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High temperature resistant glue and its preparation method and application

A high-temperature-resistant adhesive and polymer resin technology, applied in adhesives, non-polymer adhesive additives, device parts, etc., can solve the problem of uncontrollable volatilization speed of inorganic adhesive, uncontrollable flatness of adhesive layer, low mechanical strength, etc. problems, achieve good thixotropy and stability, controllable drying time, and simplify the production process steps

Active Publication Date: 2022-06-24
SHENZHEN ZHENHUA FU ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The object of the present invention is to provide a high temperature resistant glue and its preparation method to solve the problems of low temperature resistance, low mechanical strength and uncontrollable flatness of the glue layer in the existing organic glue used in the preparation of piezoelectric actuator stacks, or The technical problem that the volatilization speed of the existing inorganic glue is uncontrollable

Method used

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  • High temperature resistant glue and its preparation method and application
  • High temperature resistant glue and its preparation method and application
  • High temperature resistant glue and its preparation method and application

Examples

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preparation example Construction

[0047] Correspondingly, based on the above-mentioned high temperature resistant adhesive, the embodiment of the present invention also provides a preparation method of high temperature resistant adhesive. The technological process of the preparation method of described high temperature resistant glue is as follows figure 1 shown, it includes the following steps:

[0048] S01: Measure each component according to the formula of the high temperature resistant adhesive;

[0049] S02: Dissolve the polymer resin and slurry auxiliary in an organic solvent to prepare an organic carrier solution;

[0050] S03: mixing the measured glass particles and the organic carrier solution to prepare a pre-dispersed slurry;

[0051] S04: grinding the pre-dispersed slurry.

[0052] In this way, the preparation method of the high temperature resistant adhesive mixes and grinds the organic carrier and the glass particles according to the components contained in the high temperature resistant adhes...

Embodiment 1

[0063] This embodiment provides a high temperature resistant adhesive and a preparation method thereof. The high temperature resistant adhesive comprises an organic carrier and glass particles dispersed in the organic carrier, and the content of the glass particles in the high temperature resistant adhesive is 60wt%;

[0064] Wherein, taking the total weight of the organic carrier as 100%, it includes the following components:

[0065] Terpineol 63%, Butyl Carbitol Acetate 17%, Alcohol Ester Twelve 10%, Polyvinyl Butyral 6.5%, Ethyl Cellulose 2%, Polymer Defoamer 0.2%, Dispersant Byk110 It is 0.5%, and the organic bentonite thixotropic agent is 0.8%.

[0066] The preparation method of the high temperature resistant adhesive comprises the following steps:

[0067] S11. Preparation of organic carrier: add each component into a three-necked flask according to the components and contents of the organic carrier contained in the high temperature resistant adhesive described in thi...

Embodiment 2

[0071] This embodiment provides a high temperature resistant adhesive and a preparation method thereof. The high temperature resistant adhesive comprises an organic carrier and glass particles dispersed in the organic carrier, and the content of the glass particles in the high temperature resistant adhesive is 64wt%;

[0072] Wherein, taking the total weight of the organic carrier as 100%, it includes the following components:

[0073] Butyl carbitol 62%, butyl carbitol acetate 22.2%, dioctyl phthalate 5%, polyvinyl butyral 7%, ethyl cellulose 2%, polymer defoamer 0.2 %, the dispersant Byk110 is 0.4%, and the organic bentonite thixotropic agent is 1.2%.

[0074] The preparation method of the high temperature resistant adhesive comprises the following steps:

[0075] S11. Preparation of organic carrier: according to the components and contents of the organic carrier contained in the high temperature resistant adhesive described in this example, each component was added to a t...

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Abstract

The invention discloses a high-temperature-resistant adhesive, a preparation method and application thereof. The high temperature resistant glue shown includes an organic vehicle and glass particles dispersed in the organic vehicle, and the content of the glass particles in the high temperature resistant glue is 50-70wt%; wherein, the total weight of the organic vehicle is 100 %, the organic vehicle includes the following components: organic solvent 85-90wt%, polymer resin 8-13wt%, slurry additive 0-2wt%. The high temperature resistant adhesive of the present invention has high temperature resistance and mechanical strength, good interface bonding, and adjustable volatilization speed, smooth film formation, good thixotropy and stability, and can be compatible with various technological requirements, especially suitable for adhesive bonding Fabrication of the piezoelectric actuator stack. In addition, the process conditions of the preparation method of the high temperature resistant glue are controllable, the preparation efficiency is high, the cost is low, the performance is stable, and it is suitable for industrial production.

Description

technical field [0001] The invention belongs to the technical field of electronic bonding packaging materials, and particularly relates to a high temperature resistant adhesive and a preparation method and application thereof. Background technique [0002] Longitudinal piezoelectric actuator is a kind of component that uses inverse piezoelectric effect to control the mechanical deformation of piezoelectric body through electric field to generate longitudinal linear motion. It is widely used in aviation technology, measurement technology, precision machining, medical equipment and other fields. At present, the most widely used longitudinal piezoelectric actuators are large stroke actuator stacks with heights greater than 10mm. Among them, a discrete stack made by bonding a plurality of chip drivers together by glue is one of the most common structures. [0003] However, the traditional method usually uses an organic glue such as epoxy resin as the bonding layer, which is lim...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J129/14C09J101/28C09J11/04H01L41/02
CPCC09J129/14C09J11/04C08L2201/08C08L2203/20H10N30/80C08L1/28C08K3/40
Inventor 程晨张婷阮天新肖倩朱建华施威熊晓磊
Owner SHENZHEN ZHENHUA FU ELECTRONICS
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