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High speed analog-to-digital converter organic substrate for integrated circuit packaging

An analog-to-digital converter, integrated circuit technology, applied in circuits, electrical solid devices, electrical components, etc., can solve the problems of high-speed signal transmission attenuation, serious, large dielectric loss, etc., to achieve low signal attenuation, performance improvement, insertion Low loss effect

Pending Publication Date: 2021-04-20
GUIZHOU ZHENHUA FENGGUANG SEMICON
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AI Technical Summary

Problems solved by technology

[0004] The main purpose of the present invention is to solve the problems of large dielectric loss and serious attenuation of high-speed signal transmission in the existing substrate technology

Method used

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  • High speed analog-to-digital converter organic substrate for integrated circuit packaging
  • High speed analog-to-digital converter organic substrate for integrated circuit packaging
  • High speed analog-to-digital converter organic substrate for integrated circuit packaging

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specific Embodiment approach

[0026] Taking a flip-chip ball grid array package (FCBGA) substrate suitable for high-speed time-division multi-interleaved analog-to-digital converters as an example, in order to overcome the problems of large dielectric loss and serious signal attenuation of existing high-speed ADC substrates, combined with the accompanying drawings, The specific implementation is as follows:

[0027] like figure 1 and figure 2 As shown, the dielectric material of an ultra-fast ADC substrate is GL103 resin material, which has excellent dielectric constant and loss factor, and the insertion loss is reduced to -5.3dB at @28GHz; the copper wiring roughness is reduced Advanced metal film vacuum deposition and photolithography process reduce the insertion loss to -4.2dB at @28GHz. Design the structure of the substrate stack and the thickness of each layer, such as image 3 As shown, the first layer is bump pads and planes, with a thickness of 21 μm; the second layer is signal traces, with a ...

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Abstract

A high-speed analog-to-digital converter organic substrate for integrated circuit packaging comprises a green oil layer, a signal layer, a reference plane layer, a core plate layer and a dielectric layer, a strip line is adopted as a high-speed signal transmission line in a high-speed signal transmission layer, the distance between the high-speed signal line and other signal lines is one or more times of the width of the high-speed signal line, and ground via holes sharing the same network with the reference plane are formed in the periphery of the high-speed signal line; and a ball grid array pin is arranged in a top surface integrated circuit chip assembling area of the substrate, each pair of high-speed differential signals is shielded by a power supply / ground or static signals, and hollowing processing is carried out right above the high-speed differential signal pins. The problems of large dielectric loss and serious attenuation of high-speed signal transmission in the existing substrate technology are solved. A flip chip ball grid array is adopted for packaging, and the organic substrate has the advantages of being high in integration, low in signal attenuation, low in signal return loss, small in crosstalk and the like, and is widely applied to the field of packaging of high-speed integrated circuit chips with the frequency ranging from 20 GHz to 40 GHz.

Description

technical field [0001] The present invention relates to the field of semiconductor chip packaging, and more specifically, to high-speed semiconductor chip packaging substrate technology, specifically, to a high-speed analog-to-digital converter (ADC) organic substrate. Background technique [0002] In the field of semiconductor integrated circuit packaging, semiconductor chips are usually assembled on a substrate, bonded by inner wires, and then sealed in the casing, which can greatly improve the packaging density and packaging performance of the circuit. In general, the packaging substrate is essentially a high-density printed circuit board, and its processing technology is similar to that of printed circuit boards. According to the division of materials, it can be divided into organic substrates and ceramic substrates. Its processing process is composed of physical process and chemical process, and the required substrate is obtained through exposure, development, drilling...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/498
Inventor 尹灿吴潇巍李平
Owner GUIZHOU ZHENHUA FENGGUANG SEMICON
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