Halogen-free polyphenyl ether resin composition, and prepreg and laminated board prepared therefrom

Abstract

The invention discloses a halogen-free polyphenyl ether resin composition, which comprises the following components: (a) 100 parts of polyphenyl ether resin containing carbon-carbon unsaturated bonds;(b) 5-60 parts of a phosphorus-containing compound containing carbon-carbon unsaturated bonds; and (c) 0-10 parts of an initiator. According to the invention, the phosphorus-containing compound containing carbon-carbon unsaturated bonds is used as a cross-linking agent for polyphenyl ether and the compound containing carbon-carbon unsaturated bonds; according to the resin composition and the laminated board prepared from the resin composition, polyphenyl ether and a compound containing carbon-carbon unsaturated bonds can be well and uniformly compatible together, a lower dielectric constant and a lower dielectric loss value are obtained, and experimental data prove that the resin composition and the laminated board prepared from the resin composition can meet the requirements of current 5G products.

Description

technical field [0001] The invention relates to a halogen-free polyphenylene ether resin composition and a prepreg and a laminate made by using the composition, belonging to the technical field of electronic materials. Background technique [0002] With the upgrading of technology, the automotive market, smart phones and other consumer electronics markets have put forward new requirements for PCBs. After the 5G commercial launch in 2018, the requirements for the dielectric properties of PCB substrates have been raised to a higher level. High-frequency and high-speed copper-clad laminates are one of the indispensable electronic substrates in the 5G era. Simply put, the PCB substrate material needs to have a lower dielectric constant and dielectric loss tangent to reduce signal delay, distortion and loss during high-speed transmission, as well as interference between signals. Therefore, it is desired to provide a thermosetting resin composition, and the printed circuit board ...

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Problems solved by technology

[0003] In order to meet the high dielectric performance requirements, the prior art generally uses a hydrocarbon resin system, but it will bring problems such as poor flame retardancy, low glass transition temperature, and insufficient rigidity. Therefore, high-performance substrates for high-frequency and high-speed applications are prepared. At the same time, in order to solve the problems of flame retardancy and rigidity, other components such as bismaleimide resin, benzoxazine resin or ordinary DOPO structure phosphorus-containing flame retardant are added to the resin composition, but the final obtained The dielectric constant of the substrate material still fails to meet the requirements of high-frequency and high-speed substrates

[0004] Japanese patents JP2019023263 and JP2019044031 disclose the addition of phosphorus-containing flame retardants (such as phosphazenes) that are incompatible with polyphenylene ether and crosslinking properties in resin compositions containing polyphenylene ether resins and carbon-carbon unsaturated crosslinking agents , this technical solution can obtain halogen-free flame retardancy, and reduce the dielectric constant and dielectric loss of the cured product to a certain extent, but the phosphorus atoms in the incompatible phosphorus-containing flame retardants cannot be well introduced into the polymer network In the structure, it affects the moisture and heat resistance of the cured product, and at the same time the overall crosslinking density decreases, which affects the heat resistance of the cured product

Furthermore, incompatible phosphorus-containing flame retardants will also affect the compatibility of polyphenylene ether resins and crosslinking agents

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