Packaged antenna module and preparation method thereof

An antenna module and antenna technology, applied in antennas, antenna components, antenna supports/mounting devices, etc., can solve the problems of packaged antenna signal loss, location layout limitations, etc., to reduce signal loss and improve the overall competitive advantage , the effect of improving flexibility

Pending Publication Date: 2021-01-29
SJ SEMICON JIANGYIN CORP +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] In view of the above-mentioned shortcomings of the prior art, the purpose of the present invention is to provide a packaged antenna module and its preparation method, whi

Method used

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  • Packaged antenna module and preparation method thereof
  • Packaged antenna module and preparation method thereof
  • Packaged antenna module and preparation method thereof

Examples

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Effect test

Example Embodiment

[0067]Example one

[0068]Such asFigure 8 This embodiment provides a packaged antenna module. The packaged antenna module includes a rewiring layer 103, an antenna structure, a semiconductor chip 107, a third package layer 108, and a packaged antenna connector 111. Wherein, the rewiring layer 103 includes a first surface and a second surface that are arranged oppositely; the antenna structure includes a connector window 109 and a first antenna structure stacked at least on the second surface of the rewiring layer 103 104 and a second antenna structure 106. The first antenna structure 104 includes a first antenna feed line 1141, a first antenna metal layer 1341, and a first encapsulation layer 124. The first end of the first antenna feed line 1141 is The rewiring layer 103 is electrically connected, the first encapsulation layer 124 covers the first antenna feeder 1141 and exposes the second end of the first antenna feeder 1141, and the first antenna metal layer 1341 is located on the T...

Example Embodiment

[0109]Example two

[0110]Such asPicture 11 This embodiment provides a schematic structural diagram of a packaged antenna module. The main difference from the first embodiment is that the position of the connector window in the packaged antenna module is different to enlarge the packaged antenna connector The range of choices.

[0111]Wherein, the packaged antenna module includes a rewiring layer 203, an antenna structure, a semiconductor chip 207, a third package layer 208, and a packaged antenna connector 211. Wherein, the rewiring layer 203 includes a first surface and a second surface that are arranged oppositely; the antenna structure includes a connector window 209 and a first antenna structure stacked at least on the second surface of the rewiring layer 203 204 and a second antenna structure 206. The first antenna structure 204 includes a first antenna feed line 214, a first antenna metal layer 234 and a first encapsulation layer 224. The first end of the first antenna feed line 21...

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Abstract

The invention provides a packaged antenna module and a preparation method thereof, the packaged antenna module comprises a rewiring layer, an antenna structure, a semiconductor chip, a third packaginglayer and a packaged antenna connector, the antenna structure comprises a connector window, and a first antenna structure and a second antenna structure at least stacked on a second surface of the rewiring layer, the packaged antenna connector is located in the connector window and electrically connected with the redistribution layer. According to the invention, the electrical leading-out is carried out through the packaging antenna connector located in the connector window, the signal loss can be reduced, a metal protruding block electrically connected with the rewiring layer does not need to be prepared, electrical connection does not need to be carried out through a flip-chip technology, and therefore, the flexibility of position layout of the packaging antenna module can be improved,and the overall competitive advantage of the WLP AiP is further improved.

Description

technical field [0001] The invention belongs to the technical field of semiconductor packaging, and relates to a packaging antenna module and a preparation method thereof. Background technique [0002] With the popularity of high-tech electronic products, especially in order to meet the needs of mobile, most high-tech electronic products have added the function of wireless communication. [0003] Antenna in Package (AiP for short) is a technology that integrates antennas and chips into packages based on packaging materials and processes to realize system-level wireless functions. Its advantages are: simplified system design, product miniaturization, and low cost . As AiP technology conforms to the trend of increasing integration of silicon-based semiconductor processes, it provides a good antenna and packaging solution for system-level wireless chips. A must-select technology for radar chips, so AiP technology has received extensive attention. [0004] In traditional AiP ...

Claims

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Application Information

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IPC IPC(8): H01L23/498H01L23/58H01Q1/22H01Q1/36H01Q1/38H01Q1/50
CPCH01L23/498H01L23/585H01Q1/2283H01Q1/36H01Q1/38H01Q1/50
Inventor 吴政达于睿林正忠张湘辉
Owner SJ SEMICON JIANGYIN CORP
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