Self-cleaning porous vacuum chuck and preparation method thereof

A vacuum suction cup and self-cleaning technology, applied in metal processing equipment, semiconductor/solid-state device manufacturing, liquid chemical plating, etc., can solve problems such as easy clogging and contamination, ineffective effect, and high hardness of porous ceramic adsorption plates , to achieve the effect of solving non-anti-static, excessive temperature sensitivity, and ensuring high-precision stability

Pending Publication Date: 2021-02-12
ZHENGZHOU RES INST FOR ABRASIVES & GRINDING CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Theoretically, this kind of sucker can realize pores of any size, and the porosity can be adjusted, but the porous metal adsorption plate of this kind of sucker, due to the internal crisscross through-hole structure, is easy to be blocked and stained during actual use, and the physical ultrasonic And cleaning with chemical reagents, the effect is not obvious; at the same time, due to the high hardness of the porous ceramic adsorption plate, scratches are easy to occur during the adsorption process of the wafer; Enterprise costs, resulting in waste of resources
[0003] In view of the problems existing in various types of vacuum chucks in the prior art, it is necessary to provide a self-cleaning porous vacuum chuck, which has a self-cleaning function and can avoid the clogging and contamination of chips during wafer processing

Method used

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  • Self-cleaning porous vacuum chuck and preparation method thereof
  • Self-cleaning porous vacuum chuck and preparation method thereof
  • Self-cleaning porous vacuum chuck and preparation method thereof

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0055] Such as Figure 1-3 As shown, the self-cleaning porous vacuum chuck of the present invention includes a base 1 and a porous metal adsorption plate 2 arranged on the base 1. In the sunken platform; the middle part of the sunken platform of the base 1 is provided with an air extraction hole 4 passing through the base 1, and the upper surface of the sunken platform is provided with a cross groove 3 and two concentric annular grooves 8 extending vertically downward, The cross groove 3 runs through the annular groove 8 and the air extraction hole 4 , and the two annular grooves 8 are arranged concentrically with the air extraction hole 4 .

[0056] The inner walls of the annular groove 8 , the cross groove 3 and the suction hole 4 are all provided with a composite coating 7 , and the thickness of the composite coating 7 is 3-5 μm. The part of the base 1 that is in contact with the porous metal adsorption plate 2 is coated with an adhesion aid layer.

[0057] The preparatio...

Embodiment 2

[0085] The difference between this embodiment and embodiment 1 is that the thickness of the composite coating is 8-10um.

[0086] The preparation method of the self-cleaning porous vacuum chuck of this embodiment comprises the following steps:

[0087] (1) Preparation of porous metal adsorption plate

[0088] ① Weigh the materials required for the porous metal adsorption plate: spherical 321 stainless steel powder with a particle size of 30um, Cu-Al alloy powder with a particle size of 20um (Cu:Al=1:1) and PMMA with a particle size of 10um, stainless steel powder, alloy powder and PMMA The mass ratio is 1:0.1:0.2, and then the three materials are put into a V-type mixer and dry mixed for 24 hours to obtain mixed powder A;

[0089] ②Add 10% of the total volume of the mixed powder A to the mixed powder A in step ①, wetting agent water, manually stir clockwise for 10 minutes, then put it into a V-type mixer for wet mixing for 2 hours, and pass through a 400-mesh stainless steel ...

Embodiment 3

[0099] The difference between this embodiment and embodiment 1 is that the thickness of the composite coating is 5-7um.

[0100] The preparation method of the self-cleaning porous vacuum chuck of this embodiment comprises the following steps:

[0101] (1) Preparation of porous metal adsorption plate

[0102] ①Weigh the materials required for the porous metal adsorption plate: spherical 321 stainless steel powder with a particle size of 30um, Fe-Cu alloy powder with a particle size of 20um (Fe:Cu=3:1) and starch with a particle size of 10um, stainless steel powder, alloy powder and The mass ratio of starch is 1:0.4:0.3, and then the three materials are put into a V-type mixer and dry mixed for 24 hours to obtain mixed powder A;

[0103] ②Add 7.5% wetting agent propylene glycol in the total volume of mixed powder A to the mixed powder A in step ①, manually stir clockwise for 30 minutes, then put it into a V-type mixer for wet mixing for 6 hours, and pass through a 400-mesh stai...

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Abstract

The invention belongs to the technical field of semiconductor manufacturing, and particularly relates to a self-cleaning porous vacuum chuck and a preparation method thereof. The self-cleaning porousvacuum chuck comprises a base and a porous metal adsorption plate arranged on the base, a sinking table is arranged in the middle of the base, and the porous metal adsorption plate is clamped in the sinking table; an air suction hole penetrating through the base is formed in the middle of a sinking table of the base, a crossed groove and a plurality of concentric annular grooves extending vertically downwards are formed in the upper surface of the sinking table, and the crossed groove penetrates through the annular grooves and the air suction hole. According to the porous vacuum metal suctioncup, the PTFE anti-sticking coatings are deposited on the surfaces of the criss-cross channels in the porous metal adsorption plate and the ventilation grooves in the cavity of the suction cup base, and the problems that micropores of an existing mainstream porous vacuum ceramic suction cup are prone to blockage and not easy to clean can be solved.

Description

technical field [0001] The invention belongs to the technical field of semiconductor manufacturing, and in particular relates to a self-cleaning porous vacuum chuck and a preparation method thereof. Background technique [0002] In the semiconductor chip manufacturing process, the porous vacuum chuck is widely used as a carrying tool for fixing various wafers. Traditional porous vacuum suction cups are made by mechanical drilling. Although this type of porous vacuum suction cup is not easy to clog and stick to dirt, due to the limitations of mechanical drilling, it is impossible to mass-produce suction cups with a pore diameter of less than 500um, so it cannot absorb thinner vacuum suction cups. 100um wafers. At present, the popular porous vacuum ceramic sucker, its porous adsorption area adopts the method of stacking to form holes, and the porous ceramic adsorption plate is manufactured by cold pressing or hot pressing and high temperature sintering. Theoretically, this k...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/683B22F1/00B22F3/11C23C18/16C23C18/36C23C18/52
CPCB22F1/0003H01L21/6838B22F3/1121B22F3/1134C23C18/1637C23C18/1644C23C18/1662C23C18/36C23C18/52B22F1/10
Inventor 宋运运张昕孙正斌刘勋裴亚星刘猛
Owner ZHENGZHOU RES INST FOR ABRASIVES & GRINDING CO LTD
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