Pure metal/high-entropy alloy nano-multilayer film with controllable phase change characteristics and preparation method thereof

A nano-multi-layer, high-entropy alloy technology, applied in metal material coating technology, nanotechnology, coatings, etc., can solve problems such as low deformation capacity, dislocation-stuffed interface damage, and reduced plasticity

Active Publication Date: 2021-03-12
XI AN JIAOTONG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Generally, introducing high-density heterogeneous interface into the material to form a nano-multilayer film can significantly increase its strength and properly improve its ductility, and its strength and plasticity are closely related to the layer thickness of the nano-multilayer film, that is, the strength often increases with the layer thickness. increases with decreasing, but the plasticity decreases
Previous studies on nano-multilayer films mainly focused on stable bimetallic multilayer film systems composed of pure metals, such as Cu / Cr, Cu / Zr, etc. The staggered interface is prone to damage and has relatively low deformation capacity

Method used

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  • Pure metal/high-entropy alloy nano-multilayer film with controllable phase change characteristics and preparation method thereof
  • Pure metal/high-entropy alloy nano-multilayer film with controllable phase change characteristics and preparation method thereof
  • Pure metal/high-entropy alloy nano-multilayer film with controllable phase change characteristics and preparation method thereof

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preparation example Construction

[0047] A preparation method of a pure metal / high-entropy alloy nano-multilayer film with controllable phase transition characteristics of the present invention comprises the following steps:

[0048] Step 1: cleaning and drying the surface of the silicon substrate, and removing the oxide layer on the surface of the silicon substrate by using hydrofluoric acid aqueous solution on the dried silicon substrate;

[0049] Specifically, one side of the silicon substrate is polished, and then the polished one side of the silicon substrate is ultrasonically cleaned in acetone and ethanol for at least 10 minutes, and then quickly dried with warm air to make the surface of the silicon substrate clean, free of stains, and Dust adheres, the roughness is below 0.5-0.8nm, then soak the dried silicon substrate in hydrofluoric acid aqueous solution for at least 5min, and dry after soaking, wherein the concentration of hydrofluoric acid aqueous solution is 35wt.%-45wt.% .

[0050] Step 2: In a...

Embodiment 1

[0060] Present embodiment 1 is implemented under the following implementation conditions and technical requirements:

[0061] Firstly, the silicon substrate was ultrasonically cleaned in analytical pure acetone and ethanol for 10 minutes each, and then quickly dried with warm air. Then soak the silicon substrate in hydrofluoric acid with a concentration of 45wt.% for 5 minutes, remove the oxide film and dry it quickly; then fix the silicon substrate on the substrate, and automatically send it into the magnetron sputtering vacuum coating chamber mechanically and automatically. To the vacuum degree of the background at 1.0×10 -4 Pa. The pure metal (Cu) / high-entropy alloy (Cu / Fe 50 mn 30 co 10 Cr 10 ) nano multilayer film, Cu target (purity 99.99wt.%) and Fe 50 mn 30 co 10 Cr 10 The target (purity 99.95wt.%) adopts DC power supply, the power is 200W, the deposition pressure is set to 1.0Pa, the deposition temperature is room temperature, the substrate rotation speed is 1...

Embodiment 2

[0063] This embodiment 2 is implemented under the following implementation conditions and technical requirements:

[0064] First, ultrasonically clean the silicon substrate in pure acetone and ethanol for 10 minutes each, and then quickly dry it with warm air; then soak the silicon substrate in hydrofluoric acid with a concentration of 40wt.% for 8 minutes, remove the oxide layer and then dry it quickly ; Then fix the silicon substrate on the base plate, mechanically and automatically send it into the magnetron sputtering vacuum coating chamber, and pump it until the vacuum degree of the background is 1.0×10 -4 Pa;

[0065] Then magnetron sputtering is used to deposit pure metal (Cu) / high entropy alloy (Cu / Fe 50 mn 30 co 10 Cr 10 ) nano multilayer film, Cu target (purity 99.99wt.%) and Fe 50 mn 30 co 10 Cr 10 Targets (purity 99.95wt.%) are DC power supply, the power is 200W, the deposition pressure is set to 0.8Pa, the deposition temperature is room temperature, the su...

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Abstract

The invention discloses a pure metal/high-entropy alloy nano-multilayer film with controllable phase change characteristics and a preparation method thereof. The preparation method comprises the following steps: alternately carrying out magnetron sputtering on the surface of a silicon substrate with an oxide layer removed through a pure metal target and a high-entropy alloy target to obtain the pure metal/high-entropy alloy nano-multilayer film, wherein the pure metal target is a Cu target, and the high-entropy alloy target is a Fe50Mn30Co10Cr10 target or a Fe50Mn30Co10Ni10 target; during magnetron sputtering, the Cu target and the high-entropy alloy target both adopt a direct-current power supply, the power is 200 W, and the deposition air pressure is 0.8-1.3 Pa; and the pure metal/high-entropy alloy nano-multilayer film is a Cu/Fe50Mn30Co10Cr10 nano-multilayer film or a Cu/Fe50Mn30Co10Ni10 nano-multilayer film. According to the preparation method, the preparation of the metal/high-entropy alloy nano-multilayer film with adjustable phase change is realized.

Description

technical field [0001] The invention belongs to the field of metal surface modification, and specifically relates to a pure metal / high-entropy alloy nano-multilayer film with controllable phase transition characteristics and a preparation method thereof. Background technique [0002] In recent years, multi-principal high-entropy alloys have attracted extensive attention due to their unique structures and excellent comprehensive properties. High-entropy alloys contain 4 or more elements, and the content of each element is usually between 5 and 35%. It has four significant effects, such as high-entropy effect, lattice distortion effect, hysteresis diffusion effect and cocktail effect, thus affecting its performance. Mechanoinduced phase transition is one of the main reasons for the high strength and high plasticity of high-entropy alloys with a face-centered cubic structure (FCC). challenge. In particular, at the micro-nano scale, the plastic deformation ability of high-ent...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C14/35C23C14/16B82Y40/00
CPCC23C14/352C23C14/165B82Y40/00
Inventor 张金钰赵宇芳王亚强吴凯刘刚孙军
Owner XI AN JIAOTONG UNIV
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