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A method of manufacturing a copper-aluminum combined 5G antenna radiator

A manufacturing method and radiator technology, which can be applied to antennas, antenna parts, electrical components, etc., can solve the problems of poor heat dissipation performance and reduced heat dissipation efficiency of radiators, and achieve increased surface area, reduced surface temperature, and improved heat accumulation. Effect

Active Publication Date: 2021-11-23
UNIV OF SCI & TECH LIAONING
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Since the surface of the radiator is covered with a sealing cover plate, although the corrosion resistance of the radiator is enhanced, the sealing cover plate causes the heat dissipation performance of the radiator to deteriorate and the heat dissipation efficiency to decrease

Method used

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  • A method of manufacturing a copper-aluminum combined 5G antenna radiator
  • A method of manufacturing a copper-aluminum combined 5G antenna radiator
  • A method of manufacturing a copper-aluminum combined 5G antenna radiator

Examples

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Effect test

Embodiment 1

[0036] A method for manufacturing a copper-aluminum combined 5G antenna heat sink, which is made by copper-based aluminum die-casting, comprising the following steps:

[0037] Make the mold:

[0038] Design the mold structure according to the requirements. The die-casting mold adopts H13 mold steel as the mold core, and the mold frame adopts QT600 ductile iron. The mold is heated, and the lubricating liquid is evenly sprayed in the mold, and the pressure casting machine with the casting mold installed is used for die-casting;

[0039] The die-casting mold adopts XR-D coating, the thickness of the coating is 2 μm, the oxidation resistance temperature of the coating is 1300 ℃, the hardness of the coating is HV0.05:4500, and the color is gray-black.

[0040] The core processing method is:

[0041] 1) Modulation, 2) Rough machining, 3) Three tempering treatments, 4) Forming fine electrical machining, 5) Stress relief treatment, 6) Oxidation treatment.

[0042] The mold is to mak...

Embodiment 2

[0054] A method for manufacturing a copper-aluminum combined 5G antenna heat sink, which is made by copper-based aluminum die-casting, comprising the following steps:

[0055] Make the mold:

[0056] Design the mold structure according to the requirements. The die-casting mold adopts H13 mold steel as the mold core, and the mold frame adopts QT600 ductile iron. The mold is heated, and the lubricating liquid is evenly sprayed in the mold, and the pressure casting machine with the casting mold installed is used for die-casting;

[0057] The die-casting mold adopts XR-D coating, the thickness of the coating is 3 μm, the oxidation resistance temperature of the coating is 1400 ℃, the hardness of the coating is HV0.05:4500, and the color is gray-black.

[0058] The core processing method is:

[0059] 1) Modulation, 2) Rough machining, 3) Three tempering treatments, 4) Forming fine electrical machining, 5) Stress relief treatment, 6) Oxidation treatment.

[0060] The mold is to mak...

Embodiment 3

[0072] A method for manufacturing a copper-aluminum combined 5G antenna heat sink, which is made by copper-based aluminum die-casting, comprising the following steps:

[0073] Make the mold:

[0074] Design the mold structure according to the requirements. The die-casting mold adopts H13 mold steel as the mold core, and the mold frame adopts QT600 ductile iron. The mold is heated, and the lubricating liquid is evenly sprayed in the mold, and the pressure casting machine with the casting mold installed is used for die-casting;

[0075] The die-casting mold adopts XR-D coating, the thickness of the coating is 5 μm, the oxidation resistance temperature of the coating is 1500 °C, the hardness of the coating is HV0.05:4500, and the color is gray-black.

[0076] The core processing method is:

[0077] 1) Modulation, 2) Rough machining, 3) Three tempering treatments, 4) Forming fine electrical machining, 5) Stress relief treatment, 6) Oxidation treatment.

[0078] The mold is to ma...

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Abstract

The invention relates to the technical field of metal material processing, in particular to a method for manufacturing a copper-aluminum combined 5G antenna radiator, which is made by die-casting a copper sheet that has been frosted in advance. This method can connect copper and aluminum The thermal resistance is minimized. At the same time, due to the semi-ellipsoidal sheet structure of the heat sink, the heat dissipation speed can be accelerated. In addition, the use of pure copper as the substrate can even out the heat of the chip, and at the same time better The heat is transferred to the aluminum fins, the temperature distribution of the radiator is even, and the surface temperature difference is small. Multiple heat sinks work at the same time, and the heat dissipation efficiency is high. Due to the arc-shaped structure inside, it can strengthen the rise of the weak airflow, and enhance the convection efficiency of the fins and air.

Description

technical field [0001] The invention relates to the technical field of metal material processing, in particular to a method for manufacturing a copper-aluminum combined 5G antenna radiator. Background technique [0002] At present, communication technology is developing rapidly. With the increasing popularity of 5G technology, while the performance and speed are improving, the number of transistors in the chip is increasing, the heat generation of the chip is also increasing, and the power consumption of the chip is also getting higher and higher. When the operating temperature of the chip exceeds 200° C., the excessively high temperature causes excessive thermal expansion stress among the materials. This will lead to permanent failure of the chip, and the excessive temperature will cause greater heat generation, which will greatly increase the power consumption of the device. Therefore, the base station chip radiator has become the research direction of the majority of res...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B22D17/00B22D19/04B22D17/22H01Q1/00
CPCB22D17/00B22D17/2209B22D19/04H01Q1/02
Inventor 徐振李雪陈雪娇陈星宇张于顺梅硕教镇博王心怡薛彤郭菁庞启航张俊凯侯忠霖于德川赵卓王洪斌乔军李胜利
Owner UNIV OF SCI & TECH LIAONING
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