A light al-si-mg 2 si electronic packaging material and its preparation method and application

An al-si-mg2si, electronic packaging material technology, applied in the direction of circuit, additive manufacturing, additive processing, etc., can solve the problems of large size, split matrix, reduce material mechanical properties and processing performance, etc., to achieve density reduction, combination Good effect of avoiding component segregation

Active Publication Date: 2021-07-30
CENT SOUTH UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

But currently limit the light Al-Si-Mg 2 The key to the popularization and application of Si alloys lies in the primary Mg 2 Si intermetallic compounds and Si phases are coarse in size and have sharp edges and corners, which split the matrix and reduce the mechanical properties and processing properties of the material

Method used

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  • A light al-si-mg <sub>2</sub> si electronic packaging material and its preparation method and application
  • A light al-si-mg <sub>2</sub> si electronic packaging material and its preparation method and application
  • A light al-si-mg <sub>2</sub> si electronic packaging material and its preparation method and application

Examples

Experimental program
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Embodiment 1

[0055] Prepare a kind of light Al-2%Si-25%Mg in the present embodiment 2 Si alloy electronic package cover material, please refer to the attached figure 1 ,Specific steps are as follows:

[0056] S1: Alloy composition design: The main performance index of the electronic packaging cover plate is the thermal expansion coefficient of 18.0±1.0 ×10 -6 / K and thermal conductivity ≥150W / mK, combined with Al, Si and Mg 2 The performance parameters of Si (Table 1), first design the Si content in Al-Si alloy according to formula (1) and formula (2), then use formula (3) and formula (4) to design Al-Si-Mg 2 Mg in Si alloy 2 The proportion of Si and Si phase.

[0057] First, according to the coefficient of thermal expansion 18.0±1.0×10 -6 / K requirements and formula (1), assuming Si content is x, then Al content is 1-x, namely

[0058] 23.6·(1-x)+4.2·x=18±1 (5)

[0059] From the formula (5), it can be obtained that the Si content of 23.7%-34.0% can meet the requirement of thermal e...

Embodiment 2

[0091] Prepare a kind of light Al-25%Si-25%Mg in the present embodiment 2 Si alloy electronic packaging shell material, please refer to the attached figure 1 ,Specific steps are as follows:

[0092] S1: Alloy composition design: The main performance index of the electronic packaging shell is the thermal expansion coefficient of 12.0±1.0 ×10 -6 / K and thermal conductivity ≥120W / mK, combined with Al, Si and Mg 2 The performance parameters of Si (Table 1), first design the Si content in Al-Si alloy according to formula (1) and formula (2), then use formula (3) and formula (4) to design Al-Si-Mg 2 Mg in Si alloy 2 The proportion of Si and Si phase.

[0093] First, according to the coefficient of thermal expansion 12.0±1.0×10 -6 / K requirements and formula (1), assuming Si content is x, then Al content is 1-x, namely

[0094] 23.6·(1-x)+4.2·x=12±1 (9)

[0095] It can be obtained from formula (9), that the Si content of 54.6% to 64.9% can meet the requirement of thermal expan...

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Abstract

The present invention relates to a kind of lightweight Al-Si-Mg 2 Si electronic packaging material and its preparation method and its application in the field of electronic packaging, the preparation method comprises the following steps: S1: alloy composition design, including Si and Mg 2 Si phase content and proportion; S2: spray deposition billet; S3: thermal analysis and thermal stability analysis; S4: hot isostatic pressing densification and heat treatment; S5: microstructure and performance investigation; S6: shell processing and Assessment verification. Compared with existing materials, Al‑Si‑Mg 2 Si alloy has lower density and higher elastic modulus; compared with existing preparation techniques, spray deposition and hot isostatic pressing methods can effectively control Mg 2 The size and morphology of Si and Si phases can be used to obtain large-scale ingots and ensure good overall performance and process stability of the alloy. Proven, spray-deposited Al‑Si‑Mg 2 Si alloys are suitable for electronic packaging, and can also be applied to lightweight components such as pistons, brake discs, and engine cylinder liners.

Description

technical field [0001] The invention belongs to the technical field of development and preparation of metals and alloys, in particular to a light Al-Si-Mg 2 The Si electronic packaging material and its preparation method are applied in the field of electronic packaging. Background technique [0002] Metal Matrix Composites (MMCs, Metal Matrix Composites) have the characteristics of high toughness, high plasticity, good processing performance of the metal matrix, high hardness of the reinforcing phase, excellent wear resistance and heat resistance, etc., and by adjusting the reinforcing phase Materials with different properties can be obtained by volume fraction, showing good designability. With the rapid development of electronic information, rail transit and automobile industries, as well as the increasingly prominent problems of energy shortage and environmental pollution, lightweight aluminum matrix composites have attracted more and more attention from the material and ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B22F10/22C22C21/02C22C32/00B22F10/60B22F10/64H01L23/29B33Y10/00B33Y80/00
CPCB22F3/115B22F3/15B22F3/24B22F2003/248B33Y10/00B33Y80/00C22C21/02C22C32/0078H01L23/29
Inventor 蔡志勇王日初彭超群冯艳王小锋
Owner CENT SOUTH UNIV
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