Unlock instant, AI-driven research and patent intelligence for your innovation.

Y-shaped gate structure based on carbon-based material, and preparation method thereof

A carbon-based material and gate structure technology, which is applied in semiconductor/solid-state device manufacturing, semiconductor devices, electrical components, etc., can solve the problem of reducing the distance between source-drain electrodes and gates, the inability to prepare short-channel transistors, and increasing device parasitics. Effects and other issues to achieve the effect of reducing parasitic effects, suppressing short channel effects, and reducing power consumption

Active Publication Date: 2021-02-26
BEIJING INST OF CARBON BASED INTEGRATED CIRCUIT +2
View PDF10 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

T-gate devices have two structures, one is the gate-first self-aligned structure, its disadvantage is that the length of the channel defined by the self-aligned source-drain electrodes depends on the length of the gate cap, so in a long gate cap (larger Under the design of gate cap cross-sectional area and smaller gate resistance), short-channel transistors cannot be fabricated, and short channels are necessary for RF devices
The second is the gate-last non-self-aligned structure. Through two exposures, the complexity of the process is increased. Although the former problem can be solved, the distance between the source-drain electrode and the gate is reduced, thereby increasing the device size. Parasitic effects, which are detrimental to the high frequency performance of the device

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Y-shaped gate structure based on carbon-based material, and preparation method thereof
  • Y-shaped gate structure based on carbon-based material, and preparation method thereof
  • Y-shaped gate structure based on carbon-based material, and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0041]Embodiments of the present invention will be described in detail below with reference to the accompanying drawings. In the various drawings, the same elements are denoted by the same reference numerals, and various parts in the drawings are not drawn to scale. Also, some well-known parts may not be shown. For the sake of simplicity, the semiconductor structure obtained after several steps can be described in one figure.

[0042] It should be understood that when describing the structure of a device, when a layer or a region is referred to as being "on" or "over" another layer or another region, it may mean being directly on another layer or another region, or Other layers or regions are also included between it and another layer or another region. And, if the device is turned over, the layer, one region, will be "below" or "beneath" the other layer, another region.

[0043] The terms used in the present invention are for describing specific embodiments only, and are n...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
angleaaaaaaaaaa
thicknessaaaaaaaaaa
thicknessaaaaaaaaaa
Login to View More

Abstract

The invention discloses a Y-shaped gate structure based on a carbon-based material. The Y-shaped gate structure comprises a substrate of a carbon-based material channel layer, wherein an integrated gate metal structure consisting of a gate metal gate root and a gate metal gate cap is arranged on the substrate, a first high-K gate dielectric layer is arranged between the gate metal structure and the carbon-based material channel layer, the lower portion of the gate metal gate cap has a first width, the upper portion of the gate metal gate cap has a second width greater than or equal to the first width, two side surfaces are formed between the upper portion and the lower portion of the gate metal gate cap, and the side surfaces are respectively coated with a second high-K gate dielectric layer. The invention further provides a preparation method of the Y-shaped gate structure, wherein the self-aligned Y-shaped gate structure can be formed only through one-time exposure, so that the process is simple, and operation is convenient. According to the Y-shaped gate structure based on the carbon-based material, the parasitic effect is further reduced while the gate resistance is reduced, and the performance of a carbon-based high-speed and high-frequency device can be improved.

Description

technical field [0001] The invention relates to the technical field of transistor electronic device preparation, in particular to a carbon-based material-based Y-shaped gate structure and a preparation method thereof. Background technique [0002] Carbon-based electronic materials represented by three-dimensional material diamond, two-dimensional material graphene and quasi-one-dimensional material carbon nanotubes have ultra-wide bandgap, ultra-high carrier mobility, excellent thermal conductivity and mechanical properties, respectively. As well as the various quantum effects brought by the unique low-dimensional structure, it has great potential in the fields of radio frequency high-power, high-linearity, terahertz and photoelectric mixing devices. With the development of carbon-based radio frequency devices, the existing experimental results show that the performance of carbon-based radio frequency devices is still lagging behind theoretical expectations due to limitation...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01L29/423H01L21/28
CPCH01L21/28008H01L29/42356H01L29/4236H01L29/42376
Inventor 周简硕丁力彭练矛
Owner BEIJING INST OF CARBON BASED INTEGRATED CIRCUIT