33results about How to "Solve the problem of high loss" patented technology

The invention relates to a substrate integrated gap waveguide coupler design method. A coupler structure is formed by the close connection of an upper dielectric plate (5) and a lower dielectric plate(6). The upper surface of the upper dielectric plate (5) is provided with a grounding metal layer through printing, and the lower surface of the upper dielectric plate (5) is provided with a couplingmicrostrip line (13) through printing. The upper surface of the lower dielectric plate (6) is provided with an H-shaped coupling microstrip line (12) through printing, and the H-shaped coupling microstrip line (12) and a metal via hole (11) form an H-bridge transmission ridge. Two sides of the H-bridge transmission ridge are each provided with a first EBG structure array (9), and the center of the H-bridge transmission ridge is provided with a second EBG structure array (10), wherein the lower surface is printed with a metal layer. The method provided by the invention is improved from the theoretical basis of a microstrip branch line coupler. The waveguide coupler is easy for integration, is small in size, is wide in bandwidth, is small in loss, and is higher in isolation degree.

The invention belongs to the technical field of multi-material and multi-structure mid-infrared optical fiber preparation, and more particularly, relates to a low-cost batch preparation method and system of a mid-infrared optical fiber with an adjustable material and structure. The structure design of a crucible is used to realize control of a fiber shape, a double crucible method is used to makean initial preform, and the initial preform is used as a base structure to prepare a multi-material and multi-structure mid-infrared optical fiber preform by combination with a high-performance polymer film winding method, and a batch of highly-flexible, multi-material, multi-structure, and low-loss mid-infrared optical fibers are prepared by using a hot drawing method, so that the problem of core-cladding interface defects, impurity introduction, and tedious preparation process when chalcogenide glass fibers are prepared by the existing optical fiber hot drawing method is solved, and the problem of single structure, limited materials, uncontrollable core-cladding ratio, and high cost caused by high use amount of chalcogenide glass when chalcogenide glass fibers are prepared by the existing double crucible method is solved.

The invention provides a relay control circuit. The relay control circuit includes a power supply module, an absorbing module, a reset module, a control module, a first driving module and a second driving module, wherein the power supply module outputs a power signal; the absorbing module absorbs the peak leakage inductance voltage generated when a coil is turned off; the reset module reduces thecurrent passing by the coil and the peak leakage inductance energy generated when the coil is turned off after the relay is started, so as to reset the coil; the control module outputs a first switchcontrol signal and a second switch control signal; the first driving module turns on the coil according to the first switch control signal to control the start of the relay, and is turned off according to the first switch control signal after the relay is started; the second driving module is activated according to the second switch control signal after the relay is started, so as to enable the relay to maintain in a working state; and after the relay is started, the current passing by the coil is controlled to be reduced through the second driving module and the reset module to maintain the startup state, thereby saving the energy being unnecessary to consume after the relay is started.

The invention discloses a preparation method of a radio frequency chip type multilayer ceramic capacitor. The preparation method comprises the following steps: S1, carrying out tape casting on high-frequency ceramic slurry to form a ceramic medium; S2, printing copper electrode slurry on the ceramic medium to prepare a laminated body; S3, removing glue from a ceramic medium film in air at the temperature of 450 DEG C or below, grinding the ceramic dielectric film into powder, and sintering the powder to obtain film powder; S4, discharging glue from the laminated body, scattering a layer of uniform film powder to the bottom and the surface of the laminated body during glue discharging, and the glue discharging mode being air glue discharging or nitrogen glue discharging; S5, sequentially sintering and chamfering the laminated body to obtain the radio frequency ceramic chip; and S6, coating the two ends of the radio frequency ceramic chip with Cu external electrode slurry, then burning the end, and carrying out electroplating to manufacture an external electrode, thereby obtaining the radio frequency chip type multilayer ceramic capacitor. According to the invention, the problem thatan existing nickel electrode sheet type multilayer ceramic capacitor cannot meet the performance requirement of working at a higher frequency is solved, and the problem that the cost is high becausethe silver/palladium sheet type multilayer ceramic capacitor adopts noble metal materials as the inner electrode and the end electrode is solved.

