Copper powder for laser cladding of phosphor copper workpiece and cladding method

Abstract

The invention belongs to the technical field of laser cladding, in particular to a copper powder for laser cladding of phosphor copper workpieces and a cladding method. The copper powder comprises the following components: Sn 2.5-9%, P 0.05-0.6%, Pb 0.01-0.05 %, Ce 0-0.5%, Y 0-1%, Sm 0-0.2%, and the rest are Cu and inevitable impurities. The method includes the following steps: pretreatment on the surface of the workpiece; tin plating on the surface of the workpiece; making a cooling support seat for the workpiece during the cladding process; preparing copper powder for laser cladding of the phosphor bronze workpiece, drying the copper powder; fixing the workpiece on the cooling support seat, The cladding process is cooled, the laser irradiates the cladding position on the surface of the workpiece, and the synchronous powder feeder is used to send copper powder to the cladding position on the workpiece surface to carry out laser cladding on the surface of the workpiece; the surface of the cladding position is sandblasted; the workpiece is processed and formed. The cladding layer of the invention presents metallurgical bonding with the workpiece base material, the structure is compact, and there are no pores and no cracks. The hardness, wear resistance and anticorrosion experiments show that the transition between the cladding layer and the workpiece substrate is natural, the performance is similar, and the curve is stable.

Description

technical field [0001] The invention belongs to the technical field of laser cladding, and particularly relates to a copper powder for laser cladding of phosphor copper workpieces and a cladding method. Background technique [0002] Among the existing phosphor copper surfacing repair technologies, only the laser cladding technology can achieve the metallurgical bonding effect and perform batch processing under the premise of a particularly small heat input. However, in the actual production process, due to the high reflectivity and material properties of copper alloy materials for common semiconductor lasers, the following problems exist in cladding: [0003] 1) Before cladding, the adhesive or absorber applied to increase the absorbance of the substrate enters the molten pool, causing adverse effects; [0004] 2) Before cladding, the surface is pretreated with nickel-based material, which changes the comprehensive performance of the bonding area and the additive part, so t...

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Problems solved by technology

[0005] 3) At the beginning of cladding, in order to reduce the excessive demand for laser energy density, the use of aluminum-based admixtures changes the overall performance of the cladding layer and makes it difficult to control the cladding bead effect;

[0006] 4) During cladding molding, the weld bead is easy to crack due to excessive cooling;

[0007] 5) When cladding is lapped, due to multiple laps, excessive heat accumulation is caused, and the thin-walled substrate is easily deformed;

[0008] 6) After the cladding is completed, the material difference between the cladding layer and the base material is too large, which will cause excessive gradient results in the hardness, wear resistance, corrosion resistance, electrical conductivity, heat conduction and mechanical comprehensive properties of the final workpiece

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