Room-temperature-cured bi-component epoxy adhesive with high heat resistance and high peel strength

An epoxy adhesive, room temperature curing technology, applied in epoxy resin glue, modified epoxy resin adhesive, non-polymer adhesive additives, etc., can solve problems affecting aging resistance, strength attenuation, etc. , to achieve the effects of high cost performance, increased strength, and good heat and aging resistance

Inactive Publication Date: 2021-02-02
上海汉司实业有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, there are still some defects in the epoxy adhesives currently on the market. Some products with excellent performance after curing need to be cured at a higher curing temperature to achieve high strength. Some manufacturers' curing conditions are difficult to achieve high temperature curing requirements; Some products increase the peel strength of the glue by adding some toughening agents, but it will seriously affect the aging resistance, and the sandwich structure board will experience serious strength attenuation after a period of time; at present, due to people's increasing requirements for environmental protection and health The higher the VOC, the more stringent the VOC requirements for various materials in the transportation and construction industries. Many manufacturers need to remove VOC through high-temperature baking after the sheet is formed, which requires the adhesive to have a certain High temperature resistance and aging resistance

Method used

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  • Room-temperature-cured bi-component epoxy adhesive with high heat resistance and high peel strength

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] (1) Preparation of component A:

[0025] ① 45 parts by weight of bisphenol A epoxy resin, 13 parts by weight of self-made acrylic modified epoxy resin, 12 parts by weight of core-shell toughened particles, 10 parts by weight of reactive diluent, 2 parts by weight of silane coupling agent and 0.2 parts by weight Add the wetting and dispersing agent in parts by weight to the planetary stirring tank in turn, raise the temperature of the material to 60°C, and at the same time, slowly increase the planetary stirring to 60-70rpm, slowly accelerate the high-speed dispersion to 800-900rpm, vacuum defoaming for 15-20min Then turn off the planetary stirring and high-speed dispersion.

[0026] ②Add 27.8 parts by weight of filler to the planetary stirring tank, slowly increase the planetary stirring to 60-70rpm, and slowly accelerate the high-speed dispersion to 800-900rpm, turn off the planetary stirring and high-speed dispersion after vacuum defoaming for 45-50min, Feed to get A...

Embodiment 2

[0031] (1) Preparation of component A:

[0032] ① 42 parts by weight of bisphenol A epoxy resin, 16 parts by weight of self-made acrylic modified epoxy resin, 3 parts by weight of core-shell toughened particles, 9 parts by weight of reactive diluent, 2 parts by weight of silane coupling agent and 0.3 parts by weight Add the wetting and dispersing agent in parts by weight to the planetary stirring tank in turn, raise the temperature of the material to 60°C, and at the same time, slowly increase the planetary stirring to 60-70rpm, slowly accelerate the high-speed dispersion to 800-900rpm, vacuum defoaming for 15-20min Then turn off the planetary stirring and high-speed dispersion.

[0033] ②Add 27.7 parts by weight of filler to the planetary stirring tank, slowly increase the planetary stirring to 60-70rpm, and slowly accelerate the high-speed dispersion to 800-900rpm, turn off the planetary stirring and high-speed dispersion after vacuum defoaming for 45-50min, and the Feed to...

Embodiment 3

[0038] (1) Preparation of component A:

[0039] ① Mix 40 parts by weight of bisphenol A epoxy resin, 16 parts by weight of self-made acrylic modified epoxy resin, 9 parts by weight of core-shell toughened particles, 10 parts by weight of reactive diluent, 2 parts by weight of silane coupling agent and 0.4 parts by weight Add the wetting and dispersing agent in parts by weight to the planetary stirring tank in turn, raise the temperature of the material to 60°C, and at the same time, slowly increase the planetary stirring to 60-70rpm, slowly accelerate the high-speed dispersion to 800-900rpm, vacuum defoaming for 15-20min Then turn off the planetary stirring and high-speed dispersion.

[0040] ② Add 22.6 parts by weight of filler to the planetary stirring tank, slowly increase the planetary stirring to 60-70rpm, and slowly accelerate the high-speed dispersion to 800-900rpm, turn off the planetary stirring and high-speed dispersion after vacuum defoaming for 45-50min, and the F...

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Abstract

The invention discloses a room-temperature-cured bi-component epoxy adhesive with high heat resistance and high peel strength. The room-temperature-cured bi-component epoxy adhesive comprises a component A and a component B, wherein the component A is bisphenol A epoxy resin, self-made acrylic acid modified epoxy resin, core-shell toughening particles, a reactive diluent and a silane coupling agent, the component B is prepared from polyamide, an accelerator and a filler. The room-temperature cured double-component epoxy adhesive with high heat resistance and high peel strength is operated for40-50 minutes at the temperature of 25 DEG C, has better bonding force on the surfaces of various metal substrates after being cured, and is generally used for various sandwich structure plates, the roller peel strength is higher than 60N. mm/mm, and the plane tensile strength is higher than 5MPa. In addition, the epoxy adhesive has good heat resistance and aging resistance, still has good performance under the condition of 80 DEG C, and after a specific aging test, the strength attenuation is still within a required range. Meanwhile, compared with similar products, the epoxy adhesive is relatively low in overall cost, has very high cost performance and has relatively strong competitiveness in the market of sandwich structure plates.

Description

technical field [0001] The invention relates to the field of high-strength structural adhesives cured at room temperature, in particular to an epoxy adhesive capable of curing at room temperature with high heat resistance and high roller peel strength. Background technique [0002] In recent years, industries such as transportation and construction have proposed the concept of lightweight in order to achieve better operation. In addition to requiring the material itself to be light and strong, there are also new requirements for the connection between materials. [0003] The sandwich structure is a composite shell structure consisting of thinner plates on both sides and a lighter core in the middle. Through this connection, different materials can be combined to obtain lightweight and extremely strong materials. Adhesives are needed to realize the material of this sandwich structure. [0004] Epoxy resin adhesive, as a kind of adhesive with excellent performance, is widely ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J163/10C09J11/04C09J11/06
CPCC09J163/00C09J163/10C09J11/04C09J11/06C08K2003/265C08L2205/02C08L2201/08C08L63/10C08K5/5435C08K3/26C08K3/34C08K3/36C08K3/346C08L63/00
Inventor 姚培军林孝蔚吴海平向劲松
Owner 上海汉司实业有限公司
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