High-heat-conductivity heat-conducting silicone grease and preparation process thereof

A thermal grease, high thermal conductivity technology, applied in heat exchange materials, chemical instruments and methods, etc., can solve the problems of inability to meet market demands, complex oxidation processes, and high production costs, and achieve strong practical value, simple process, and high price. low effect

Pending Publication Date: 2021-04-09
广东鼎泰新材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although its thermal conductivity is 5.5-6.9W / m K, this solution requires a more complicated oxidation process, which leads to higher production costs and higher prices for this technical solution, which cannot meet market demand

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0047] A high thermal conductivity thermal conductive silicone grease of the present invention is composed of the following components in parts by mass:

[0048] 80 parts of powder; 5 parts of silicone oil; 1 part of coupling agent;

[0049] The powder is a mixture of zinc oxide and metal aluminum powder directly without forming an oxide film on the surface of the powder. The mass ratio of each component in the powder is:

[0050] Metal aluminum powder: 90%; Zinc oxide: 10%;

[0051] The particle size of the metal aluminum powder is 1-20 microns, and the particle size of the zinc oxide is 0.1-5 microns. Metal aluminum powder is composed of metal aluminum powder with different particle sizes.

[0052] Silicone oil is vinyl silicone oil. The viscosity of silicone oil is 100-3000cps.

[0053] The coupling agent is octyltrimethoxysiloxane and phenylsiloxane.

[0054] The preparation method of the thermally conductive silicone grease with high thermal conductivity comprises th...

Embodiment 2

[0063] Referring to Example 1, the difference from Example 1 is that the high thermal conductivity thermal conductive silicone grease of this example is composed of the following components by mass: 90 parts of powder; 10 parts of silicone oil; 2 parts of coupling agent; powder The mass ratio of each component in the body is: metal aluminum powder: 95%; zinc oxide: 5%.

Embodiment 3

[0065] Referring to Example 1, the difference from Example 1 is that the high thermal conductivity thermal conductive silicone grease of this example is composed of the following components by mass: 95 parts of powder; 15 parts of silicone oil; 3 parts of coupling agent; powder The mass ratio of each component in the body is: metal aluminum powder: 96%; zinc oxide: 4%.

[0066] The thermal conductive silicone grease prepared in Example 1-3 has a thermal conductivity of 6.0-6.5W / m·K or more, and a thermal resistance of 0.05-0.07°C·cm 2 / W@40psi, BLT (thermal interface material thickness) is 0.02-0.04mm@40psi, breakdown strength is 700-780V / mm.

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PUM

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Abstract

The invention discloses high-heat-conductivity heat-conductive silicone grease and a preparation method thereof. The heat-conductive silicone grease is prepared from the following components in parts by mass: 80-99 parts of powder; 1-20 parts of silicone oil; 0.01-5 parts of a coupling agent; wherein the powder is a mixture of zinc oxide and metal aluminum powder which are directly mixed, an oxide film does not need to be formed on the surface of the powder, and the mass ratio of the components in the powder is as follows: 80%-99% of the metal aluminum powder; 1%-20% of zinc oxide; the particle size of the metal aluminum powder is 1-30 micrometers, and the particle size of the zinc oxide is 0.1-5 micrometer. The heat conduction coefficient of the heat conduction silicone grease is 6.0-6.5 W/m.K, the process is simpler, the price is low, and the market requirements can be met.

Description

technical field [0001] The invention relates to the technical field of heat-conducting interface materials used in high-power electronic and electrical equipment, more specifically, it relates to a high heat-conducting heat-conducting silicone grease and a preparation process thereof. Background technique [0002] With the rapid development of the communication industry, the power consumption of chips is getting higher and higher, and the heat flux density is getting higher and higher. If the heat of the chip cannot be dissipated quickly, it will cause the chip to overheat, thereby affecting the life of the chip. [0003] For the heat dissipation of communication product chips, the commonly used heat dissipation design is to install spring screw heat sinks, heat pipes or VC heat sinks on the heat source. However, there is inevitably a certain gap between the chip and the heat sink, and the existence of the gap will lead to an increase in contact thermal resistance, which wi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09K5/14
CPCC09K5/14
Inventor 黄华利
Owner 广东鼎泰新材料科技有限公司
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