Silicon wafer cutting machine

Abstract

The invention discloses a silicon wafer cutting machine which comprises a machine body and first material boxes, the upper end of the machine body is connected with a moving module, the upper end of the interior of the machine body is provided with a cutting module, the front end of the cutting module is movably connected with a laser cutting head, and the upper end of the laser cutting head is embedded with a fiber laser light path integration; and the first material boxes are arranged at the left end and the right end in the machine body, the lower ends of the first material boxes are connected with jacking lower blocks, jacking upper blocks are fixed to the upper ends of the first material boxes, and material box cushion blocks are arranged on the upper sides of the first material boxes. The silicon wafer cutting machine is provided with the laser cutting head, the laser cutting head is in sliding connection with the cutting module, the laser cutting head can slide left and right along the surface of the cutting module, adjustment within a certain range is achieved, different parts of a silicon wafer can be cut conveniently, the silicon wafer cutting fineness is guaranteed, and the cutting effect is improved; and meanwhile, the slidable laser cutting head can be switched back and forth between two machining tables for machining, and the machining effect is improved.

Description

technical field [0001] The invention relates to the technical field of silicon wafer processing, in particular to a silicon wafer cutting machine. Background technique [0002] The silicon element with a content of 25.8% in the earth's crust provides an inexhaustible source for the production of monocrystalline silicon. Since silicon is one of the most abundant elements in the earth's crust, for products destined to enter the large-scale market such as solar cells, the advantage of reserves is also one of the reasons why silicon has become the main material for photovoltaics. , has been able to integrate 160,000 transistors, and thinner cutting lines mean lower kerf loss, which means that the same silicon block can produce more silicon wafers. [0003] The silicon wafer cutting machines on the market cannot perform multi-station cutting operations, and the work efficiency is low, especially for the need to stop operation when loading and unloading. Therefore, we propose a s...

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Problems solved by technology

[0004] The purpose of the present invention is to provide a silicon wafer cutting machine to solve the problem that the silicon wafer cutting machine on the market proposed in the above background technology cannot perform multi-station cutting operations, and the work efficiency is low, especially for the needs of loading and unloading work. Problems with downtime operations

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