A preparation method and application of heat-resistant connection foam
A foam and heat-resistant technology, applied in the field of foam, can solve the problems of poor mechanical properties, affecting structural stability, connectivity, and poor heat resistance, and achieve the effects of improving other properties, maintaining other properties, and increasing heat resistance
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[0019] The invention provides a method for preparing heat-resistant connecting foam, which comprises the following steps.
[0020] Step 1: Disperse 1,4-cyclohexanediol, simethicone, acrylic acid and di-n-octyl phthalate evenly, heat to 100-120°C and react for 3-5 hours, then adjust the pH value to 6.4- 6.6. Add ethyl acrylate, lauryl acrylate and 1-hydroxycyclohexyl phenyl ketone, then raise the temperature to 200-220°C at a heating rate of 0.5-1°C / min, and keep it warm for 10-12h to obtain the first composition; Among them, the mass ratio of 1,4-cyclohexanediol, simethicone, acrylic acid, di-n-octyl phthalate, ethyl acrylate, lauryl acrylate and 1-hydroxycyclohexyl phenyl ketone is 1: (0.05-0.1): (10-12): (1-3): (0.2-0.4): (0.1-0.2): (0.5-0.7).
[0021] Step 2: Disperse acryloxytriisopropylsilane, N-methylolacrylamide and formamide evenly, adjust the pH value to 9.2-9.6, let stand for 20-24h, then add isopropanol, water-based epoxy The modified resin and benzophenone are he...
Embodiment 1
[0028] This embodiment provides a heat-resistant connection foam and a preparation method thereof, including the following steps.
[0029] Step 1: Disperse 1,4-cyclohexanediol, simethicone, acrylic acid and di-n-octyl phthalate evenly, heat to 100°C and react for 3 hours, then adjust the pH value to 6.4, and add ethyl acrylate , lauryl acrylate, and 1-hydroxycyclohexyl phenyl ketone, and then heated up to 200°C at a heating rate of 0.5°C / min, and kept for 10 hours to obtain the first composition; among them, 1,4-cyclohexanediol, di The mass ratio of methyl silicone oil, acrylic acid, dioctyl phthalate, ethyl acrylate, lauryl acrylate and 1-hydroxycyclohexyl phenyl ketone is 1:0.05:10:1:0.2:0.1:0.5.
[0030] Step 2: Disperse acryloxytriisopropylsilane, N-methylolacrylamide and formamide evenly, adjust the pH value to 9.2, let it stand for 20 hours, then add isopropanol, water-based epoxy modified resin and Benzophenone was heated to 160°C at a stirring speed of 200r / min, and k...
Embodiment 2
[0034] This embodiment provides a heat-resistant connection foam and a preparation method thereof, including the following steps.
[0035] Step 1: Disperse 1,4-cyclohexanediol, simethicone, acrylic acid and di-n-octyl phthalate evenly, heat to 120°C and react for 5 hours, then adjust the pH value to 6.6, and add ethyl acrylate , lauryl acrylate and 1-hydroxycyclohexyl phenyl ketone, and then the temperature was raised to 220°C at a heating rate of 1°C / min, and kept for 12h to obtain the first composition; wherein, 1,4-cyclohexanediol, di The mass ratio of methyl silicone oil, acrylic acid, dioctyl phthalate, ethyl acrylate, lauryl acrylate and 1-hydroxycyclohexyl phenyl ketone is 1:0.1:12:3:0.4:0.2:0.7.
[0036] Step 2: Disperse acryloxytriisopropylsilane, N-methylolacrylamide and formamide evenly, adjust the pH value to 9.6, let it stand for 24 hours, then add isopropanol, water-based epoxy modified resin and Benzophenone was heated to 170°C at a stirring speed of 220r / min, ...
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