Heterogeneously integrated system-in-package structure and packaging method

Abstract

The invention provides a heterogeneous integrated system-in-package structure and a packaging method, and the structure comprises a ceramic substrate, wherein one side of which is dug to form a firstcavity; a Kovar ring which is arranged on the other surface of the ceramic substrate and is used for forming a second cavity; a first cover plate which is arranged at the opening of the first cavity and is used for sealing the first cavity; a second cover plate which is arranged at the opening of the second cavity and is used for sealing the second cavity, wherein at least one chip is arranged ineach of the first cavity and the second cavity, the chips are adhered to the surface of the ceramic substrate through a conductive adhesive, at least one passive discrete device is arranged in the first cavity or the second cavity, and the passive discrete device is adhered to the surface of the ceramic substrate through a conductive adhesive. A double-sided cavity structure is formed by adoptinga single-sided cavity-dug ceramic substrate and a Kovar ring, the structural stability is improved, the signal wiring is shortened, the interconnection efficiency and the system integration degree areimproved, the integration of active and passive devices is realized, the process maturity and the module reliability are both considered, and the guidance is provided for high-reliability SiP mass production.

Description

technical field [0001] The invention relates to the technical field of semiconductor packaging, in particular to a heterogeneously integrated system-level packaging structure and packaging method. Background technique [0002] System-in-Package SiP, System in Package technology is an integrated packaging form that mixes and loads components with different functions into the same package through different technologies, and thus provides system-level or subsystem-level functions. As a technical route to continue Moore's Law at the system level, SiP is an important means to meet the integration and miniaturization of aerospace electronic products. [0003] Due to the particularity of their application environments, aerospace electronics and military electronics need to be developed in terms of miniaturization, light weight, high density, and high reliability. SiP products in this field have advanced technology, mature technology, Product reliability is very important, interact...

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Problems solved by technology

[0004] At present, in the case production of system-level packaging products, single-cavity structures are mostly used, but because the cavity size of the single-cavity structure is too large, it cannot meet the requirements of miniaturization and light weight, and there is a great risk of reliability ; There are also some existing technologies that use a double-cavity structure to improve reliability and integration. However, due to the difficulty in controlling the processing flatness of the shell with a double-cavity structure, the process requirements are relatively high, which is not conducive to production cost control and batch production. At the same time, the current dual-cavity structure is mostly used in the case of multi-chip integrated packaging, and rarely contains passive discrete devices; on the other hand, no matter the current dual-cavity structure, the stability in terms of structure is not Not ideal, as the requirements of the application environment are getting higher and higher, it cannot meet the requirements very well

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