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A preparation method and application of heat-resistant connection foam

A foam and heat-resistant technology, applied in the field of foam, can solve the problems of poor mechanical properties, affecting structural stability, connectivity, and poor heat resistance, and achieve the effects of improving other properties, maintaining other properties, and increasing heat resistance

Active Publication Date: 2021-05-07
深圳市象形科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The existing connecting foams on the market tend to have poor heat resistance and are prone to deformation, resulting in dimensional changes that affect the structural stability and connectivity, thus affecting the service life of the foam; and the mechanical properties are poor, and the cost performance is low, which cannot fully meet the market requirements.

Method used

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  • A preparation method and application of heat-resistant connection foam
  • A preparation method and application of heat-resistant connection foam

Examples

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preparation example Construction

[0019] The invention provides a method for preparing heat-resistant connecting foam, which comprises the following steps.

[0020] Step 1: Disperse 1,4-cyclohexanediol, simethicone, acrylic acid and di-n-octyl phthalate evenly, heat to 100-120°C and react for 3-5 hours, then adjust the pH value to 6.4- 6.6. Add ethyl acrylate, lauryl acrylate and 1-hydroxycyclohexyl phenyl ketone, then raise the temperature to 200-220°C at a heating rate of 0.5-1°C / min, and keep it warm for 10-12h to obtain the first composition; Among them, the mass ratio of 1,4-cyclohexanediol, simethicone, acrylic acid, di-n-octyl phthalate, ethyl acrylate, lauryl acrylate and 1-hydroxycyclohexyl phenyl ketone is 1: (0.05-0.1): (10-12): (1-3): (0.2-0.4): (0.1-0.2): (0.5-0.7).

[0021] Step 2: Disperse acryloxytriisopropylsilane, N-methylolacrylamide and formamide evenly, adjust the pH value to 9.2-9.6, let stand for 20-24h, then add isopropanol, water-based epoxy The modified resin and benzophenone are he...

Embodiment 1

[0028] This embodiment provides a heat-resistant connection foam and a preparation method thereof, including the following steps.

[0029] Step 1: Disperse 1,4-cyclohexanediol, simethicone, acrylic acid and di-n-octyl phthalate evenly, heat to 100°C and react for 3 hours, then adjust the pH value to 6.4, and add ethyl acrylate , lauryl acrylate, and 1-hydroxycyclohexyl phenyl ketone, and then heated up to 200°C at a heating rate of 0.5°C / min, and kept for 10 hours to obtain the first composition; among them, 1,4-cyclohexanediol, di The mass ratio of methyl silicone oil, acrylic acid, dioctyl phthalate, ethyl acrylate, lauryl acrylate and 1-hydroxycyclohexyl phenyl ketone is 1:0.05:10:1:0.2:0.1:0.5.

[0030] Step 2: Disperse acryloxytriisopropylsilane, N-methylolacrylamide and formamide evenly, adjust the pH value to 9.2, let it stand for 20 hours, then add isopropanol, water-based epoxy modified resin and Benzophenone was heated to 160°C at a stirring speed of 200r / min, and k...

Embodiment 2

[0034] This embodiment provides a heat-resistant connection foam and a preparation method thereof, including the following steps.

[0035] Step 1: Disperse 1,4-cyclohexanediol, simethicone, acrylic acid and di-n-octyl phthalate evenly, heat to 120°C and react for 5 hours, then adjust the pH value to 6.6, and add ethyl acrylate , lauryl acrylate and 1-hydroxycyclohexyl phenyl ketone, and then the temperature was raised to 220°C at a heating rate of 1°C / min, and kept for 12h to obtain the first composition; wherein, 1,4-cyclohexanediol, di The mass ratio of methyl silicone oil, acrylic acid, dioctyl phthalate, ethyl acrylate, lauryl acrylate and 1-hydroxycyclohexyl phenyl ketone is 1:0.1:12:3:0.4:0.2:0.7.

[0036] Step 2: Disperse acryloxytriisopropylsilane, N-methylolacrylamide and formamide evenly, adjust the pH value to 9.6, let it stand for 24 hours, then add isopropanol, water-based epoxy modified resin and Benzophenone was heated to 170°C at a stirring speed of 220r / min, ...

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Abstract

The invention relates to a preparation method of heat-resistant connecting foam and use thereof, wherein the preparation method comprises the steps of: uniformly dispersing 1,4-cyclohexanediol, dimethicone, acrylic acid and di-n-octyl phthalate After the treatment, ethyl acrylate, lauryl acrylate and 1-hydroxycyclohexyl phenyl ketone are added to react to obtain the first composition; acryloxy triisopropyl silane, N-methylol acrylamide and formamide are added Disperse uniformly, adjust pH, add raw materials such as isopropanol, and react to obtain the second composition; mix raw materials such as acetoacetoxyethyl methacrylate, glycerin, etc. to obtain the third composition; combine the first composition and the second composition After the mixture is mixed and processed, the third composition, acrylate silicone emulsion and azodicarbonamide are added, and after foaming, it is cured and formed to obtain heat-resistant connecting foam. The foam provided by the invention has good heat resistance, excellent tensile strength, impact strength, waterproof performance, elongation at break and flame retardancy, and has wide application prospects.

Description

technical field [0001] The invention relates to the technical field of foam, in particular to a preparation method and application of heat-resistant connecting foam. Background technique [0002] Foam is a material made of plastic particles, which can be divided into PU foam, anti-static foam, conductive foam, EPE, anti-static EPE, PORON, CR, EVA, bridging PE, SBR, EPDM, etc. Foam has a series of characteristics such as good elasticity, light weight, fast pressure-sensitive fixation, convenient use, free bending, ultra-thin volume, and reliable performance. With the rapid development of electronics and communication industries, connection foams are beginning to be used in such industries to play the role of connection buffer. The existing connecting foams on the market tend to have poor heat resistance and are prone to deformation, resulting in dimensional changes that affect the structural stability and connectivity, thus affecting the service life of the foam; and the mec...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08J9/10C08L51/08C08L51/00C08L91/00C08F283/12C08F283/10C08F263/04C08F220/06C08F220/18C08F230/08C08F220/58C08F220/28C08F220/20
CPCC08F263/04C08F283/10C08F283/12C08F283/124C08J9/103C08J2351/00C08J2351/08C08J2491/00C08F220/06C08F220/1802C08F220/1812C08F230/085C08F220/58C08F220/283C08F220/20
Inventor 张志伟陈洲
Owner 深圳市象形科技有限公司