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Unsaturated-group-containing alkali-soluble resin, photosensitive resin composition including unsaturated-group-containing alkali-soluble resin as essential ingredient, and cured product of photosensitive resin composition including unsaturated-group-containing alkali-soluble resin as essential ingredient

A photosensitive resin and soluble technology, applied in the field of hardened materials and alkali-soluble resins, can solve the problems of difference in crosslinking density, difficulty in obtaining photosensitive insulating materials, and difficulty in photohardening on the bottom surface of the coating film, achieving low thermal expansion and alkali resistance. Excellent performance and electrical reliability

Pending Publication Date: 2020-11-03
NIPPON STEEL CHEM &MATERIAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, even if photocuring is sufficiently carried out on the surface of the coating film, it is difficult to photocure on the bottom surface of the coating film, so it is obviously difficult to cause a difference in crosslink density between the exposed part and the unexposed part.
Therefore, it is difficult to obtain a photosensitive insulating material that can be developed at high resolution with desired pattern dimensional stability, development margin, pattern adhesion, pattern edge shape, and cross-sectional shape.

Method used

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  • Unsaturated-group-containing alkali-soluble resin, photosensitive resin composition including unsaturated-group-containing alkali-soluble resin as essential ingredient, and cured product of photosensitive resin composition including unsaturated-group-containing alkali-soluble resin as essential ingredient
  • Unsaturated-group-containing alkali-soluble resin, photosensitive resin composition including unsaturated-group-containing alkali-soluble resin as essential ingredient, and cured product of photosensitive resin composition including unsaturated-group-containing alkali-soluble resin as essential ingredient
  • Unsaturated-group-containing alkali-soluble resin, photosensitive resin composition including unsaturated-group-containing alkali-soluble resin as essential ingredient, and cured product of photosensitive resin composition including unsaturated-group-containing alkali-soluble resin as essential ingredient

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0101] (Synthesis of Alkali-Soluble Resin)

[0102] Put 50% PEGMEA solution (337.2g) of NAMMEA (337.2g), THPA (49.1g), TEAB (0.90g) and PEGMEA (5.4g) into a 1000ml four-necked flask with a cooler, and stir at 120°C to 125°C After 6 hours, an alkali-soluble resin (i)-1 was obtained. The solid content concentration of the obtained resin was 56.0 mass %, the acid value (solid content conversion) was 88.0 mgKOH / g, and the molecular weight (Mw) was 1000.

Embodiment 2

[0117] [Evaluation of Photosensitive Resin Compositions of Example 2 and Comparative Example 2]

[0118] The photosensitive resin composition shown in Table 1 was coated on a glass substrate of 125 mm×125 mm using a spin coater so that the film thickness after post-baking would be 30 μm, and prebaked at 110° C. for 5 minutes to prepare a coated sheet. After that, use 500W / cm 2 The high-pressure mercury lamp irradiates ultraviolet light with a wavelength of 365nm to perform photohardening reaction of the exposed part. Next, the coated plate after this exposure is passed through 0.8% by mass tetramethylammonium hydroxide (TMAH) aqueous solution, 23 ℃ of spray development, carry out further development for 30 seconds from the time when the pattern starts to appear, and then carry out spray water washing, remove The unexposed portion of the coating film. Thereafter, using a hot air dryer, heat curing was performed at 230° C. for 30 minutes to obtain the cured films of Example 2 ...

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Abstract

An alkali-soluble resin that is represented by general formula (1) and has a carboxyl group and a polymerizable unsaturated group in each molecule thereof. A photosensitive resin composition that contains: (i) the alkali-soluble resin of general formula (1); (ii) a photopolymerizable monomer that has at least one polymerizable unsaturated group; (iii) a photopolymerization initiator; and (iv) an optional epoxy compound.

Description

technical field [0001] The present invention relates to an alkali-soluble resin containing an unsaturated group, a photosensitive resin composition containing the unsaturated group as an essential component, and a cured product obtained by curing the resin. The photosensitive resin composition of the present invention and its cured product can be suitably used as solder resists, plating resists, resists for circuit board production, insulating films for multilayering of wiring boards on which semiconductor elements are mounted, and semiconductor The gate insulating film, photosensitive adhesive, etc. Background technique [0002] Along with recent improvements in performance and definition of electronic devices and display members, electronic components used therein have been required to be miniaturized and denser. Further, miniaturization and rationalization of cross-sectional shapes of processed patterns are also required for the processability of insulating materials use...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G59/17C08F290/06G03F7/027G03F7/032
CPCG03F7/032G03F7/027C08F290/06G03F7/32
Inventor 滑川崇平高野正臣
Owner NIPPON STEEL CHEM &MATERIAL CO LTD
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