High-voltage insulating epoxy resin composition for conductive column and preparation method thereof

Abstract

The invention relates to the field of polymer chemical engineering, and particularly provides a high-voltage insulating epoxy resin composition for a conductive column and a preparation method of thehigh-voltage insulating epoxy resin composition. The first aspect of the invention provides the high-voltage insulating epoxy resin composition for the conductive column, which comprises the followingpreparation raw materials in parts by weight: 90-100 parts of epoxy resin, 60-70 parts of a curing agent, 0.05-0.5 part of an accelerant and 40-80 parts of an inorganic filler.

Description

Technical field

[0001] The present invention relates to the field of polymer chemical engineering. More specifically, the present invention provides a high-voltage insulating epoxy resin composition for conductive columns and a preparation method thereof. Background technique

[0002] Epoxy resin is an important type of thermosetting resin. Its molecular structure contains two or more epoxy groups, which can react with curing agents (anhydrides, amines, etc.) to form cross-linked cured products. Because of its excellent mechanical properties, electrical properties, chemical resistance, bonding properties, etc., it is widely used in coatings, adhesives, electrical and electronic material insulation and advanced composite materials. It is even more effective in the field of composite materials. It can be combined with fibers and fabrics and other reinforcing materials to form a multiphase system solid material. This solid material can give full play to the characteristics and poten...

Examples

preparation example Construction

[0049] The raw materials for preparing the phosphorus-containing curing agent include p-aminophenol and phenylphosphoryl dichloride.

[0050] In a preferred embodiment, the molar ratio of the p-aminophenol and phenylphosphoryl dichloride is (2~3):1; more preferably, the molar ratio of the p-aminophenol and phenylphosphoryl dichloride is The molar ratio is 2.5:1.

[0051] The preparation process of the phosphorus-containing curing agent is: in a flask equipped with a stirrer, reflux condensation, thermometer, and nitrogen protection, add 0.25 mol of p-aminophenol, 100 mL of methyl isobutyl ketone, and 1.5 mL of triethylamine in sequence to heat Bring to 20~30℃, stir until the p-aminophenol is dissolved, pass nitrogen protection, heat up to 100~110℃, then add dropwise 40mL methyl isobutyl ketone solution with 0.1mol phenylphosphoryl dichloride, 1~2h drops After the addition is complete, react for 5-8h, stop heating, naturally cool to room temperature, filter, wash with dichlorometha...

Embodiment 1

[0075] Embodiment 1 of the present invention provides a high-voltage insulating epoxy resin composition for conductive posts, which includes 90 parts epoxy resin, 60 parts curing agent, 0.05 parts accelerator, and 40 parts inorganic filler.

[0076] In parts by weight, the preparation raw material also includes 0.6 parts of a release agent.

[0077] The epoxy resin includes bisphenol A type epoxy resin, aliphatic epoxy resin and biphenyl type epoxy resin.

[0078] The bisphenol A epoxy resin was purchased from An Debao of Shanghai Huayi Resin Co., Ltd.

[0079] The aliphatic epoxy resin was purchased from ERL-4221 of Hubei Jusheng Technology Co., Ltd.

[0080] The biphenyl type epoxy resin was purchased from Mitsubishi YX4000HK of Shanghai Zhongsi Industrial Co., Ltd.

[0081] The mass ratio of the bisphenol A epoxy resin, aliphatic epoxy resin and biphenyl epoxy resin is 1:0.5:0.6.

[0082] The curing agent includes modified aromatic amine and modified aliphatic amine.

[0083] The modif...

Embodiment 2

[0098] Embodiment 2 of the present invention provides a high-voltage insulating epoxy resin composition for conductive columns, which includes 100 parts epoxy resin, 70 parts curing agent, 0.5 parts accelerator, and 80 parts inorganic filler.

[0099] In parts by weight, the preparation raw material also includes 0.9 parts of a release agent.

[0100] The epoxy resin includes bisphenol A type epoxy resin, aliphatic epoxy resin and biphenyl type epoxy resin.

[0101] The bisphenol A epoxy resin was purchased from An Debao of Shanghai Huayi Resin Co., Ltd.

[0102] The aliphatic epoxy resin was purchased from ERL-4221 of Hubei Jusheng Technology Co., Ltd.

[0103] The biphenyl type epoxy resin was purchased from Mitsubishi YX4000HK of Shanghai Zhongsi Industrial Co., Ltd.

