Packaging method and device for manufacturing heat homogenizing plate of vacuum chamber

Abstract

The invention relates to a packaging method and device for manufacturing a heat homogenizing plate of a vacuum chamber. A packaged object is a semi-finished heat homogenizing plate with a shell, a capillary liquid sucking core structure and a supporting structure. The packaging manufacturing process comprises the steps of injecting a working medium into the semi-finished heat homogenizing plate, freezing and solidifying, vacuum pumping, sealing and the like. The packaging device comprises a freezing end assembly, a refrigeration source, a refrigerant pipeline, a vacuum pump set, a vacuum pipeline, a sealing end clamping jig and the like, the processes of freezing and solidifying, vacuum pumping and sealing in the atmospheric normal pressure environment or the vacuum environment can be provided, and the characteristics that the structure is simple, the production efficiency is high, and the product yield is high are achieved. The packaging method and device are suitable for automatic and batch production. The heat homogenizing plate manufactured by the technical scheme has the advantages that a very high vacuum degree can be obtained in the heat homogenizing plate, the quality of aphase change working medium is basically not lost, the residual amount of non-condensable gas is small, and the production efficiency is high.

Description

technical field [0001] The invention relates to the technical field of vapor chamber technology, in particular to a packaging method and device for manufacturing a vacuum chamber vapor chamber. Background technique [0002] The miniaturization of electronic devices has become the mainstream trend in the development of modern electronic equipment. The feature size of electronic devices has been continuously reduced (for example, the feature size of microprocessors has been reduced from 0.35 µm to 0.18 µm from 1990 to 2000), and the integration level, packaging density, and operating frequency of chips have continued to increase. The heat flux increases rapidly. Studies have shown that more than 55% of the failure modes of electronic equipment are caused by excessive temperature, so the thermal reliability design of electronic devices plays a pivotal role in the development of electronic devices. [0003] With the increasing integration and thinning of electronic products su...

AI Technical Summary

Problems solved by technology

This technical solution has the following two problems: one is to condense the liquid working medium into a solid and then put it into the heat pipe, which is only suitable for heat pipes with large size or thickness and simple shape and structure. Vapor chambers with complex and compact structures make it difficult to put solid working fluid into its inner cavity; secondly, the solid working fluid is put into the heat pipe, installed in the vacuum station, and vacuumed by vacuum equipment. If the time is long, the solid working medium will be partially re-liquefied, and it is easy to gasify and escape during vacuumin

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