High-performance organic silicon conductive shielding adhesive and preparation method thereof

Abstract

The invention discloses a high-performance organic silicon conductive shielding adhesive and a preparation method thereof. According to the high-performance organic silicon conductive shielding adhesive, vinyl polysiloxane and white carbon black are blended, a blend obtained after silazane treatment is blended and kneaded with single-walled carbon nanotubes, and then thin-passing dispersion is performed through a three-roller machine to prepare a basic adhesive material; and 100 parts by mass of the base rubber material is mixed with 5-15 parts by mass of hydrogen-containing polysiloxane, 0.1-0.5 part by mass of a platinum catalyst, 0.01-0.05 part by mass of an inhibitor, 300-500 parts by mass of a conductive filler and 0-20 parts by mass of an environment-friendly diluent to obtain the high-performance organic silicon conductive shielding adhesive. The volume resistance of the high-performance organic silicon conductive shielding adhesive is less than or equal to 60m Omega.cm, the shielding effectiveness reaches 120dB or above, the tensile strength reaches 4.0 MPa or above, the tensile elongation at break reaches 100%, the tearing strength is greater than 10N/mm, and the high-performance organic silicon conductive shielding adhesive has good adhesion bonding property to materials. The adhesive can be widely applied to occasions such as communication equipment shell sealing electronic products, telecommunication equipment and high-frequency control equipment which require a very wide watertight, airtight or frequency range and require excellent shielding performance and instant sealing of irregular surfaces.

Description

technical field [0001] The invention belongs to the technical field of organosilicon materials, in particular to ultra-low volume resistivity after curing, high shielding efficiency, high strength, good elongation and tear strength, good adhesion to materials, and can be used for bonding communication material shells. A high-performance organic silicon conductive shielding adhesive for joint sealing and sealing of uneven and irregular complex surfaces and a preparation method thereof. [0002] technical background [0003] With the rapid growth of the electronic information industry, the miniaturization and high-performance development of electronic instruments, the number of electronic devices used in the system has increased greatly, and the miniaturization of the equipment has brought the electronic devices very close together, which has a great impact on the electromagnetic interference. Control puts forward higher requirements. Electromagnetic interference often occurs ...

AI Technical Summary

Problems solved by technology

The conductive filler used in patents such as CN104327509A and CN103665875A is acetylene carbon black or other fillers, all of which have the disadvantages of large amount of acetylene carbon black added, poor mechanical properties of conductive silicone rubber, and complicated process.

Patent CN200810060489.6 uses acetylene carbon black as the conductive medium, firstly uses the treatment agent to pretreat the acetylene carbon black, and then cooperates with reinforcing silicone rubber to make conductive silicone rubber material, which can improve the floating of carbon black and is beneficial to the health of operators Healthy, but the processing steps are increased, and there is also pollution in the carbon black treatment stage

None of these conductive silica gels can meet the increasingly complex structure of communication technology communication equipment and the battery shielding requirements of high-frequency communication. The market and technology development needs an urgent need for a high strength and elasticity, ultra-high conductivity, and high shielding efficiency. Dispensing molding conductive adhesive with complex and irregular structure

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