Method for in situ preparation of DLC resistive electrode for large-area microstructure gas detector
A gas detector and in-situ preparation technology, which is applied to instruments, measuring devices, scientific instruments, etc., can solve the problems that DLC resistive electrodes cannot be prepared by in-situ one-time forming, low binding force, and high internal stress, and expand practical applications. , The effect of improving the bonding force and reducing the internal stress
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Embodiment 1
[0026] A new type of DLC resistive electrode for microstructured gas detectors was prepared by using a polyimide film with a size of 600mm×300mm, a thickness of 50±5 microns, and no copper coating on the surface as the electrode substrate.
[0027] Equipment used: see attached figure 1 , there are four sets of heating devices 5 in the vacuum chamber, and four sets of vacuum vapor deposition systems with magnetron sputtering cathodes 1-4 on the chamber wall, of which 1 is equipped with high-purity metal chromium targets, and 2 and 4 are counter-positioned with high-purity graphite targets 3 high-purity metal copper targets; each sputtering target is equipped with a baffle 6 that can control opening and closing. Among them, the purity of high-purity graphite, chromium and copper targets is 99.99%, and the size of the target is 600mm×125mm×12mm.
[0028] The sample turret is a stainless steel orifice cylinder fixed on the rotating shaft, which can facilitate the flexible adjustm...
Embodiment 2
[0036] A new type of DLC resistive electrode for microstructured gas detectors was prepared on the basis of a polyimide film with a size of 1500mm×500mm, a thickness of 50±5 microns, and a single-sided copper coating (the thickness of the copper layer is 5 microns). .
[0037] Equipment used: Same as Example 1, with the same installation position and purity of the sputtering target.
[0038] Process steps for in-situ preparation of DLC resistive electrodes:
[0039] (1) Surface pretreatment of single-sided copper-clad polyimide film: Wipe and clean the surface of the copper-free layer of single-sided copper-clad polyimide film with a dust-free cloth dipped in absolute ethanol to remove dust and other pollutants , shield and protect the copper-clad surface with aluminum foil, clamp it on the sample turntable and place it in the cavity; vacuumize to 5×10 -3 Pa, turn on the heating device in the cavity and bake at 150°C for 7 hours to completely remove residual moisture; then k...
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