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Fluorine-silicon modified epoxy resin, preparation method and application thereof

A technology of epoxy resin and fluorosilicone modification, which is applied in the direction of epoxy resin glue, film/sheet adhesive, adhesive, etc. It can solve the problem of poor heat resistance and dielectric properties, and cannot meet the requirements of the microelectronics industry, etc. Problems, to achieve low dielectric properties, improve heat resistance, low dielectric constant effect

Active Publication Date: 2020-09-08
ZHEJIANG FORST NEW MATERIAL RES INST CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0007] The main purpose of the present invention is to provide a kind of fluorosilicon modified epoxy resin, its preparation method and application, to solve the problem of epoxy resin covering film in the prior art Poor heat resistance and dielectric properties, unable to meet the requirements of the rapidly developing microelectronics industry

Method used

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  • Fluorine-silicon modified epoxy resin, preparation method and application thereof
  • Fluorine-silicon modified epoxy resin, preparation method and application thereof
  • Fluorine-silicon modified epoxy resin, preparation method and application thereof

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preparation example Construction

[0028] According to another aspect of the present invention, also provide the preparation method of above-mentioned fluorosilicone modified epoxy resin, it comprises the following steps: S1, reaction monomer trifluoropropylmethyl cyclotrisiloxane (D 3 F) and / or 2,4,6,8-tetramethyl-2,4,6,8-tetrakis(3,3,3-trifluoropropyl)cyclotetrasiloxane (D 4 F) Carry out ring-opening bulk polymerization under the action of an alkali metal initiator to form a hydroxyl-terminated polyfluorosilicon polymer; S2, make a hydroxyl-terminated polyfluorosilicon polymer and epichlorohydrin undergo an epoxidation reaction to obtain a fluorosilicon modified permanent epoxy resin. The above-mentioned modified epoxy resin can be obtained through ring-opening bulk polymerization and terminal hydroxyl epoxidation by the above-mentioned method. The method has the advantages of convenient operation, simple procedure, mild reaction conditions, high reaction conversion rate, etc., and is very suitable for large...

Embodiment

[0041] Preparation of fluorosilicone modified epoxy resin:

[0042] Step 1 Anionic ring-opening bulk polymerization of hydroxyl fluorosilicone polymer: the polymerization monomer is trifluoropropylmethylcyclotrisiloxane (D 3 F), initiator is potassium hydroxide initiator; Add D in the reactor 3 F and Potassium Hydroxide, the control initiator (mol ratio) is 1.0%, 20 ℃ of reaction temperatures, 30min of reaction time, whole reaction process is carried out under nitrogen protection; Add hydrochloric acid termination at last, consumption is 5 times of initiator (mol ratio ). After the reaction was completed, it was extracted with ethyl acetate and washed. A hydroxyl-terminated polyfluorosilicon polymer is obtained. The viscosity of the synthesized polymer is about 6000 mPa·s, corresponding to n in formula I is about 20.

[0043] Step 2 Epoxidation of terminal hydroxyl groups: Based on 100 parts by weight of the above-mentioned synthesized hydroxyl-terminated fluorosilicone po...

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Abstract

The invention provides fluorine-silicon modified epoxy resin, a preparation method and application thereof. The fluorine-silicon modified epoxy resin comprises a structure represented by the followingformula I, wherein in the formula I, n is an integer greater than 5. The fluorine-silicon modified epoxy resin provided by the invention has the advantages of low dielectric constant, low dielectricloss and excellent heat resistance. According to the invention, with the application of the fluorine-silicon modified epoxy resin in an epoxy resin-based cover film, the heat resistance of the cover film can be obviously improved, and the film has low dielectric property and meets the high-frequency and high-efficiency transmission requirements of signals in the 5G era so as to be used as a flexible copper-clad plate and a halogen-free cover film material in the fields of intelligent products (glasses, earphones, mobile phones, watches and the like), cameras, video cameras, portable flat-paneldisplays, military aerospace automobiles and the like.

Description

technical field [0001] The invention relates to the technical field of cover film materials, in particular to a fluorine-silicon modified epoxy resin, its preparation method and application. Background technique [0002] In recent years, with the rapid development of electronic technology, the demand for flexible circuit boards has become stronger and its application fields have become wider. Therefore, higher requirements are put forward for the performance of the cover film used for the protection material of flexible copper clad substrate (FCCL). The cover film is an insulating film coated with an adhesive. It not only resists soldering and protects the FPC from moisture, foreign substances, and chemicals, but also improves the flex resistance of the FPC. At present, the resin systems of cover film adhesives are mainly acrylic and epoxy resins. Among them, epoxy resin has excellent adhesion, excellent electrical insulation, good mechanical properties, good corrosion res...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G59/30C08G77/385C08G77/24C08G77/16C09J163/00C09J179/08C09J175/04C09J7/30
CPCC08G59/308C08G59/306C08G77/045C08G77/385C08G77/24C08G77/16C09J163/00C09J179/08C09J175/04C09J7/30C08K2003/2227C08L2205/025C08L2205/035C08L2201/02C08L2201/08C08L63/00C08L79/08C08L75/04C08L9/02C08K3/22C08K5/5313
Inventor 陈培黄黎明周慧
Owner ZHEJIANG FORST NEW MATERIAL RES INST CO LTD