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Halogen-free flame retardant thermosetting resin composition, prepreg for printed circuit and metal-clad laminate

A resin composition, thermosetting technology, applied in printed circuits, printed circuit parts, metal layered products, etc., can solve the problems of high dielectric constant of sheets, poor heat resistance of multi-layer boards, and high water absorption of sheets

Active Publication Date: 2021-07-30
GUANGDONG SHENGYI SCI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In the past, as the resin composition used in printed circuit boards requiring low transmission loss, in the patent CN103131131A, it is disclosed that there is a method of using styrene-maleic anhydride copolymer to cooperate with epoxy resin and benzoxazine resin, but the produced The glass transition temperature of the finished board is only 170°C, and the coefficient of thermal expansion (CTE) is large. In addition, the board has high water absorption and the heat resistance of the multilayer board is not good.
In CN201510106304, the combination of amine-modified bismaleimide, benzoxazine resin and epoxy resin can obtain the effect of high glass transition temperature and low CTE by utilizing the advantages of bismaleimide. However, the dielectric constant of the board is high, which is not conducive to signal transmission in the PCB at high frequencies

Method used

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  • Halogen-free flame retardant thermosetting resin composition, prepreg for printed circuit and metal-clad laminate
  • Halogen-free flame retardant thermosetting resin composition, prepreg for printed circuit and metal-clad laminate
  • Halogen-free flame retardant thermosetting resin composition, prepreg for printed circuit and metal-clad laminate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1-9 and comparative example 1-5

[0095] The compositions and solid amounts of the thermosetting resin compositions of Examples 1-9 and Comparative Examples 1-5 are shown in Table 1 or Table 2.

[0096] Preparation of copper clad laminate

[0097] According to the composition and amount (parts by weight) shown in Table 1 or 2, the components of the respective thermosetting resin compositions of Examples 1-9 and Comparative Examples 1-5 were put into containers, stirred to make them mix uniformly, and prepared Form the respective thermosetting resin compositions of Examples 1-9 and Comparative Examples 1-5, add methyl ethyl ketone solvent and mix uniformly therein, so that the solid content is 60% and make glue solution, promptly obtain Embodiment 1-9 and comparative Example 1-5 respective resin glue. Use 2116 electronic grade glass fiber cloth to impregnate the resin glue solution, and bake in an oven at 150°C to form the respective 2116 prepregs of Examples 1-9 and Comparative Examples 1-5. Take 6 sheets of...

Embodiment 2

[0130] Example 2 On the basis of Example 1, the amount of inorganic filler and phosphorus-containing epoxy resin is reduced, and phosphorus-containing phenolic resin is introduced.

[0131] Examples 3, 4 and 5 use different types of epoxy resins and different types of benzoxazine resins around prepolymer A-1.

Embodiment 6

[0132] Example 6 On the basis of Example 1, prepolymer A-1 was replaced with prepolymer A-2.

[0133] Examples 7, 8 and 9 use different types of epoxy resins and different types of benzoxazine resins around prepolymer A-2.

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Abstract

The disclosure provides a halogen-free flame-retardant thermosetting resin composition, a prepreg for a printed circuit, and a metal-clad laminate. The halogen-free flame-retardant thermosetting resin composition comprises: a modified bismaleimide prepolymer; a benzoxazine resin; a phosphorus-containing epoxy resin; an acid anhydride compound; and a curing accelerator. By using the halogen-free flame-retardant thermosetting resin composition, the prepared metal-clad laminate can have at least good adhesion, high heat resistance, high glass transition temperature (Tg), flame retardancy, low dielectric constant and loss one of the properties.

Description

technical field [0001] The present disclosure relates to the technical field of printed circuit boards. Specifically, the present disclosure relates to a halogen-free flame-retardant thermosetting resin composition, a prepreg for printed circuits, and a metal-clad laminate. Background technique [0002] Metal-clad laminate is a plate-shaped material made by impregnating electronic glass fiber cloth or other reinforcing materials with resin solution, covering one or both sides with metal foil and hot pressing. It is called metal-clad laminate. It is referred to as a metal-clad laminate or a metal-clad laminate for short, such as a copper-clad laminate or a copper-clad laminate (CCL). Metal-clad laminates such as copper-clad laminates are base laminates for the manufacture of printed circuit boards (Printed Circuit Board, PCB for short), and PCBs are one of the important components of the electronics industry. Almost every kind of electronic equipment, ranging from electroni...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L63/00C08L79/08C08L61/34C08L35/06C08K3/36C08L61/14C08L85/02C08J5/24B32B17/04B32B17/06B32B15/14B32B5/02B32B27/04B32B27/18B32B27/28B32B27/38B32B27/42H05K1/03
CPCC08L63/00C08L79/08C08L35/06B32B5/02B32B5/022B32B15/14H05K1/0353C08L2205/035C08L2201/02C08L2201/22C08J2363/00C08J2379/08C08J2335/06C08J2461/34C08J2463/00C08J2479/08C08J2435/06B32B2250/40B32B2260/021B32B2260/046B32B2262/101B32B2457/08B32B2307/3065B32B2307/306B32B2307/204C08J5/244C08J5/249C08L61/34C08K3/36C08L61/14C08L85/02B32B17/04B32B17/06B32B27/04B32B27/18B32B27/38B32B27/42B32B27/28H05K1/03C08G59/58B32B15/08C08G73/02C08G59/20C08K3/013C08L79/04
Inventor 潘子洲方克洪
Owner GUANGDONG SHENGYI SCI TECH