[0104] The mass ratio of the bisphenol A epoxy resin, the aliphatic epoxy resin and the biphenyl epoxy resin is 1:0.7:0.8.

[0105] The curing agent includes modified aromatic amine and modified aliphatic amine.

[0106]...

Technical field

[0001] The present invention relates to the field of polymer chemical engineering. More specifically, the present invention provides a high-voltage insulating epoxy resin composition for conductive columns and a preparation method thereof. Background technique

[0002] Epoxy resin is an important type of thermosetting resin. Its molecular structure contains two or more epoxy groups, which can react with curing agents (anhydrides, amines, etc.) to form cross-linked cured products. Because of its excellent mechanical properties, electrical properties, chemical resistance, bonding properties, etc., it is widely used in coatings, adhesives, electrical and electronic material insulation and advanced composite materials. It is even more effective in the field of composite materials. It can be combined with fibers and fabrics and other reinforcing materials to form a multiphase system solid material. This solid material can give full play to the characteristics and poten...

Examples

preparation example Construction

[0049] The raw materials for preparing the phosphorus-containing curing agent include p-aminophenol and phenylphosphoryl dichloride.

[0050] In a preferred embodiment, the molar ratio of the p-aminophenol and phenylphosphoryl dichloride is (2~3):1; more preferably, the molar ratio of the p-aminophenol and phenylphosphoryl dichloride is The molar ratio is 2.5:1.

[0051] The preparation process of the phosphorus-containing curing agent is: in a flask equipped with a stirrer, reflux condensation, thermometer, and nitrogen protection, add 0.25 mol of p-aminophenol, 100 mL of methyl isobutyl ketone, and 1.5 mL of triethylamine in sequence to heat Bring to 20~30℃, stir until the p-aminophenol is dissolved, pass nitrogen protection, heat up to 100~110℃, then add dropwise 40mL methyl isobutyl ketone solution with 0.1mol phenylphosphoryl dichloride, 1~2h drops After the addition is complete, react for 5-8h, stop heating, naturally cool to room temperature, filter, wash with dichlorometha...

Embodiment 1

[0075] Embodiment 1 of the present invention provides a high-voltage insulating epoxy resin composition for conductive posts, which includes 90 parts epoxy resin, 60 parts curing agent, 0.05 parts accelerator, and 40 parts inorganic filler.

[0076] In parts by weight, the preparation raw material also includes 0.6 parts of a release agent.

[0077] The epoxy resin includes bisphenol A type epoxy resin, aliphatic epoxy resin and biphenyl type epoxy resin.

[0078] The bisphenol A epoxy resin was purchased from An Debao of Shanghai Huayi Resin Co., Ltd.

[0079] The aliphatic epoxy resin was purchased from ERL-4221 of Hubei Jusheng Technology Co., Ltd.

[0080] The biphenyl type epoxy resin was purchased from Mitsubishi YX4000HK of Shanghai Zhongsi Industrial Co., Ltd.

[0081] The mass ratio of the bisphenol A epoxy resin, aliphatic epoxy resin and biphenyl epoxy resin is 1:0.5:0.6.

[0082] The curing agent includes modified aromatic amine and modified aliphatic amine.

[0083] The modif...

Embodiment 2

[0098] Embodiment 2 of the present invention provides a high-voltage insulating epoxy resin composition for conductive columns, which includes 100 parts epoxy resin, 70 parts curing agent, 0.5 parts accelerator, and 80 parts inorganic filler.

[0099] In parts by weight, the preparation raw material also includes 0.9 parts of a release agent.

[0100] The epoxy resin includes bisphenol A type epoxy resin, aliphatic epoxy resin and biphenyl type epoxy resin.

[0101] The bisphenol A epoxy resin was purchased from An Debao of Shanghai Huayi Resin Co., Ltd.

[0102] The aliphatic epoxy resin was purchased from ERL-4221 of Hubei Jusheng Technology Co., Ltd.

[0103] The biphenyl type epoxy resin was purchased from Mitsubishi YX4000HK of Shanghai Zhongsi Industrial Co., Ltd.

[0104] The mass ratio of the bisphenol A epoxy resin, the aliphatic epoxy resin and the biphenyl epoxy resin is 1:0.7:0.8.

[0105] The curing agent includes modified aromatic amine and modified aliphatic amine.

[0106]...

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