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Rod splicing glue and preparation method thereof, rod splicing glue film and preparation method and application thereof

A film and stick technology, used in adhesives, manufacturing tools, epoxy glue, etc., can solve problems such as jumpers, large waste, and impact on silicon wafer production capacity.

Active Publication Date: 2021-04-27
CHANGZHOU SHICHUANG ENERGY CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The current cutting process is to superimpose or splice multiple silicon blocks into a combined silicon block, then paste and fix the combined silicon block on the substrate, and then cut it into a very thin silicon wafer. There is no glue bonding in the gaps, so the cut silicon wafers are prone to thick slices in the gaps, resulting in a lot of leftover silicon blocks and a large waste, which seriously affects the production capacity of silicon wafers; and there is no glue blocking the diamond wires in the gaps, which is prone to disconnection and jumper phenomenon, which seriously reduces the production efficiency

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0053] The present embodiment provides a kind of stick glue, in parts by mass, comprising: 10 parts by mass of polyacrylate pressure-sensitive adhesive, 60 parts by mass of modified epoxy resin, 15 parts by mass of silicon dioxide powder, 5 parts by mass Parts by mass of dicyandiamide curing agent, 0.5 parts by mass of 1-cyanoethyl-2-ethyl-4-methylimidazole and 5 parts by mass of ethyl acetate.

[0054] The preparation method of above-mentioned spell stick glue, comprises the following steps:

[0055] (1) Preparation of polyacrylate pressure-sensitive adhesive:

[0056] Mix and stir 1.5mL acrylic acid, 15mL isooctyl acrylate, 10mL butyl acrylate, 8mL methyl methacrylate, 8mL vinyl acetate, 30mL toluene, 30mL xylene and 30mL ethyl acetate, and add 1.0mL BPO initiator dropwise, Stir at 80°C for 30 minutes to obtain the mixture I;

[0057] Mix 0.5 mL of acrylic acid, 5 mL of isooctyl acrylate, 5 mL of butyl acrylate, 2 mL of methyl methacrylate and 2 mL of vinyl acetate to obta...

Embodiment 2

[0067] This embodiment provides a kind of stick glue, which includes: 5 parts by mass of polyacrylate pressure-sensitive adhesive, 50 parts by mass of modified epoxy resin, 30 parts by mass of silicon dioxide powder, 2.5 parts by mass Parts by mass of dicyandiamide curing agent, 1 part by mass of 1-cyanoethyl-2-ethyl-4-methylimidazole and 10 parts by mass of ethyl acetate.

[0068] The preparation method of above-mentioned spell stick glue, comprises the following steps:

[0069] (1) Preparation of polyacrylate pressure-sensitive adhesive:

[0070] Mix and stir 1.5mL acrylic acid, 15mL isooctyl acrylate, 10mL butyl acrylate, 8mL methyl methacrylate, 8mL vinyl acetate, 30mL toluene, 30mL xylene and 30mL ethyl acetate, and add 1.0mL BPO initiator dropwise, Stir at 80°C for 30 minutes to obtain the mixture I;

[0071] Mix 0.5 mL of acrylic acid, 5 mL of isooctyl acrylate, 5 mL of butyl acrylate, 2 mL of methyl methacrylate and 2 mL of vinyl acetate to obtain a mixture II;

[0...

Embodiment 3

[0081] A stick glue film, comprising a glue layer made of the stick glue in Example 1 and release layers respectively pasted on both sides of the glue layer.

[0082] The preparation method of above-mentioned spell stick adhesive film, comprises the following steps:

[0083] On one side of the release layer with a thickness of 20um, coat a layer of adhesive layer with the above-mentioned stick glue, the thickness of the adhesive layer is 20um; then coat the surface of the adhesive layer with a release layer with a thickness of 20um, and dry it at 100°C After 3 minutes, the solvent of the adhesive layer volatilizes to form a film, and a sticky film is obtained.

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PUM

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Abstract

The invention discloses a rod splicing glue, a preparation method thereof, a rod splicing glue film, a preparation method thereof and application. The rod splicing glue comprises, by mass, 5-10 parts by mass of acrylate pressure-sensitive adhesive; 50-60 parts by mass of modified epoxy resin; 15-30 parts by mass of a high-hardness filler; 2.5-5 parts by mass of a dicyandiamide curing agent; 0.5-1 part by mass of an imidazole catalyst; and 5-10 parts by mass of a solvent. As a novel glue for special purposes, the rod splicing glue disclosed by the invention has certain viscosity at normal temperature, has no viscosity after being cured at high temperature, and is high in hardness and relatively strong in tear resistance. According to the rod splicing glue film, the silicon blocks are spliced into the combined silicon block, the combined silicon block is cut after being heated and cured, thick pieces are prevented from being generated at the splicing position during cutting, and the silicon wafer output rate is increased; and moreover, the problems of wire jumping and wire breaking of the cutting wire at the splicing position are avoided, and the working efficiency is improved. The preparation process of the rod splicing glue and the rod splicing glue film is simple and easy to implement.

Description

technical field [0001] The invention relates to a stick glue and its preparation method, a stick glue film, its preparation method and application, in particular to a stick glue for splicing silicon blocks, its preparation method, the stick glue film, its preparation method and its application. Background technique [0002] In the production process of solar cells, silicon wafer cutting is particularly important as a pre-process. The current cutting process is to superimpose or splice multiple silicon blocks into a combined silicon block, then paste and fix the combined silicon block on the substrate, and then cut it into a very thin silicon wafer. There is no glue bonding in the gaps, so the cut silicon wafers are prone to thick slices in the gaps, resulting in a lot of leftover silicon blocks and a large waste, which seriously affects the production capacity of silicon wafers; and there is no glue blocking the diamond wires in the gaps, which is prone to disconnection And...

Claims

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Application Information

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IPC IPC(8): C09J163/00C09J133/08C09J175/08C09J11/04C09J7/38C09J7/10B28D5/00
CPCC09J163/00C09J11/04C09J7/38C09J7/10B28D5/0058C08L2205/03C08L33/08C08L75/08C08K3/36Y02P70/50
Inventor 邓舜吴凯
Owner CHANGZHOU SHICHUANG ENERGY CO LTD
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