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Resin composition and preparation method and application thereof

A resin composition and resin technology, applied in the direction of chemical instruments and methods, layered products, metal layered products, etc., can solve the problems of increasing production costs, difficult to control requirements, etc., to achieve accurate measurement, improve product quality, improve Effect of Glass Transition Temperature and Heat Resistance

Pending Publication Date: 2021-04-06
KINGBOARD JIANGSU CHEM
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

It is difficult to meet this control requirement by using N,N-dimethylformamide to dissolve dicyandiamide, and using PM or MCS to dissolve dicyandiamide will significantly increase production costs

Method used

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  • Resin composition and preparation method and application thereof
  • Resin composition and preparation method and application thereof
  • Resin composition and preparation method and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0067]Bisphenol A type epoxy resin: 20g, the formula is (1), in the formula X is

[0068]Phenol formaldehyde epoxy resin: 5g,

[0069]20% epoxy resin: 40g,

[0070]BPA benzoxazine resin: 28g,

[0071]Tetrachromobisphenol A: 20g,

[0072]Linear phenolic resin: 15g,

[0073]Solvent: Acetone: 20g, methanol: 5g

[0074]Under nitrogen protection, the bisphenol A-type epoxy resin was added to 100 ° C to start melting, adding bromide, BPA benzoxazine resin, tetrabromide bisphenol A, phenol formaldehyde epoxy resin and line type Phenolic resin, mixing is uniform, then adding acetone and methanol to obtain a resin composition to obtain a resin composition.

[0075]Take 125 g of the resin composition of Example 1, 5% mica, SiO2Filler, add 20 g of acetone and 10 gpm (propylene glycol methyl ether) and 0.04 g of methylimidazole (cured accelerator), and the curing time of the stirring 30 minutes is controlled between 160 to 260s.

[0076]The 7628 glass cloth was impregnated with the gum liquid, baked at 170 ° C for a semi...

Embodiment 2

[0080]Bisphenol A epoxy resin: 40g, its general formula (1), in the formula X is

[0081]Bromine-containing epoxy resin: 10g, structural formula

[0082]

[0083]Isocyanate modified epoxy resin: 5g

[0084]Topphenolice phenolic resin KB802: 2G,

[0085]CN: 15G

[0086]Tetrachromobisphenol A (TBBA): 28g

[0087]Acenone (ACE): 20g

[0088]Tolue (Tol): 5g

[0089]Under nitrogen protection, the bisphenol A epoxy resin was added to 120 ° C to add a bromine-containing epoxy resin, and the isocyanate modified epoxy resin was stirred, and Ace and Tol were added, and the Kb802, Cn and TBBA were added, and the dissolution was mixed. The resin composition is baked.

[0090]125 g of the resin composition of 125 g of Example 2, add 8 wt% filler, 20 g of propanol and 10 g of propylene glycol methyl ether and 0.02 g of 2 methylimidazole and 0.02 g of 2-methyl-4 ethylimidazole, stirred for 30 minutes glue The curing time is controlled between 160 and 260s.

[0091]The filler is an uncertainty of silica, talc, and mica.

[0092]The 76...

Embodiment 3

[0096]Bisphenol A epoxy resin: 20g, its general formula (1), in the formula X is

[0097]Contaminated epoxy resin: 20g, which is (1), in the formula

[0098]MDI modified epoxy resin: 20g,

[0099]Bisphenol A-formaldehyde resin: 15g

[0100]Tetophenolic ethane epoxy resin: 5g

[0101]Tetrachromobisphenol A (TBBA): 20g

[0102]DPM benzoxazine: 15g

[0103]Acetone: 20g

[0104]Glycol methyl ether: 5g

[0105]Under nitrogen protection, the bisphenol A-type epoxy resin, a bromine-containing epoxy resin, MDI modified epoxy resin is heated, and 10 g of acetone is dissolved uniform, then 10 g of acetone, 5 g of propylene glycol methyl ether, uniform dissolved, Add bisphenol A-type formaldehyde resin and tetraromobisphenol A dissolution. After dissolving the resin described above, then the tetraphenol-based ethane epoxy resin was dissolved to give a resin composition solution.

[0106]125 g of the resin composition of Example 3, add 6 wt% filler, 20 g of acetate and 10 gpma and 0.02 g of 2-mi and 0.02 g of 2-pi, stirred ...

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PUM

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Abstract

The invention relates to a resin composition and a preparation method and application thereof. The resin composition comprises 30-60% of epoxy resin, 30-60% of other resin, 15-30% of a curing agent and the balance of a solvent, wherein the epoxy resin is selected from bifunctional epoxy resin shown in a general formula (1) or polyfunctional epoxy resin shown in a general formula (2), and one or more of DOPO modified epoxy resin, isocyanate modified epoxy resin, DCPD phenol epoxy resin, p-aminophenol epoxy resin, diaminodiphenylmethane epoxy resin and TGIC triglycidyl cyanurate of the bifunctional epoxy resin and the polyfunctional epoxy resin; and the other resin is selected from one or more of benzoxazine resin and cyanate ester resin. The resin composition belongs to an epoxy resin curing system, N, N-dimethylformamide does not need to be used as a solvent to participate in dissolution in the system, and the environment-friendly requirement of strictly controlling the use of N, N-dimethylformamide at present is met.

Description

Technical field[0001]The present invention relates to a method of preparation of a resin composition, and is specifically related to the preparation method and application of a resin combination that can be used as a solidified collapse.Background technique[0002]Studies have shown that many heavy metals and chemicals contained in electronic electrical products have an adverse effect on humans. In recent years, some sanitation organizations have advocated control of harmful chemical solvents and chemical raw materials in electronic and electrical products, thereby improving human modern living environment.[0003]The copper-copper laminate is a plate-like material that is immersed in the electron fiberglass or other reinforcing material to a resin, one or double-sided to copper foil and thermally press it. A variety of different forms, printed circuit boards for different functions. The aforementioned resin is often contained in N, N-dimethylformamide as a solvent.[0004]The current coa...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08L63/02C08L63/04C08L79/04B32B17/04B32B17/12B32B15/20B32B15/14
CPCC08L63/00C08L79/04B32B5/02B32B5/26B32B15/20B32B15/14B32B2260/023B32B2260/046B32B2262/101C08L2205/035C08L2205/025
Inventor 张久久陈儒周国荣
Owner KINGBOARD JIANGSU CHEM
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