High-thermal-conductivity organosilicone gel sheet and preparation method thereof

Abstract

The invention discloses a high-thermal-conductivity organosilicone gel sheet which comprises a substrate and a composition, the composition comprises a component A and a component B, the component A comprises vinyl-terminated polysiloxane, by weight, the component B comprises 10 to 20 parts of heat conduction filler, 3 to 10 parts of side chain vinyl polysiloxane coupling agent, 75 to 85 parts ofpolysiloxane with a side chain containing a silicon hydrogen group, 0.05 to 0.2 part of catalyst and 0.05 to 0.2 part of inhibitor; and the composition is formed on the substrate through coating, calendering and thermocuring in sequence. According to the high-thermal-conductivity organosilicone gel sheet, the heat conduction filler is uniformly distributed in the gel molecular grid and is fixed instructure, and the organosilicone gel sheet has efficient and uniform thermal conductivity, relatively long service life and relatively high strength, and is easy to strip, adhere, rework and re-adhere.

Description

technical field [0001] The invention belongs to the field of thermally conductive interface materials, and more specifically relates to a high thermally conductive silicone gel sheet and a preparation method thereof. Background technique [0002] Electronic components of electronic computers and smartphones, such as CPUs, integrated circuit packaging chips, lithium-ion polymer batteries, etc., often use radiators such as metal heat pipes and fans to conduct heat. In order to achieve a good fit between the radiator and the surface of the component, thermal interface materials such as thermal conductive silicone grease, silica gel sheet, and silicone gel sheet are often added between the two interfaces to assist in heat conduction. [0003] At present, when commercially available products are prepared, the inorganic fillers used are often dispersed in the silicone oil or gel layer through mechanical dispersion. Due to the effects of gravity and electrostatic accumulation, it i...

AI Technical Summary

Problems solved by technology

[0003] At present, when commercially available products are prepared, the inorganic fillers used are often dispersed in the silicone oil or gel layer through mechanical dispersion. Due to the effect of gravity and electrostatic accumulation, the fillers are difficult to disperse evenly.

If used for a long time, it is prone to adverse phenomena such as reduced sheet strength, local hardening and cracking, stickiness, and uneven heat conduction.

As a result, the thermal conductivity is reduced, or even the thermal conductivity is lost.

[0004] On the other hand, commercially available silicone gel heat conduction sheet products have the problem of insufficient strength. In the process of electronic surface lamination and rework and repaste, the gel layer is easily broken or difficult to construct. It is used for a long time because the interface is mechanically squeezed. , the gel layer is easily broken

The conventional solution is to add MQ resin for reinforcement, or increase the content of thermally conductive fillers, which will cause problems such as spilled oil, small molecule residues, and increased production costs.

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