The invention provides glass powder for semiconductor passivation packaging and a preparation method of the glass powder. The glass powder is prepared from the following ingredients in percentage by mass: 30-60% of SiO2, 3-10% of Al2O3, 5-15% of B2O3, 28-55% of PbO, 0-10% of Bi2O3, 0-20% of ZnO, 0-2% of CeO2, 0-2% of Sb2O3, 0-3% of PbF2, 0-5% of V2O5, 0-0.5% of ZrO2 and 0-5% of TiO2. According tothe preparation method of the glass powder for the semiconductor passivation packaging, the operation is simple, the cost can be effectively saved, the prepared glass powder can meet requirement on the semiconductor passivation packaging, meanwhile, the glass powder has enough strength and breaking tenacity and can effectively resist comprehensive damage caused by illumination, cold, heat, wind, rain, bacteria and the like to the surface of a semiconductor device.