Silicon wafer cutting machine
A cutting machine, silicon wafer technology, applied in conveyor objects, laser welding equipment, transportation and packaging, etc., can solve problems such as low work efficiency, shutdown operation, etc., to improve the cutting effect, ensure the fineness, and improve the processing effect. Effect
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[0023]Next, the technical solutions in the embodiments of the present invention will be apparent from the embodiment of the present invention, and it is clearly described, and it is understood that the described embodiments are merely embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, there are all other embodiments obtained without making creative labor without making creative labor premises.
[0024]SeeFigure 1-6The present invention provides a technical solution: a silicon cutting machine, including a body 1, a motion module 2, a cutting module 3, a fiber laser optical path integration 4, a laser cutting head 5, a first material box 6, a top rising Block 7, top rumor 8, material cassette block 9, cassette baking 10, pair of column 11, support frame 12, blown blast block 13, motor frame 14, second case 15, finished box sheet metal 16 , The table body 17, the upper plate 18, the slider block 19, the hot crank tube 20, t...
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