the second filler is modified spherical alumina with a particle size of 9 μm. The toughening agent is acrylic rubber with spherical core-shell structure. The structural formula of the ion capture agent is BiO x (OH) y (NO) z , wherein, 0.9≤x≤1.1, 0.6≤y≤0.8, 0.2≤z≤0.4, and the particle size of the ion trapping agent is 0.1 μm. The reactive diluent is n-butyl glycidyl ether. The curing agent is dicyandiamide curing agent, and the curing accelerator is 2-phenyl-4,...

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Abstract

The invention belongs to the field of filling adhesives, and in particular relates to a one-component epoxy resin flow type bottom filling adhesive, which comprises the following composition in parts by mass: 10-50 parts of bisphenol F epoxy resin, 10-20 parts of the first filler, and 10-20 parts of the first filler. 5-10 parts of two fillers, 5-10 parts of curing agent, 2-5 parts of curing accelerator, 5-15 parts of reactive diluent, 0.1-3 parts of toughening agent, 0.1-3 parts of ion scavenger, the first The particle size of the filler is larger than that of the second filler. The mass fraction of the filler in the present invention is relatively low. Through the organic combination of the first filler and the second filler, the thermal conductivity coefficient of the overall underfill adhesive can be improved while controlling the viscosity of the system, and it has good adhesion, thermal conductivity and insulation. , Good heat resistance, low viscosity, good fluidity, and low hygroscopicity.

Description

technical field [0001] The invention belongs to the field of filling adhesives, in particular to a one-component epoxy resin flow type bottom filling adhesive and a preparation method thereof. Background technique [0002] In the 21st century, due to the demand for wireless communications, portable computers, broadband Internet products and car navigation electronic products, the integration of electronic devices is getting higher and higher, the chip area is expanding, and the number of integrated circuit pins is increasing. At the same time, chip packaging is required The size is further miniaturized and miniaturized, integrated circuits are becoming lighter, thinner, and smaller, and the integration, density, and performance of integrated circuits are gradually improved, so many new packaging technologies and packaging forms have emerged. [0003] Packaging is to put "clothes" on the chip, protect the chip from damage caused by physical, chemical and other environmental f...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J163/02C09J11/04C09J11/08
CPCC09J163/00C09J11/04C09J11/08C08L2201/08C08L2207/53C08L2205/06C08K2201/005C08K2201/014C08L33/08C08K13/06C08K7/18C08K3/26C08K3/38
Inventor 刘伟康石爱斌刘鑫
Owner 东莞市新懿电子材料技术有限公司
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