Paste adhesive composition and semiconductor device

Abstract

A paste adhesive composition which contains silver particles and a monomer, and forms a silver particle-linking structure in which the interfaces between the silver particles have been eliminated by aheat treatment, wherein: the silver particles include flake-shaped silver particles and spherical silver particles; and when the paste adhesive composition is heated from a temperature of 30 DEG C to200 DEG C at a temperature increase rate of 10 DEG C / minute, then subjected to a heat treatment at 200 DEG C for 60 minutes, then heated from 200 DEG C to 450 DEG C at a temperature increase rate of10 DEG C / minute, and then subjected to a heat treatment at 450 DEG C for 10 minutes, (W2-W1) / W2 equals 0.20-0.90, inclusive, relative to the paste adhesive composition before heating under the statedmeasurement conditions, when W1(%) is the percentage of the weight loss of the paste adhesive composition after the heat treatment at 200 DEG C for 60 minutes, and W2(%) is the percentage of the weight loss of the paste adhesive composition after the heat treatment at 450 DEG C for 10 minutes. As measurement conditions, the measurement method is a thermogravimetry-differential thermal analysis (TG-DTA) device, and the atmosphere is an atmospheric air environment.

Description

Technical field [0001] The invention relates to a paste adhesive composition and a semiconductor device. Background technique [0002] Conventionally, two types of paste adhesive compositions, adhesive type and sintered type, have been used for the paste adhesive composition used for bonding each part of semiconductor devices and electric and electronic parts. [0003] Adhesive paste adhesive composition is a composition in which conductive metal particles such as silver particles are dispersed in a liquid thermosetting resin. The resin is cured by heating to bond the metal particles to achieve conductivity and heat conduction. Sex. [0004] In the adhesive paste adhesive composition, the adhesiveness and adhesion to the adherend are expressed by curing of the liquid thermosetting resin. In addition, since the paste adhesive composition shrinks due to curing, the frequency of contact between the metal particles is higher than before curing, and the contact points of the metal parti...

AI Technical Summary

Problems solved by technology

On the other hand, when a sintered paste adhesive composition is used as an adhesive, although a monomer remains between the metal particle connection structure formed by heating and the adherend, the monomer is a trace amount. , so sometimes the adhesion between the metal particle bonded structure and the adherend cannot be obtained sufficiently

Moreover, the adhesion between the adherend and the metal particle connection structure is affected by the type or combination of the metal material and the metal particles constituting the adherend, so the material of the adherend has poor compatibility with the metal particles. , there are cases where the adhesion between the adherend and the metal particle connection structure is weak and peeling occurs between them

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