Three-dimensional intelligent micro-system chip

A microsystem and chip technology, which is applied in the components of TV systems, microstructure technology, microstructure devices, etc., can solve the difficult wafer-wafer three-dimensional integration process, increase the difficulty of intelligent microsystems, and difficult to integrate traditional sensors, etc. problems, to achieve the effect of improving R&D efficiency, lowering test costs, and reducing chip area
CN112582371AActive Publication Date: 2021-03-30SHANGHAI INST OF MICROSYSTEM & INFORMATION TECH CHINESE ACAD OF SCI
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
SHANGHAI INST OF MICROSYSTEM & INFORMATION TECH CHINESE ACAD OF SCI
Publication Date
2021-03-30

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Abstract

The invention relates to a three-dimensional intelligent micro-system chip. The three-dimensional intelligent micro-system chip mainly comprises a first chip, a second chip and a third chip, wherein the first chip comprises a sensing layer. Aiming at the problem that a traditional sensor (such as an MEMS) is difficult to integrate with a CMOS, according to the three-dimensional intelligent micro-system chip, the sensor, a processor and a memory can achieve higher integration density and better robustness through the wafer-level integrated packaging, the parasitic capacitance in electrical connection is reduced, the test cost is reduced, the three-dimensional intelligent micro-system chip is the premise for achieving a large-array sensor, and the risk that the data is stolen is also reducedbecause of the internal transmission of the data. Meanwhile, the advantages of better material compatibility and faster product development period of a multi-chip scheme are kept.
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Description

technical field

[0001] The invention belongs to the field of integrated circuits, in particular to a three-dimensional intelligent microsystem chip. Background technique

[0002] In a general sense, intelligent microsystems refer to the guidance of the theory of miniaturization, systematization, and intelligence, adopting new architectural ideas and design methods at the levels of material domain, information domain, and energy domain, through three-dimensional / heterogeneous / Heterogeneous integration and other advanced manufacturing methods form a miniaturized system device with a characteristic scale of micro-nano level, which has multiple functions such as information acquisition, processing, communication, execution, and energy supply, and can work independently and intelligently. It is an intelligent microsystem unit or an intelligent microsystem node. Under traditional microsystems or classic computer architectures, sensing, storage, and computing are discrete, reflec...

Claims

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