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Back polishing method of PERC battery

A back-polishing and back-polishing technology, applied in the field of solar cells, can solve the problems of increasing oxidation processes, back surface defects, and inability to take both into account, so as to achieve the effects of improving light reflectivity, improving flatness, and solving loss and composite loss.

Active Publication Date: 2020-12-25
LONGI SOLAR TECH NINGXIA CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In order to improve the reflectivity of the back of the battery, alkali polishing is used in the industry - adding water to potassium hydroxide or sodium hydroxide, which can replace acid polishing under high temperature conditions. Alkali polishing can achieve a high reflectivity of 50%, but alkali polishing needs to be replaced. Some acid polishing machines, and alkali polishing requires an additional oxidation process, as well as an increase in the reflectivity of the back, which will lead to a decrease in the efficiency of the back of the double-sided battery
[0004] In order to improve the reflectivity of the etched backside and at the same time take into account the power generation efficiency of the backside of the double-sided battery, measures to increase the weight reduction are adopted to increase the corrosion depth. However, because acid polishing is isotropic corrosion, only by increasing the reduction Heavy, defects will form in some areas of the back surface, resulting in severe recombination centers
Therefore, although this method can achieve high reflectivity on the back, it will also increase the recombination of electrons on the back of the battery, and the two cannot be taken into account at the same time.

Method used

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  • Back polishing method of PERC battery
  • Back polishing method of PERC battery

Examples

Experimental program
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Effect test

Embodiment 1

[0083] The back polishing method of the PERC cell of the present embodiment comprises the following steps:

[0084] S11, removing the organic matter on the surface of the silicon wafer and the damaged layer during the cutting process of the silicon wafer;

[0085] S12. Phosphorus is diffused on the surface of the silicon wafer using a phosphorus oxychloride liquid source to form a PN junction on the surface of the silicon wafer; during the diffusion process, the surface of the silicon wafer will be covered with a phosphosilicate glass layer;

[0086] S13. Using a laser to locally irradiate the phosphosilicate glass layer on the surface of the silicon wafer according to the metallization pattern, so as to form a local re-diffusion area on the surface of the silicon wafer.

[0087] S2, place the silicon wafer in HF, H 2 SO 4 、HNO 3 with H 2 The volume ratio of O is 1:0.3:2.6:1 for back polishing in a mixed solution to form a textured surface with a square or rectangular stru...

Embodiment 2

[0096] The back polishing method of the PERC cell of the present embodiment comprises the following steps:

[0097] S11, removing the organic matter on the surface of the silicon wafer and the damaged layer during the cutting process of the silicon wafer;

[0098] S12. Phosphorus is diffused on the surface of the silicon wafer using a phosphorus oxychloride liquid source to form a PN junction on the surface of the silicon wafer; during the diffusion process, the surface of the silicon wafer will be covered with a phosphosilicate glass layer;

[0099] S13. Using a laser to locally irradiate the phosphosilicate glass layer on the surface of the silicon wafer according to the metallization pattern, so as to form a local re-diffusion area on the surface of the silicon wafer.

[0100] S2, place the silicon wafer in HF, H 2 SO 4 、HNO 3 with H 2 The volume ratio of O is 1:1.5:3.0:1.8 for back polishing in a mixed solution to form a textured surface with a similar square or rectan...

Embodiment 3

[0109] The back polishing method of the PERC cell of the present embodiment comprises the following steps:

[0110] S11, removing the organic matter on the surface of the silicon wafer and the damaged layer during the cutting process of the silicon wafer;

[0111] S12. Phosphorus is diffused on the surface of the silicon wafer using a phosphorus oxychloride liquid source to form a PN junction on the surface of the silicon wafer; during the diffusion process, the surface of the silicon wafer will be covered with a phosphosilicate glass layer;

[0112] S13. Using a laser to locally irradiate the phosphosilicate glass layer on the surface of the silicon wafer according to the metallization pattern, so as to form a local re-diffusion area on the surface of the silicon wafer.

[0113] S2, place the silicon wafer in HF, H 2 SO 4 、HNO 3 with H 2 The volume ratio of O is 1:1:2.8:1.5 for back polishing in a mixed solution to form a textured surface with a similar square or rectangu...

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Abstract

The invention relates to a back polishing method of a PERC battery. The method comprises the following steps: S1, pretreating a silicon wafer before polishing; S2, polishing the back surface of the silicon wafer, wherein the step S2 comprises the steps that a silicon wafer is placed in an HF / H2SO4 / HNO3 / H2O mixed solution to be subjected to back face polishing, and a texturing face of a quasi-square or rectangular structure is formed, the volume ratio of HF:H2SO4:HNO3:H2O is 1:0.3-1.5:2.6-3.0:1-1.8, the polishing temperature is 112 DEG C, and the polishing time is 2070 s; and S3, post-processing the silicon wafer. According to the PERC battery back polishing method provided by the invention, a new acid polishing ratio, namely the ratio of rich sulfuric acid to low nitric acid, is adopted toform a microscopic quasi-square or rectangular structure on the back surface of the silicon wafer so as to improve the flatness of the microstructure on the back surface of the silicon wafer, so thatthe loss of long-wave photons and the loss of recombination are solved. And meanwhile, the light reflectivity of the back surface of the silicon wafer, the passivation capability of the battery pieceand the electrical property of the battery piece are improved.

Description

technical field [0001] The present disclosure relates to the field of solar cells, in particular to a back polishing method for PERC cells. Background technique [0002] The current PERC process flow is: texturing-diffusion-selective emitter-etching-annealing-backside alumina passivation-coating-screen printing, in which the backside of the PERC cell needs to be etched and back-polished Using hydrofluoric acid, nitric acid and water) to form a wormhole-shaped structure, the back reflectivity of the battery structure formed by this process is 28%-33%, and the low back reflectivity will reduce the reflection of long-wavelength photons, thereby reducing the light effective use. In addition, the wormhole-shaped structure will also lead to uneven field passivation on the back surface, thereby increasing the minority carrier recombination probability on the back surface and reducing the conversion efficiency of solar cells. [0003] How to improve the light reflection on the bac...

Claims

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Application Information

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IPC IPC(8): H01L31/18H01L21/306H01L31/0236C09K13/04
CPCH01L31/1804H01L21/30608H01L31/02363C09K13/04Y02P70/50
Inventor 赵赞良王肖肖付洪涛安艳龙刘世科杨明明房海冬仲志海
Owner LONGI SOLAR TECH NINGXIA CO LTD
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