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Heat dissipation assembly, device needing heat dissipation and preparation method of heat dissipation assembly

A technology for heat dissipation components and components, which is applied in semiconductor/solid-state device manufacturing, electrical components, electric solid-state devices, etc., and can solve problems such as the structure is easily destroyed, the strength of graphite sheets is low, and the effect is reduced.

Pending Publication Date: 2021-03-26
THE HONG KONG UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Although the thickness of the thermally conductive graphite sheet is relatively thin, which is in line with the development trend of mobile phones and tablet computers becoming thinner and lighter, it is limited by the structure of the material itself, and its planar thermal conductivity is at most about 4 times that of copper, and the strength of the graphite sheet itself is low. It is easy to be destroyed, and the effect will drop sharply after being destroyed

Method used

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  • Heat dissipation assembly, device needing heat dissipation and preparation method of heat dissipation assembly
  • Heat dissipation assembly, device needing heat dissipation and preparation method of heat dissipation assembly
  • Heat dissipation assembly, device needing heat dissipation and preparation method of heat dissipation assembly

Examples

Experimental program
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Effect test

Embodiment 1

[0108] Such as figure 2 As shown in (b), the heat dissipation assembly of Embodiment 1 includes an evaporating element, a liquid absorbing element 2, a cooling element and a sealing element. The liquid-absorbing element 2 is a 500-mesh stainless steel mesh (area: 60*60*0.05mm 3 , Wire diameter: 25 microns, mesh size: 25 microns). The stainless steel mesh was first activated at a current of 2 A for 2 minutes, and then, the stainless steel mesh was washed with deionized water and washed with 0.8M CuSO 4 and 1.5M H 2 SO 4 Electroplate at a current of 1 A for 5 min in the fixative solution. In this way, a micron-sized stainless steel mesh coated with a copper layer is obtained as a liquid-absorbing element. Figure 7 a shows a SEM image of a stainless steel mesh coated with copper.

[0109] The cooling and evaporating elements are 40 μm and 30 μm thick copper plates, respectively. An array of microcopper pillars is designed on a copper plate as a cooling element to support...

Embodiment 2

[0111] Such as figure 2 As shown in (c), the heat dissipation assembly of Example 2 was prepared in substantially the same manner as in Example 1, except that a flower-like nanostructure was formed on a copper-plated stainless steel mesh. Specifically, a copper-plated stainless steel mesh was immersed in a solution containing 0.065M K 2 S 2 o 8 and 2.5M KOH in 70°C aqueous solution for 30 minutes. The samples were rinsed with water and dried at 180°C for 1 hour. results, such as Figure 7 As shown in b and c, at least a part of the surface of the stainless steel mesh is covered by flower-like nanostructures. The surface with flower-like nanostructures has a contact angle with water of less than 10 degrees. Therefore, the nanostructured mesh surface is superhydrophilic, which can greatly enhance the capillary force. The thickness of the heat dissipation component in Example 2 is 230 microns.

Embodiment 3

[0113] Such as figure 2 As shown in (d), the heat dissipation assembly of Example 2 was prepared in substantially the same manner as in Example 2, except that a wetting surface with a hydrophilic network of hydrophobic island arrays was also formed on the inner surface of the copper plate of the evaporation element. Specifically, at 70*70*0.03mm 3 To manufacture hydrophobic islands on the surface of a copper substrate, firstly, a HPR504 photoresist pattern is formed on a clean copper substrate by photolithography to protect the hydrophilic area. The samples were then immersed in a solution containing FAS (fluoroalkylsilane) to form hydrophobic islands. Finally the photoresist was removed, resulting in an array of square hydrophobic islands of 45 μm in size with a pitch of 65 μm on the hydrophobic surface. Figure 6 (a) shows a photograph of the fabricated square hydrophobic island array, and Figure 6 (b) shows condensation of vapor on the hydrophobic area, demonstrating t...

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Abstract

The invention provides a heat dissipation assembly, a device needing heat dissipation and a preparation method of the heat dissipation assembly. The heat dissipation assembly comprises an evaporationelement, a cooling element and a liquid absorption element located between the evaporation element and the cooling element. The liquid absorption element is of a micron-sized structure, the surface ofthe liquid absorption element is covered with a corrosion-resistant plating layer, the evaporation element and the cooling element form a sealed space used for containing a liquid working medium, theliquid absorption element is located in the sealed space, and the surface, facing the sealed space, of the evaporation element is a hydrophilic and hydrophobic mixed wetting surface. The heat dissipation assembly can have high temperature uniformity and a good cooling effect under the ultra-thin condition.

Description

technical field [0001] The invention relates to the field of electric heating, in particular to a heat dissipation component suitable for a device requiring heat dissipation, a preparation method thereof and a related device. In particular, the present invention especially relates to an ultra-thin heat dissipation component (such as an ultra-thin heat spreader) with excellent temperature uniformity and its application in devices requiring heat dissipation, wherein ultra-thin means that the thickness of the heat dissipation component can be 240 microns the following. Background technique [0002] With the rapid development of electronic technology, the integration and performance of electronic devices (such as electronic chips, mobile phones, and tablet computers) continue to improve, and their power consumption is also increasing, which puts higher and higher demands on the heat dissipation of electronic devices or chips. requirements. If the heat dissipation capacity cann...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/367H01L23/373H01L23/427H01L21/48
CPCH01L23/3672H01L23/427H01L23/3736H01L21/4882
Inventor 杨殷创李健邱惠和吴池力
Owner THE HONG KONG UNIV OF SCI & TECH
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