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A stepping high-precision photolithography machine

A high-precision, lithography technology, applied in the field of lithography, can solve the problems of temperature change, image etching prone to errors, etching accuracy prone to errors, etc., to achieve the effect of ensuring accuracy and etching accuracy

Active Publication Date: 2022-06-07
福建安芯半导体科技有限公司
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  • Abstract
  • Description
  • Claims
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Problems solved by technology

[0004] Existing lithography machines are prone to temperature changes of the objective lens, reticle, and mask table under the laser beam, which easily causes errors in the etching of the image. At the same time, each working module of the lithography machine is prone to frequency conversion. Therefore, it is urgent to develop a step-by-step high-precision lithography machine capable of fast frequency conversion and precise etching.

Method used

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  • A stepping high-precision photolithography machine
  • A stepping high-precision photolithography machine

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Embodiment Construction

[0024] In this technical solution:

[0025] see figure 1 , figure 2 , The present invention provides a step-by-step high-precision lithography machine, including a workbench, a laser, a beam corrector, an energy controller, an energy detector, a beam shape setting, a shutter, a reticle, a mask table, an objective lens, Wafers, Enclosed Frames, Vibration Dampers, Temperature Controls, Adjusters, and Consoles; Stages, Beam Shape Settings, Shutters, Energy Detectors, Reticles, Mask Stages, Objectives, Silicon Wafers, Temperature Controls, The adjuster is set in the closed frame; the energy controller, laser, beam corrector, and console are set outside the closed frame; the bottom of the closed frame is provided with a shock absorber; the energy detector, shutter, beam shape setting, energy controller, The beam corrector is located on the same horizontal line and is arranged in sequence from left to right; the laser is matched with the energy controller through the beam correct...

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Abstract

The invention belongs to the technical field of lithography machines, in particular to a step-by-step high-precision lithography machine, which includes a workbench, a laser, a beam corrector, an energy controller, an energy detector, beam shape settings, etc.; a laser, a beam corrector The device, energy controller, and console are set outside the closed frame; the bottom of the closed frame is provided with a shock absorber; the energy detector, light shield, beam shape setting, energy controller, and beam corrector are located on the same horizontal line, and from left to The right is set in turn, etc.; the present invention adjusts the temperature difference between the objective lens, the reticle, and the mask table in time through the temperature control device; the frequency conversion of the signal in the closed frame is made through the tuner; Dead or loose, so that the objective lens can be adjusted, so as to prevent the expansion or contraction of the objective lens under the irradiation of the laser beam, so that the etched pattern can be achieved accurately, so that it can achieve a fast frequency conversion and precise etching Effect.

Description

technical field [0001] The invention belongs to the technical field of lithography machines, and particularly relates to a stepping type high-precision lithography machine. Background technique [0002] With the continuous progress of integrated circuit manufacturing technology and the continuous reduction of line width, the area of ​​semiconductor devices is becoming smaller and smaller. The layout of semiconductors has evolved from ordinary single-function separation devices to integrated high-density multi-function devices. Integrated circuits; from the initial IC (Integrated Circuit) to LSI (Large Scale Integrated Circuit), VLSI (Very Large Scale Integrated Circuit), until today's ULSI (Ultra Large Scale Integrated Circuit), the area of ​​the device is further reduced and the functions are more comprehensive powerful. [0003] Considering the constraints of unfavorable factors such as the complexity, long-term and high cost of process research and development, how to fu...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/20
CPCG03F7/70241G03F7/70875G03F7/70733G03F7/70858
Inventor 李俊毅姚恒裕陈舜钦
Owner 福建安芯半导体科技有限公司
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