The invention discloses a surface acoustic wave filter. The surface acoustic wave filter comprises a piezoelectric substrate, a plurality of resonators, and a plurality of coupling capacitors, wherein the resonators and the coupling capacitors are integrated on the piezoelectric substrate; the coupling capacitors are connected in series between the input port and the output port; the resonator is connected in parallel between a connection node of the coupling capacitor and a ground potential; and the coupling capacitor and the resonator are connected in series, in parallel and the like to form the surface acoustic wave filter, transmission of specific frequency signals is completed, and the function of the filter is achieved. Herein, a plurality of coupling capacitors are connected in series in the filter, so that the problem of high loss caused by series connection of a plurality of resonators in a conventional filter is solved; the coupling capacitors are relatively easy to prepare, the process difficulty is reduced, the size of the coupling capacitors is smaller than that of conventional resonators formed by interdigital electrodes and reflecting gratings, and miniaturization is facilitated.

The invention relates to a micro-element feeder, which includes a housing, and a conveying paper belt for transferring micro-elements is arranged above the housing, and a support extending along the conveying direction of the paper tape for supporting the conveying paper tape is arranged in the housing One side of the housing is provided with a material rack for installing paper rolls, and a row of transmission holes and a row of micro-component placement grooves are provided on the transmission paper belt. The transmission holes and the placement grooves are both along the transmission direction of the transmission paper belt. Extend and arrange in sequence at equal intervals; there are transmission gears rotating at intervals in the housing, the rotation direction of the transmission gear is the same as the transmission direction of the transmission paper belt, and the tooth tips of the transmission gears are inserted into the transmission holes of the transmission paper belt in turn and It is transmitted forward at a constant speed and at equal intervals, and a suction device for micro components is installed above the placement groove. In the transmission gap, the suction device sucks and transfers the micro components. The present invention uses multiple groups of gears for transmission, which ensures the smoothness and stability of the transmission process.

The low-profile dielectric antenna comprises a low-profile radiation patch structure, a middle-layer dielectric substrate and a bottom-layer dielectric substrate which are sequentially arranged from top to bottom, gap structures are arranged on the two opposite end faces of the low-profile radiation patch structure, silver coatings are arranged in the gap structures, and the silver coatings are arranged on the middle-layer dielectric substrate and the bottom-layer dielectric substrate. A metal bottom plate plane layer is arranged between the middle-layer dielectric substrate and the bottom-layer dielectric substrate, a linear coupling gap is formed in the middle of the metal bottom plate plane layer, a microstrip feeder line structure is arranged at the bottom of the bottom-layer dielectric substrate, the metal bottom plate plane layer and the microstrip feeder line structure form a feed structure, and the metal bottom plate plane layer is connected with the microstrip feeder line structure. The antenna has the characteristics of miniaturization, low power consumption and temperature stability.

The invention discloses an automatic forming device for a bendable plastic straw. The automatic forming device comprises a rack, wherein a working face is arranged on the rack, a hopper assembly usedfor feeding and a material collecting assembly used for collecting materials are arranged at two ends of the rack correspondingly, a material taking assembly used for taking materials is arranged on the rack, a material collecting hopper is connected to the material collecting assembly, a guide rail assembly is arranged on the working face, the guide rail assembly extends in the direction of a connecting line between the hopper assembly and the material collecting assembly, a molding assembly used for molding a bent pipe is arranged on the guide rail assembly, and the molding assembly is located between the hopper assembly and the material collecting assembly and can mold the bent pipe while doing reciprocating motion between the hopper assembly and the material collecting assembly. According to the device, straw bulges are reduced, loss of molding needles is reduced, molding parameters can be rapidly adjusted for the straws with different pipe diameters, and the yield of products is increased.