Dual-curing adhesive and preparation method thereof

A dual-curing, adhesive technology, used in adhesives, adhesive additives, epoxy resin adhesives, etc., can solve the problems of difficult curing, poor curing effect, and poor temperature resistance in the deep and shadow areas of the cured adhesive. To achieve the effect of improving the interface bonding effect, excellent water resistance and good curing effect

Inactive Publication Date: 2020-11-06
SHENZHEN EUBO NEW MATERIAL TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of this application is to provide a dual-curing adhesive and its preparation method, aiming to solve the problem of difficulty in curing the deep layer and shadow area of ​​the existing curing adhesive to a certain extent, poor curing effect, high brittleness after curing, and low temperature resistance. poor technical problem

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  • Dual-curing adhesive and preparation method thereof
  • Dual-curing adhesive and preparation method thereof
  • Dual-curing adhesive and preparation method thereof

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preparation example Construction

[0034] The second aspect of the embodiment of the present application provides a method for preparing a dual-curing adhesive, comprising the following steps:

[0035] S10. Taking the total mass of the raw materials of the dual-curing adhesive as 100%, under the condition of no ultraviolet light, 50-70wt% epoxy resin, 10-20wt% toughening resin, 5-10wt% microcapsule epoxy Curing agent, 3-5wt% cationic photoinitiator, 5-20wt% reactive diluent, 0.5-2wt% silane coupling agent, 0.5-1.5wt% hydrophobic material, 3-5wt‰ photosensitizer are mixed to obtain double curing adhesive.

[0036] The preparation method of the dual-curing adhesive provided by the second aspect of the present application, under the condition of no ultraviolet light, by mixing the epoxy resin, toughening resin, microcapsule epoxy curing agent, cationic photoinitiator, active The diluent, the silane coupling agent, the hydrophobic material and the photosensitizer are mixed to form a mixed slurry to obtain a dual-c...

Embodiment 1

[0070] A dual curing adhesive comprising the following preparation methods:

[0071] 1. Preparation of microcapsule epoxy curing agent:

[0072] ① Add 4g of 2-methylimidazole and deionized water into a 250ml flask, stir and dissolve at 80°C (water bath), until the 2-methylimidazole is completely dissolved and becomes clear and transparent; slowly add 6g of PAA until PAA is completely reacted, The solution is a light yellow transparent colloid, and the PAA-2MI aqueous solution is obtained;

[0073] ②Make Span-80 and liquid paraffin into 2% emulsifier solution;

[0074] ③Add 11.5g of emulsifier solution to the PAA-curing agent aqueous solution, and stir and emulsify at a high speed of 50000r / min for 15min;

[0075] ④ After ultrasonically dispersing 1.5g of tetrabutyl titanate and liquid paraffin, add it to the above emulsion, and continue to emulsify at 50000r / min at high speed for 30min;

[0076] ⑤ After emulsification, pour it into a single-necked flask, distill it under re...

Embodiment 2

[0082] A dual curing adhesive comprising the following preparation methods:

[0083] 1. Preparation of microcapsule epoxy curing agent:

[0084] ①Add 5g of diethylenetriamine and deionized water into a 250ml flask, stir and dissolve at 80°C (water bath), until the diethylenetriamine is completely dissolved and becomes clear and transparent; slowly add 6g of PAA until PAA is completely reaction, the solution is a light yellow transparent colloid, and the PAA-2MI aqueous solution is obtained;

[0085] ②Make Span-80 and liquid paraffin into 2% emulsifier solution;

[0086] ③Add 13.5g of emulsifier solution to PAA-curing agent aqueous solution, stir and emulsify at high speed at 4800r / min for 20min;

[0087] ④After ultrasonically dispersing 2g of tetrabutyl titanate and liquid paraffin, add it to the above emulsion, and continue to emulsify at 48000r / min at high speed for 35min;

[0088] ⑤ After emulsification, pour it into a single-necked flask, distill it under reduced pressu...

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Abstract

The invention belongs to the technical field of adhesives, in particular to a dual-curing adhesive. According to the fact that the total mass of the raw materials of the dual-curing adhesive is 100%,the dual-curing adhesive comprises 50 to 70 wt% of epoxy resin, 10 to 20 wt% of toughening resin, 5 to 10 wt% of a microcapsule type epoxy curing agent, 3 to 5 wt% of a cationic photoinitiator, 5 to 20 wt% of an active diluent, 0.5 to 2 wt% of a silane coupling agent, 0.5 to 1.5 wt% of a hydrophobic material and 0.3 to 0.5 wt% of a photosensitizer. The dual-curing adhesive has dual-curing effectsof light curing and heat curing, and can form a more stable network structure so that the interface bonding effect is improved, and the cured adhesive has excellent water resistance and gas resistance, and meanwhile, the temperature resistance is improved.

Description

technical field [0001] The application belongs to the technical field of adhesives, and in particular relates to a dual-curing adhesive and a method for preparing the dual-curing adhesive. Background technique [0002] Photocuring technology is to select a light source with appropriate wavelength intensity to irradiate the adhesive to activate it after absorbing light energy, trigger polymerization and crosslinking reactions, and make the liquid adhesive polymerize at a high speed to form a solid state. Compared with thermal polymerization, photopolymerization is simple and convenient, and the reaction is fast and efficient. UV-curable adhesives are widely used in the fields of optics, electronic appliances, and digital discs because of their remarkable characteristics such as fast curing, good compatibility, high strength, and environmental protection. However, at present, the curing of UV-curable adhesives is limited to the parts exposed to light, and it is difficult to e...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/02C09J163/00C09J11/04C09J11/08C09J11/06C08G59/50
CPCC08G59/5006C08G59/5073C08K2201/006C08K2201/011C08L2205/025C08L2205/03C09J11/04C09J11/06C09J11/08C09J163/00C08L63/00C08K7/26C08K5/5435
Inventor 李刚岳风树杨丽芳杨斌翟月勇岳树伟
Owner SHENZHEN EUBO NEW MATERIAL TECH
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