Olefinic carbon heat conduction film applied to 5G terminal

Abstract

The invention belongs to the technical field of heat conduction films, and particularly discloses an olefinic carbon heat conduction film applied to a 5G terminal, which sequentially comprises a carbon heat conduction sheet layer, a first diamond layer, a graphene heat conduction layer and a second diamond layer from bottom to top. The carbon heat conduction sheet layer comprises a metal substrateand a nano carbon layer arranged on the upper surface of the metal substrate. The upper end face of the graphene heat conduction layer is provided with first grooves which are distributed in a latticed and crossed mode, and the lower end face of the graphene heat conduction layer is provided with second grooves which are distributed in a latticed and crossed mode. The first diamond layer is deposited in the first grooves, and the second diamond layer is deposited in the second grooves. The thickness ratio of the carbon heat conduction sheet layer to the first diamond layer to the graphene heat conduction layer to the second diamond layer is (2-3): (1-2): (5-12): (1-2). The overall heat transfer efficiency of the graphene heat conduction film is greatly improved, the heat conduction performance of the graphene carbon heat conduction film is improved, the heat dissipation requirement of high-energy-consumption equipment such as 5G equipment is met, and meanwhile external electromagneticinterference can be effectively shielded.

Description

technical field [0001] The invention belongs to the technical field of heat-conducting films, and in particular relates to an alkene-carbon heat-conducting film applied to 5G terminals. Background technique [0002] The high speed and low latency of the 5G era have brought a better experience to our lives, but for electronic devices, the power consumption will increase, and the heat generation will also increase. On the other hand, the functions integrated on electronic devices in the 5G era are gradually increasing and becoming more complex, and the size of the devices themselves is gradually shrinking, which puts forward higher requirements for the thermal management technology of electronic devices. As 5G mobile phones become more and more powerful, As the processing power becomes stronger and stronger, the power consumption increases accordingly, and the absolute value of the heat generation density of mobile phones will also increase; At the same time, 5G mobile phones...

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Problems solved by technology

[0004] The purpose of the present invention is to address the deficiencies of the prior art and provide an olefinic carbon heat-conducting film applied to 5G terminals to solve the problem that the existing heat-conducting film has poor heat conduction and heat dissipation performance, cannot isolate electromagnetic interference, and cannot meet high energy consumption such as 5G. Problems with equipment cooling requirements

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