Method for treating abrasive particle-containing waste

A technology of abrasive grains and waste materials, which is applied in the field of waste materials containing abrasive grains, can solve problems such as waste, and achieve the effect of purifying and optimizing the surface state of abrasive grains
CN112010300AActive Publication Date: 2020-12-01LUOYANG CSI PHOTOVOLTAIC TECH CO LTD
10 Cites 0 Cited by

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
LUOYANG CSI PHOTOVOLTAIC TECH CO LTD
Publication Date
2020-12-01

Smart Images

  • Figure 1
    Figure 1
  • Figure 2
    Figure 2
Patent Text Reader

Abstract

The invention discloses a method for treating abrasive particle-containing waste. The method comprises the following steps: obtaining an abrasive particle-containing waste solution, and fixing abrasive particles on the surface of a fretsaw; filtering out first impurities in the waste solution through a filter screen, and obtaining a first abrasive particle solution, wherein the average particle size of the first impurities is larger than that of the abrasive particles; carrying out ultrasonic treatment on the first abrasive particle solution to peel off second impurities on the surfaces of abrasive particles, and removing the second impurities from the first abrasive particle solution to obtain a second abrasive particle solution; and carrying out surface active treatment on the abrasive particles in the second abrasive particle solution by adopting an active agent, and extracting the abrasive particles. By means of the method, the purpose of purifying and optimizing the surface stateof the diamond can be achieved so that the recycled diamond micro-powder can be reused, the utilization rate is increased, and the sanding capacity and uniformity can be further improved.
Need to check novelty before this filing date? Find Prior Art

Description

technical field

[0001] The invention relates to the field of silicon wafer cutting, and relates to a method for processing wastes containing abrasive particles. Background technique

[0002] At present, for the silicon wafer cutting industry, due to the advantages of high efficiency, high output and low cost of diamond wire, diamond wire cutting wafers have developed rapidly. Therefore, the demand for electroplated diamond wire in the silicon wafer cutting industry has also greatly increased. Therefore, the main raw material diamond powder produced by electroplated diamond wire is also in short supply.

[0003] Diamond micropowder is a very important raw material in the production process of electroplated diamond wire. The properties of diamond micropowder determine the final cutting performance of electroplated diamond wire. Therefore, the treatment of diamond micropowder is very important for the production of electroplated diamond wire. According to the actual investigat...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More