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Self-healing conductive hydrogel and preparation method and application thereof

A conductive hydrogel, self-healing technology, applied in applications, sensors, diagnosis, etc., can solve the problems of low self-healing performance, poor biocompatibility, low mechanical strength, etc., to achieve extension and function, improve mechanical strength , the effect of good mechanical strength

Pending Publication Date: 2021-03-23
SICHUAN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Aiming at technical problems such as low mechanical strength, poor electrical conductivity, low self-healing performance and poor biocompatibility in hydrogels and sensors prepared in the prior art, the purpose of the present invention is to solve the above problems and provide a self-healing Conductive hydrogel and its preparation method and application can realize simple and efficient preparation of conductive, high-strength and self-healing hydrogel, which can achieve self-healing after fracture and restore conductivity and sensing

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  • Self-healing conductive hydrogel and preparation method and application thereof
  • Self-healing conductive hydrogel and preparation method and application thereof
  • Self-healing conductive hydrogel and preparation method and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0043] The self-healing conductive hydrogel provided in this example is prepared by the following method, and the specific steps are as follows:

[0044] (1) Preparation of prepolymer dispersion I: 0.68g acrylamide monomer, 0.14g sodium lauryl sulfate, 0.07g methacrylate stearate, 0.11g molecular weight are 80000g / mol dextran dissolved in In 1mL of water, the dissolution temperature is 60°C to obtain the hydrophobically modified acrylamide pre-polymerization dispersion I, and ultrasonically disperse the pre-polymerization dispersion I at 80 kHz for 30 minutes;

[0045] (2) Preparation of pre-polymerization dispersion II: 0.1mL concentration of 20mg / mL small molecule surface-modified silver nanowires (aspect ratio of 500) dispersion was added to pre-polymerization dispersion I and mixed, oscillated evenly to obtain Pre-polymerized dispersion II;

[0046] (3) Preparation of self-healing conductive hydrogel: Add 15 μL of 0.5 mM N,N,N′,N’-tetramethylethylenediamine aqueous soluti...

Embodiment 2

[0050] The self-healing conductive hydrogel provided in this example is prepared by the following method, and the specific steps are as follows:

[0051] (1) Preparation of prepolymer dispersion I: 0.68g acrylamide monomer, 0.14g sodium lauryl sulfate, 0.07g methacrylate stearate, 0.11g molecular weight are 80000g / mol dextran dissolved in In 1mL of water, the dissolution temperature is 60°C to obtain the hydrophobically modified acrylamide pre-polymerization dispersion I, and ultrasonically disperse the pre-polymerization dispersion I at 80 kHz for 30 minutes;

[0052] (2) Preparation of pre-polymerization dispersion II: 0.2mL concentration of 20mg / mL small molecule surface-modified silver nanowires (aspect ratio of 500) dispersion was added to pre-polymerization dispersion I and mixed, oscillated evenly to obtain Pre-polymerized dispersion II;

[0053] (3) Preparation of self-healing conductive hydrogel: Add 15 μL of 0.5 mM N,N,N′,N’-tetramethylethylenediamine aqueous soluti...

Embodiment 3

[0057] The self-healing conductive hydrogel provided in this example is prepared by the following method, and the specific steps are as follows:

[0058] (1) Preparation of prepolymer dispersion I: 0.68g acrylamide monomer, 0.14g sodium lauryl sulfate, 0.07g methacrylate stearate, 0.11g molecular weight are 80000g / mol dextran dissolved in In 1mL of water, the dissolution temperature is 60°C to obtain the hydrophobically modified acrylamide pre-polymerization dispersion I, and ultrasonically disperse the pre-polymerization dispersion I at 80 kHz for 30 minutes;

[0059] (2) Preparation of pre-polymerization dispersion II: 0.3mL concentration of 20mg / mL small molecule surface-modified silver nanowires (aspect ratio of 500) dispersion was added to pre-polymerization dispersion I and mixed, oscillated evenly to obtain Pre-polymerized dispersion II;

[0060] (3) Preparation of self-healing conductive hydrogel: Add 15 μL of 0.5 mM N,N,N′,N’-tetramethylethylenediamine aqueous soluti...

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Abstract

The invention discloses self-healing conductive hydrogel and a preparation method and application thereof. The hydrogel is prepared from, by weight, 76-107 parts of hydrophobic modified polyacrylamideserving as a hydrogel matrix, 0.2-1 part of small molecular surface modified silver nanowires and 4-14 parts of glucan through one-step in-situ synthesis. The small molecular surface modified silvernanowire is a small molecular organic matter N, N-bisacryloyl cystamine surface modified silver nanowire. The two ends of the self-healing conductive hydrogel are connected with wires and packaged toobtain the self-healing conductive hydrogel sensor. According to the preparation method, the conductive, high-strength and self-healing hydrogel can be prepared simply and efficiently, self-healing can be realized after fracture, and the conductivity and the sensibility can be recovered.

Description

technical field [0001] The invention belongs to the field of hydrogel technology, and in particular relates to a self-healing conductive hydrogel and a preparation method and application thereof. Background technique [0002] In recent years, with the development of artificial intelligence and new materials, wearable self-healing hydrogel sensors based on bionic skin convert external stimuli (force, light, heat, humidity, etc.) . In order to realize the multifunctional application of hydrogel sensors, in addition to the necessary mechanical strength, electrical conductivity, sensing, and biocompatibility, self-healing after damage is required to prolong their service life and functions. In general, the self-healing properties of polymer hydrogels come from the dynamic covalent bonds and non-covalent interactions between polymer chains, especially non-covalent interactions, including hydrogen bonds, host-guest interactions, hydrophobic Coordination and metal coordination, e...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08J3/075C08L33/26C08L5/02C08K7/06C08K9/04C08F220/56C08F220/18A61B5/11A61B5/389A61B5/266A61B5/296A61B5/257
CPCA61B5/1118A61B2562/0209C08F220/56C08J3/075C08J2333/26C08J2405/02C08K7/06C08K9/04C08K2201/001C08K2201/011C08F220/1818
Inventor 范红松丁杰卫丹孙静
Owner SICHUAN UNIV
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