Surface treatment method for enhancing adhesive property of epoxy resin adhesive-bonded joint

A technology of epoxy resin glue and bonding performance, which is applied in the direction of surface pretreatment bonding methods, adhesives, etc., can solve the problems of reducing the bonding performance of bonded joints, reducing the bonding strength of materials, and stress concentration, etc., to achieve improved Adhesive performance, the effect of enhancing adhesive performance

Inactive Publication Date: 2021-03-30
BEIJING FORESTRY UNIVERSITY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] ①Narrow scope of application of materials
Although the surface blasting treatment can form a certain surface morphology on the surface of the material and increase the interface roughness, it is more destructive to the surface of the material and often causes structural damage to the surface layer of the material. Therefore, the surface blasting treatment is mostly used for rigid materials such as metal materials. materials, but less applications for materials such as wood
[0008] ② Poor technical controllability
Surface sandblasting can increase the roughness of the material surface, but this roughness is uncontrollable, and the surface morphology formed is irregular. The existing technology cannot achieve regular surface morphology on the material surface through sandblasting technology. , which can lead to large uncertainties in the adhesive properties of the structure
[0009] ③Poor surface wettability
The micro-cracks and micro-pores formed on the surface of the material by surface sandblasting make it difficult to completely wet the material surface, and it is difficult for the viscous epoxy resin with hardener to penetrate into the micro-cracks on the material surface, so that there is a gap between the adhesive and the interface. Micro-bubbles, these bubbles will cause stress concentration when the bonded joints bear the load, and form micro-cracks when they rupture, reducing the bonding performance of the bonded joint
[0010] ④ Difficult to clean
The effect of plasma modification on the surface of materials cannot be maintained for a long time, and it is time-sensitive. The number of polar groups introduced on the surface of materials by low-temperature plasma treatment will gradually decrease over time, the surface activity of materials will decrease, and the surface wettability will decrease....

Method used

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  • Surface treatment method for enhancing adhesive property of epoxy resin adhesive-bonded joint
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  • Surface treatment method for enhancing adhesive property of epoxy resin adhesive-bonded joint

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Experimental program
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Embodiment approach

[0045] (1) The resin solution is formed by mixing resin and acetone, and the resin accounts for 5% to 20% of the total mass of the resin solution, and the rest is acetone. The resin in the resin solution is the same as the resin in the epoxy resin glue. The resin solution needs to be formulated according to the mass fraction ratio. Since the acetone solvent is extremely volatile, it needs to be ready-to-use. Therefore, it is necessary to coat the resin solution on the bonding interface of the substrate within 30 minutes after the resin solution is prepared to ensure that the resin solution on the surface of the substrate at optimal concentration.

[0046] (2) The base material is at least one of bamboo-based composite materials such as wood, bamboo, recombined bamboo, wood-based engineering composite materials such as glued wood, metal materials such as steel plates and aluminum plates, fiber-reinforced composite materials such as carbon fiber boards, and glass fiber cloth. ...

Embodiment 1

[0060] Such as figure 2 As shown, a surface treatment method for enhancing the bonding performance of epoxy resin glued joints is used to treat bamboo-based materials. Before coating epoxy resin glue, the resin solution is coated (can be dipped , brushing or spraying) on ​​the bonding interface of the bamboo-based material, and then placed in a ventilated place to stand for 2 to 4 hours, volatilize the acetone in the resin solution, and then coat the epoxy resin glue on the The bonding interface is bonded, and then pressurized and solidified to obtain an epoxy resin bonded joint with enhanced bonding performance.

[0061] Specifically, the surface treatment method may include the following embodiments:

[0062] (1) Preparation of resin solution: the resin solution is formed by mixing resin and acetone, and the resin accounts for 5% to 20% (preferably 10%) of the total mass of the resin solution, and the rest is acetone. The resin in the resin solution is the same as the res...

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Abstract

The invention discloses a surface treatment method for enhancing the adhesive property of an epoxy resin adhesive-bonded joint. The surface treatment method comprises the following steps: before coating of an epoxy resin adhesive, coating a bonding interface of a base material with a resin solution, conducting standing for 2-4 hours, then coating the bonding interface with the epoxy resin adhesivefor bonding, and carrying out pressure curing, wherein the resin solution is formed by mixing resin and acetone, and the resin accounts for 5%-20% of the total mass of the resin solution, with the balance being acetone. The method is simple and convenient, good permeability and wettability can be provided for the bonding interface of the base material, the epoxy resin adhesive can be helped to permeate into micro-cracks and micro-pores in the surface layer of the base material, the contact area and bonding depth of the epoxy resin adhesive and the surface of the base material are increased, and the bonding performance of the bonded joint is remarkably improved.

Description

technical field [0001] The invention relates to the technical field of surface treatment of epoxy resin adhesive joints, in particular to a surface treatment method for enhancing the bonding performance of epoxy resin adhesive joints. Background technique [0002] Bonding is to connect two materials or the bonding interface of the same material through adhesive (such as: epoxy glue). The basic principle of bonding is to form an adhesive force between the curing reaction of the adhesive itself and the bonding interface, and firmly connect the bonding interface and the adhesive into a whole. Compared with traditional mechanical connection joints, bonded joints have the advantages of uniform stress distribution, fewer parts, low cost, light weight, high connection efficiency, and convenient construction. Factors affecting the bonding performance of bonded joints mainly include the surface treatment method of the bonded interface, the bonding length, the type of adhesive, and t...

Claims

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Application Information

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IPC IPC(8): C09J5/02
CPCC09J5/02C09J2400/303C09J2463/00C09J2400/163
Inventor 刘问徐航
Owner BEIJING FORESTRY UNIVERSITY
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