Hollow glass microspheres as well as preparation method and application thereof

A glass microsphere and hollow technology, which is applied to printed circuit parts, printed circuits, circuit substrate materials, etc., can solve the problems that cannot further meet the requirements of the dielectric constant performance of the circuit substrate, and achieve stable structure and low dielectric properties , the effect of simple method

Active Publication Date: 2021-03-12
ZHEJIANG WAZAM NEW MATERIAL CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, with the development of 5G and other technologies, the dielectric constant of traditional hollow glass microspheres can no longer meet the needs of circuit substrates for lower dielectric constant performance.

Method used

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  • Hollow glass microspheres as well as preparation method and application thereof
  • Hollow glass microspheres as well as preparation method and application thereof
  • Hollow glass microspheres as well as preparation method and application thereof

Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0035] The present invention also provides a method for preparing hollow glass microspheres, comprising:

[0036] S1, by mass percentage, weigh 45%-80% of silicon dioxide, 5%-15% of alumina, 10%-35% of boron oxide, 0.1%-15% of calcium oxide, 0.1%-7 % magnesium oxide and 2%-10% titanium dioxide to form a mixed powder;

[0037] S2. In a non-polar gas atmosphere, after the mixed powder is expanded, heat-preserved and shaped, it is cooled and molded to obtain hollow glass microspheres.

[0038] In step S1, the mixed powder may also include a chemical foaming agent, and the mass percentage of the chemical foaming agent in the mixed powder is 0.1%-8%, so that chemical foaming or chemical foaming Combined with physical foaming, the volume of the body in the obtained hollow glass microspheres is 10%-35%.

[0039] Specifically, the chemical blowing agent includes at least one of carbonate compounds, nitrate compounds, and hydrazine. Wherein, the carbonate compound includes at least ...

Embodiment 1

[0061] Weigh silicon dioxide, aluminum oxide, boron oxide, titanium oxide, calcium oxide, magnesium oxide and chemical blowing agent according to the mass ratio in Table 1, mix them, crush, grind, and sieve until the D50 is 10 μm-30 μm, and the D90 is 60 μm- 70 μm particle size to obtain mixed powder.

[0062] The mixed powder is heated to 500°C for drying, and then the dried mixed powder is transported into the expansion furnace through argon, so that the mixed powder is expanded at a high temperature of 1200°C, and kept at 900°C for setting, and then cooled molding to obtain hollow glass microspheres.

Embodiment 2-7

[0063] Embodiment 2-7 and comparative example 1-6

[0064] The manufacturing process is the same as in Example 1, and the proportioning ratio is changed as shown in Table 1.

[0065] The hollow glass microspheres obtained in Examples 1-7 and Comparative Examples 1-6 were tested, and the results are shown in Table 2.

[0066] Table 2

[0067]

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Abstract

The invention relates to a hollow glass microsphere as well as a preparation method and application thereof; the hollow glass microsphere comprises a body and a closed cavity arranged in the body. Theraw materials of the body comprise, by mass, 45%-80% of silicon dioxide, 6%-15% of aluminum oxide, 10%-35% of boron oxide, 0.1%-15% of calcium oxide, 0.1%-7% of magnesium oxide and 2%-10% of titaniumdioxide. By controlling the composition and mass percentage of the raw materials of the body, the hollow glass microsphere with stable structure and excellent dielectric property can be obtained, andwhen the hollow glass microsphere is applied to a circuit substrate, the circuit substrate with lower and more stable Dk and Df can be obtained.

Description

technical field [0001] The invention relates to the technical field of electronic industry, in particular to hollow glass microspheres, a preparation method and application thereof. Background technique [0002] In circuit substrates, dielectric fillers are often used to control dielectric and mechanical properties. In particular, hollow glass microspheres are often used as dielectric fillers where a low dielectric constant is desired. However, with the development of technologies such as 5G, the dielectric constant of traditional hollow glass microspheres can no longer meet the needs of circuit substrates for lower dielectric constant performance. Contents of the invention [0003] Based on this, it is necessary to address the above problems and provide a hollow glass microsphere with excellent dielectric properties and stable structure, its preparation method and application. [0004] A hollow glass microsphere, comprising a body and a closed cavity arranged inside the...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C03C11/00H05K1/03
CPCC03C11/002H05K1/0306
Inventor 韩梦娜方江魏卢悦群任英杰董辉
Owner ZHEJIANG WAZAM NEW MATERIAL CO LTD
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