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A high withstand voltage ceramic capacitor chip and its production process

A technology of ceramic capacitor and production process, which is applied in the field of high withstand voltage ceramic capacitor chips and its production process, can solve the problems of large differences in the insulation thickness of ceramic capacitors, the reduction of the withstand voltage strength of ceramic capacitors, and the easy generation of burrs or cracks, etc., to achieve Easy to adjust in time, avoid extrusion imbalance, high dielectric constant effect

Active Publication Date: 2022-04-29
SIYANG GRANDE ELECTRONICS CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Traditional ceramic capacitors are mainly in the form of discs. This structure is simple to form, mature in technology, easy to operate, and convenient for batch and large-scale production; but for high-voltage ceramic capacitors, the main consideration is the withstand voltage strength and nominal capacitor As high as possible; and between the two, it is precisely contradictory, under the same conditions: the thinner the dielectric, the greater the capacitance, the lower the compressive strength, and vice versa
Traditional disc-type ceramic capacitors are relatively large in size, which is not conducive to the assembly of power devices; in addition, when ceramic capacitors are formed, burrs or cracks are prone to occur
In the subsequent insulation coating, under the same coating, due to the existence of burrs or cracks, the insulation thickness of ceramic capacitors will vary greatly, and the withstand voltage strength of ceramic capacitors will also be reduced.

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  • A high withstand voltage ceramic capacitor chip and its production process
  • A high withstand voltage ceramic capacitor chip and its production process
  • A high withstand voltage ceramic capacitor chip and its production process

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Embodiment Construction

[0045] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0046] see Figure 1-6 As shown, a high withstand voltage ceramic capacitor chip includes a ceramic body and positive and negative electrodes arranged on both sides of the ceramic body. The ceramic body includes main materials and auxiliary materials, and the main material is Ba 2 Ti 9 o 20 , the auxiliary materials include the following molar percentages of raw materials: Si 5%, Ca 2.5%, As 3.5%, K 3%, Mo 7%, In 5.5%, I 2%, and the following stable phases in mol...

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Abstract

The invention discloses a high-voltage-resistant ceramic capacitor chip and its production process, comprising a ceramic body and positive and negative electrodes arranged on both sides of the ceramic body, the ceramic body includes main materials and auxiliary materials, and the main materials include Ba 2 Ti 9 o 20 、BaTi 4 o 9 、BaTi 3 o 7 、BaTi 5 o 11 and BaTi 6 o 13 At least one of the auxiliary materials includes the following molar percentages of raw materials: Si 4‑5%, Ca 1.5‑2.5%, As 2.5‑3.5%, K 2‑3%, Mo 6‑7%, In 4‑5.5%, I 0.5-2%; The high-voltage ceramic capacitor chip prepared by using the above-mentioned raw materials can work normally under high temperature and high pressure, has excellent high temperature resistance performance, and high high voltage resistance performance.

Description

technical field [0001] The invention relates to the technical field of ceramic capacitors, in particular to a high withstand voltage ceramic capacitor chip and a production process thereof. Background technique [0002] Ceramic capacitors are an important category of chip components. Due to their compact structure, small size, high specific volume, low dielectric loss, and low price, they are widely used in automobiles, computers, mobile phones, scanners, and digital cameras. Electronic products such as aerospace, weapons, ships, military communications and other military electronic equipment are more and more widely used. Ceramic capacitors are especially suitable for chip surface assembly, which can greatly increase the circuit assembly density and reduce the volume of the whole machine. This outstanding feature makes ceramic capacitors the fastest growing and most used chip electronic components in the world today. [0003] In recent years, with the popularization and wi...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01G4/12H01G13/00
CPCH01G4/1227H01G13/00
Inventor 刘志甫马名生储小兰罗亚成左生荣
Owner SIYANG GRANDE ELECTRONICS CO LTD