Connecting structure of cable and PCB, plug assembly adopting connecting structure and preparation method of plug assembly
A PCB circuit board and connection structure technology, applied in the direction of line/collector components, circuits, connections, etc., can solve the problems of increased labor costs, manual arrangement, unfavorable promotion and application, etc., to ensure product yield and shorten processing time , the effect of improving production efficiency
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
preparation example Construction
[0086] In another specific embodiment, the present invention provides a method for preparing a plug assembly, and the method for preparing includes the following steps:
[0087] (1) The terminal mounting part 210 and the second golden finger 223 of the PCB circuit board 220 are welded and fixed one by one;
[0088] (2) Strip the insulating sheath 114, the shielding layer 113 and the insulator 112 at the front end of the cable 110 from outside to inside in order to expose the internal wires 111, and arrange the wires 111 side by side with the first golden finger 221 of the PCB circuit board 220. - Welding fixed;
[0089] (3) if figure 1 As shown, next to the exposed end of the wire 111 of the cable 110, continue to peel off the insulation sheath 114 of the cable 110 along the length direction of the cable 110, strip the insulation sheath 114 of the cable 110, and expose the inner shielding layer 113, the cable After 110 are connected side by side, UV conductive adhesive 230 i...
Embodiment 1
[0096] The UV conductive adhesive 230 used in step (3) and step (4) of the above preparation method includes nano-silver powder (conductive agent), carbon black (anti-reflection agent), polyurethane acrylate prepolymer (prepolymer), acrylic iso Bornyl ester (reactive diluent), hydroxyethyl methacrylate (reactive diluent), 1-hydroxy-cyclohexyl-phenyl ketone (photoinitiator), benzoin dimethyl ether (photoinitiator), p-methyl Oxyphenol (stabilizer), polyacrylate (leveling agent), phosphate ester (defoamer) and γ-aminopropyltriethoxysilane (coupling agent).
[0097] The mass fractions of the above components are as follows:
[0098]
[0099]
[0100] The UV conductive adhesive 230 with the above components was photocured by irradiating ultraviolet light for 10 seconds.
Embodiment 2
[0102]The UV conductive glue 230 adopted in step (3) and step (4) in the above-mentioned preparation method comprises nano-silver powder (conductive agent), carbon black (anti-reflection agent), polyurethane acrylate prepolymer (prepolymer), 1, 6-hexanediol diacrylate (reactive diluent), vinyl ether (reactive diluent), aromatic sulfur salt (photoinitiator), benzophthalide ketal (photoinitiator), hydroquinone (stabilizer ), cellulose acetate butyrate (leveling agent), fatty acid ester (defoamer) and γ-aminopropyltriethoxysilane (coupling agent).
[0103] The mass fractions of the above components are as follows:
[0104]
[0105]
[0106] The UV conductive adhesive 230 with the above components was photocured by irradiating ultraviolet rays for 30 seconds.
PUM
Login to View More Abstract
Description
Claims
Application Information
Login to View More 


