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A copper-based composite material with high thermal conductivity and adjustable thermal expansion and its preparation method

A copper-based composite material and composite material technology, which is applied in metal material coating technology, metal processing equipment, liquid chemical plating and other directions, can solve the problems of reduced size and structural stability, achieve good electrical and thermal conductivity, and solve thermal problems. Mismatch and effect of high thermal conductivity, dimensional and structural stability

Active Publication Date: 2021-07-09
UNIV OF SCI & TECH BEIJING
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In order to solve the problem of dimensional and structural stability reduction caused by thermal expansion and contraction of materials in precision instruments, and to meet the needs of thermal management materials for the packaging and assembly of various microwave and microelectronics, power devices, and optoelectronic devices, the combination of metal materials and ceramics The characteristics of the material, the invention provides a high thermal conductivity adjustable thermal expansion copper matrix composite material and its preparation method, the prepared copper matrix composite material has full density, high thermal conductivity, and has adjustable thermal expansion characteristics in a wider temperature range

Method used

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  • A copper-based composite material with high thermal conductivity and adjustable thermal expansion and its preparation method
  • A copper-based composite material with high thermal conductivity and adjustable thermal expansion and its preparation method
  • A copper-based composite material with high thermal conductivity and adjustable thermal expansion and its preparation method

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preparation example Construction

[0032] The present invention also provides a method for preparing a copper-based composite material with high thermal conductivity and adjustable thermal expansion, which includes the following steps:

[0033] Step S101, grind the negative expansion reinforcement particles and the Cu matrix particles according to the molar ratio for more than 0.5h, and make them fully mixed;

[0034] In step S102, the composite powder prepared in step S101 is sintered at 400-900°C to finally obtain the copper-based composite material with high thermal conductivity and adjustable thermal expansion.

[0035] The present invention also provides a method for preparing a copper-based composite material with high thermal conductivity and adjustable thermal expansion. The electroless copper plating process is used to prepare the Cu-coated negative expansion particle composite material, which improves the chemical compatibility and interface wetting of the negative expansion particle and the Cu matrix....

Embodiment 1

[0046] This embodiment provides a method for preparing a high thermal conductivity zero-expansion copper-based composite material, comprising the following steps:

[0047] Step S211, the ScF 3 The particles are subjected to chemical coarsening, sensitization, and activation pretreatment in sequence;

[0048] In step S212, the preprocessed ScF 3 Powder according to Cu / ScF 3 Put the molar ratio of 1.36:1 into the electroless copper plating solution, control the temperature at about 50°C, and then add NaOH solution to the plating solution to stabilize the pH value of the plating solution at about 10. After 0.5 hours of chemical reaction, the electroless copper plating is completed cladding;

[0049] Step S213, the copper-coated ScF prepared in step S212 3 The composite powder is sintered at 700°C to obtain a high thermal conductivity zero-expansion copper matrix composite material.

[0050] After testing, the sample has an average thermal expansion coefficient of -0.59×10 in...

Embodiment 2

[0052] This embodiment provides a method for preparing a high thermal conductivity near-zero-expansion copper-based composite material, comprising the following steps:

[0053] Step S221, the ScF 3 The powder is subjected to chemical roughening, sensitization, and activation pretreatment in sequence;

[0054] In step S222, the preprocessed ScF 3 Powder according to Cu / ScF 3 Put the molar ratio 2.33:1 into the electroless copper plating solution, control the temperature at 50°C, and then add NaOH solution to the plating solution to stabilize the pH value of the plating solution at about 10. After 1 hour of chemical reaction, the electroless copper plating is completed. cover;

[0055] Step S223, the copper-coated ScF prepared in step S222 3 The composite powder is sintered at 700°C to obtain a copper-based composite material with high thermal conductivity and near zero expansion.

[0056] After testing, the sample has an average thermal expansion coefficient of 2.02×10 in ...

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Abstract

The invention provides a copper-based composite material with high thermal conductivity and adjustable thermal expansion and its preparation method, which belongs to the field of metal-based composite materials and its preparation, and in particular relates to a fully dense, high thermal conductivity copper matrix composite material that can be used within the range of -160-400°C A series of adjustable thermal expansion copper-based negative expansion particle reinforced composite materials and a preparation method thereof. The Cu matrix and the negative expansion reinforcement particles are prepared in a certain molar ratio by copper coating or direct compounding. The composite material has the characteristics of full density, high thermal conductivity, wide temperature range, adjustable thermal expansion, etc. Cu / ScF with a molar ratio of 1 to 6:1 3 The average coefficient of thermal expansion of the copper-based particle-reinforced composite material in the temperature range of -50 to 400°C is -0.5×10 ‑6 / K~7×10 ‑6 / K, and its thermal conductivity at room temperature reaches 40-190W / m K, which can be used in high-end technical fields such as aerospace, new energy vehicles, microelectronic packaging, and precision instruments.

Description

technical field [0001] The invention belongs to the field of metal-based composite materials and their preparation, and in particular relates to a series of adjustable heat-expandable copper-based negative-expansion particle-reinforced composite materials that are fully dense, high in thermal conductivity, and can be used in the range of -160 to 400°C and a preparation method thereof. Background technique [0002] As we all know, thermal expansion and contraction are considered to be one of the basic physical properties of matter. However, the thermal expansion and contraction of materials will reduce the structural stability and safety reliability of precision components, and weaken or even destroy the functional properties of materials. The appearance and size of zero-expansion materials are not affected or less affected by changes in external ambient temperature, so they can be used in some high-end technical fields such as electronic devices and precision instruments. I...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C22C9/00C22C32/00C22C1/04B22F1/02C23C18/38
CPCC22C9/00C22C32/0005C22C32/0089C22C1/0425C23C18/38B22F1/17
Inventor 陈骏肖宁乔永强宋玉柱施耐克
Owner UNIV OF SCI & TECH BEIJING
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