Distributed feedback laser chip and preparation method thereof

A distributed feedback, laser technology, used in lasers, laser parts, semiconductor lasers, etc., can solve the problems of large series resistance of devices, affecting device performance and reliability, and high production costs

Active Publication Date: 2020-10-13
因林光电科技(苏州)有限公司
View PDF3 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Conventional DFB lasers all use masked gratings, which require multiple epitaxial growths. The preparation process is complicated, and the interface of the secondary epitaxial growth is prone to contamination, which seriously affects the performance and reliability of the laser, and the preparation cost is high, which is not conducive to mass production. Production
Some existing DFB lasers use one-time epitaxial growth, and prepare gratings on the surface of the laser through micro-nano processing technology. Since the grating reduces the current injection area, the series resistance of the device is large, and the thermal effect is serious, which seriously affects the performance and reliability of the device.
[0004] Conv

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Distributed feedback laser chip and preparation method thereof
  • Distributed feedback laser chip and preparation method thereof
  • Distributed feedback laser chip and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0041] The present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, but not to limit the present invention. In addition, it should be noted that, for the convenience of description, only some structures related to the present invention are shown in the drawings but not all structures.

[0042] Terms used in the embodiments of the present invention are only for the purpose of describing specific embodiments, and are not intended to limit the present invention. It should be noted that the orientation words such as "up", "down", "left", and "right" described in the embodiments of the present invention are described from the angles shown in the drawings, and should not be interpreted as a reference to the implementation of the present invention. Example limitations. Also in this context, it also nee...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
Sizeaaaaaaaaaa
Sizeaaaaaaaaaa
Login to view more

Abstract

The embodiment of the invention discloses a distributed feedback laser chip and a preparation method thereof. The laser chip comprises a substrate, a laser structure located on one side of the substrate, a first electrode and a second electrode. A grating pattern is arranged on the side, adjacent to the second electrode, of the laser structure, the grating pattern comprises a ridge-shaped structure, the ridge-shaped structure comprises first areas and second areas which are circularly arranged in the first direction, and the refractive index of the first areas is larger than that of the secondareas; the second electrode covers the ridge-shaped structure, extends to partial regions of the second regions and is in contact with a film layer, close to one side of the substrate, of the film layer where the grating pattern is located, wherein the first direction is parallel to the plane where the substrate is located. The technical scheme of the embodiment of the invention has the advantages of high modulation rate, high internal quantum efficiency, low resistance, good single-mode characteristic, small stress, low cost and the like, can greatly improve the modulation rate, the electro-optical conversion efficiency, the single-mode characteristic, the production yield and the like of the laser, and is very beneficial to large-scale production and application.

Description

technical field [0001] Embodiments of the present invention relate to semiconductor laser technology, and in particular to a distributed feedback laser chip and a manufacturing method thereof. Background technique [0002] With the development of high-speed optical communication systems, high transmission rates have become an urgent need for optical fiber transmission systems. Among them, high-speed semiconductor laser chips are the core. Improving the transmission rate of semiconductor laser chips can greatly increase the transmission rate of optical fibers. Distributed Feedback (DFB) laser has good single-mode characteristics and high modulation rate, so it has become a common semiconductor light source for optical fiber communication, and has attracted extensive attention from industry and academia. [0003] For DFB lasers, the recombination rate of the internal carriers determines the modulation rate of the laser to a large extent, and the carriers in the laser mainly un...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): H01S5/12H01S5/22H01S5/042H01S5/343
CPCH01S5/12H01S5/22H01S5/343H01S5/04252
Inventor 刘朝明王涛高磊张峰
Owner 因林光电科技(苏州)有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products