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A kind of tungsten-copper alloy material and its preparation method and application

A tungsten-copper alloy and alloy technology, which is applied in the field of tungsten-copper alloy materials and their preparation, can solve the problems of fusion of MIM raw materials, difficulty in satisfying the thermal conductivity and expansion coefficient of tungsten-copper alloys, and inability to weld valve alloys together. The effect of skeleton morphology, high production efficiency and high product quality

Active Publication Date: 2022-02-11
昆山家锐电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] Although the technical problems existing in the traditional process can be solved by the metal powder injection molding process, the existing tungsten-copper alloy materials used for transmitting 400G signal optical communication modules in the 5G field still have at least the following problems: 1. The problem of the fusion of MIM raw materials ; 2. It cannot be welded well with valveable alloy (4J29); 3. The thermal conductivity and expansion coefficient of tungsten-copper alloy are difficult to meet the needs of 400G signal optical communication modules in the 5G field

Method used

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  • A kind of tungsten-copper alloy material and its preparation method and application
  • A kind of tungsten-copper alloy material and its preparation method and application
  • A kind of tungsten-copper alloy material and its preparation method and application

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Effect test

Embodiment 1

[0027] A kind of tungsten-copper alloy material comprises the following components by weight (percentage):

[0028]

[0029]

[0030] A preparation method of the above-mentioned tungsten-copper alloy material, comprising the following steps:

[0031] (1) Heat 56 parts by weight of polystyrene, 23 parts by weight of methyl cellulose and 22 parts by weight of mineral oil in a closed container to 110 ° C and mix and stir for 2 hours to obtain a wax-based binder; tungsten powder, Copper powder, silver and silicon according to the above dosage ratio, through ball milling (rotating speed 800rpm, time 4h) to obtain sub-micron-based powder particles; then sub-micron-based powder particles and wax-based binder are mixed evenly at a volume ratio of 12:88 ;

[0032] (2) Banbury the mixture of the above-mentioned submicron-based powder particles and wax-based binder at 98° C. for 6 hours to obtain granular tungsten-copper materials;

[0033] (3) Design a near-net shape injection m...

Embodiment 2

[0040] A tungsten-copper alloy material, comprising the following components by weight:

[0041]

[0042] The preparation method of the tungsten-copper alloy material in this embodiment is the same as that in Embodiment 1.

[0043] The performance testing method of the tungsten-copper alloy in this embodiment is the same as that in Embodiment 1.

[0044] After measurement, the real density of the tungsten-copper alloy material obtained in this embodiment is 15.32g / cm 3 , the hardness is 272HV, and the thermal conductivity is 158W·M -1 ·K -1 , the coefficient of thermal expansion is 8.68 (10 -6 / °C).

[0045] The tungsten-copper alloy material in this embodiment is used to prepare a module capable of transmitting 400G signals in the field of 5G optical communication. When copper alloy and Kovar alloy are welded to each other, the shear force on the welding surface is 26KG.

Embodiment 3

[0047] A tungsten-copper alloy material, comprising the following components by weight:

[0048]

[0049] The preparation method of the tungsten-copper alloy material in this embodiment is the same as that in Embodiment 1.

[0050] The performance testing method of the tungsten-copper alloy in this embodiment is the same as that in Embodiment 1.

[0051] After measurement, the real density of the tungsten-copper alloy material obtained in this embodiment is 15.33g / cm 3 , the hardness is 285HV, and the thermal conductivity is 167W·M -1 ·K -1 , the coefficient of thermal expansion is 8.75 (10 -6 / °C).

[0052] The tungsten-copper alloy material in this embodiment is used to prepare a module capable of transmitting 400G signals in the field of 5G optical communication. When copper alloy and Kovar alloy are welded to each other, the shear force on the welding surface is 32KG.

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Abstract

The invention discloses a tungsten-copper alloy material for an optical communication module transmitting 400G signals in the 5G field, which comprises the following components in parts by weight: 78.6-81.2 parts of tungsten; 18.6-21.10 parts of copper; 0.02-0.25 parts of silver; 0.15‑0.23 parts. The present invention also provides a method for preparing the above-mentioned tungsten-copper alloy material, which includes the following steps: mixing tungsten, copper, silver, silicon and a wax-based binder, making particles through banburying, near-net shape injection molding, The tungsten-copper alloy material can be obtained after debonding by extraction and sintering. The present invention also provides an application of the above-mentioned tungsten-copper alloy material. The invention continuously adjusts the composition of the tungsten-copper alloy, so that the tungsten-copper alloy and the Kovar alloy (4J29) can achieve good mutual welding, and the thermal conductivity and thermal expansion coefficient can meet the material requirements of the optical communication module.

Description

technical field [0001] The invention belongs to the field of alloy materials, and in particular relates to a tungsten-copper alloy material and a preparation method and application thereof. Background technique [0002] In recent years, the communication industry has developed rapidly, and the 5G network era has arrived, but any 5G optical fiber communication requires a 5G optical communication module. Before the application of 400G signal optical communication modules, such as 20G, 40G, and 100G optical communication modules were implemented with Kovar alloy or Kovar alloy assisted by W70Cu. When it reached 400G, W70Cu material could no longer meet the transmission requirements. [0003] At present, the tungsten-copper alloy material products required for launching 400GQSFP-DDER4-Lite signal optical communication modules in the 5G field are produced by traditional processes. The process route is as follows: 1. Metal smelting to make plates; 2. Plate sawing machine blanking;...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C22C27/04C22C1/05C22C1/10
CPCC22C27/04C22C1/05
Inventor 陈明喜
Owner 昆山家锐电子科技有限公司
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