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Preparation method of radio frequency chip type multilayer ceramic capacitor

A technology of multilayer ceramics and capacitors, which is applied in the direction of laminated capacitors, capacitors, fixed capacitors, etc., can solve the problems of high cost, and achieve the effect of easy oxidation, low price and low resistivity

Inactive Publication Date: 2020-11-13
四川华瓷科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] The purpose of the present invention is to provide a preparation method of radio frequency chip multilayer ceramic capacitors, to solve the performance problem that the existing nickel electrode chip multilayer ceramic The problem of high cost of using precious metal materials as internal electrodes and terminal electrodes in layer ceramic capacitors

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  • Preparation method of radio frequency chip type multilayer ceramic capacitor
  • Preparation method of radio frequency chip type multilayer ceramic capacitor
  • Preparation method of radio frequency chip type multilayer ceramic capacitor

Examples

Experimental program
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Embodiment 1

[0050] Such as Figure 1-Figure 2 , Figure 7 As shown, a method for preparing a radio frequency chip multilayer ceramic capacitor includes preparing porcelain slurry, casting dielectric diaphragm, printing copper electrodes, alternating dislocation lamination, lamination, cutting lamination, debinding, firing, pouring Angle, capping, burning end and electroplating preparation process, specifically include the following steps:

[0051] S1. Prepare a high-frequency ceramic slurry, and tape-cast the high-frequency ceramic slurry into a ceramic medium, and the high-frequency ceramic slurry is a Sr-Ca-Zr-Ti series ceramic material;

[0052] S2. Printing copper electrode paste on ceramic medium to prepare a laminate, the solid content of the copper electrode paste is 50% to 60%, wherein copper accounts for 85% of the solid content, and the amount of inorganic substances added accounts for 15%:

[0053] S21, printing the copper electrode paste on the ceramic medium to obtain a membr...

Embodiment 2

[0065] This embodiment is based on embodiment 1, and the difference with embodiment 1 is:

[0066] The debinding method is 450°C nitrogen atmosphere protection debinding, and the nitrogen atmosphere protection debinding is 450°C nitrogen protection debinding, wherein, 220°C-450°C debinding takes 8 hours (220°C to 450°C heating process takes 8 hours ), held at 450°C for 3 hours, and the debinding curve under nitrogen protection is as follows Figure 5 Shown; nitrogen atmosphere protection after debinding laminated body sintering at 750 ℃ ​​for 1.5 hours, the firing curve after nitrogen protection debinding is as follows Image 6 shown.

[0067] In this embodiment, the debinding temperature can be increased to 450°C through nitrogen protection, and the organic matter in the ceramic body is mainly eliminated by pyrolysis, so that the carbon residue in the ceramic is less, but this debinding method requires special atmosphere debinding equipment ; When the laminate is sintered, ...

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Abstract

The invention discloses a preparation method of a radio frequency chip type multilayer ceramic capacitor. The preparation method comprises the following steps: S1, carrying out tape casting on high-frequency ceramic slurry to form a ceramic medium; S2, printing copper electrode slurry on the ceramic medium to prepare a laminated body; S3, removing glue from a ceramic medium film in air at the temperature of 450 DEG C or below, grinding the ceramic dielectric film into powder, and sintering the powder to obtain film powder; S4, discharging glue from the laminated body, scattering a layer of uniform film powder to the bottom and the surface of the laminated body during glue discharging, and the glue discharging mode being air glue discharging or nitrogen glue discharging; S5, sequentially sintering and chamfering the laminated body to obtain the radio frequency ceramic chip; and S6, coating the two ends of the radio frequency ceramic chip with Cu external electrode slurry, then burning the end, and carrying out electroplating to manufacture an external electrode, thereby obtaining the radio frequency chip type multilayer ceramic capacitor. According to the invention, the problem thatan existing nickel electrode sheet type multilayer ceramic capacitor cannot meet the performance requirement of working at a higher frequency is solved, and the problem that the cost is high becausethe silver / palladium sheet type multilayer ceramic capacitor adopts noble metal materials as the inner electrode and the end electrode is solved.

Description

technical field [0001] The invention relates to the technical field of radio frequency capacitors, in particular to a method for preparing radio frequency chip multilayer ceramic capacitors. Background technique [0002] Chip multilayer ceramic capacitors MLCC are widely used in various electronic products such as communications, home appliances, computers and peripherals, automotive electronics, industrial control, and lighting. In recent years, the upgrading of the communication industry has driven the rapid development of a series of communication industry chains, especially in terms of communication terminals, and the continuous upgrading of smart phones has greatly stimulated the demand for MLCC. With the promotion of the 5G market, the demand for chip multilayer ceramic capacitors for radio frequency circuits is also rising. At present, the production of RF chip multilayer ceramic capacitors in the market mainly uses noble metal materials as the internal electrodes an...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01G4/12H01G4/008H01G4/232H01G4/30
CPCH01G4/0085H01G4/12H01G4/2325H01G4/30
Inventor 曾雨梁丽倪福松孔令峰董强李聪
Owner 四川华瓷科技有限公司
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